39,37
±0,13
1,550
±0,005
RECOMMENDED PANEL CUTOUT
EMPFOHLENER FRONTPLATTEN-AUSSCHNITT
46,31 1,823
RECOMMENDED PCB LAYOUT (COMPONENT SIDE VIEW)
EMPFOHLENES LEITERPLATTEN-LAYOUT (BESTUECKUNGSSEITE)
TOL. 0.05 [0.002] UNLESS NOTED
38,10 1,500
26,97 1,062
26,66[1,050]
2,54 0,100
26,16 1,030
35
0 ,0
,0
±0
03
8
X4
0,38
±0,10
0,015
±0,004
TOP OF PCB
LP
12,69[0,500]
10,16 0,400
1
8
8
8
1
3,25
±0
1,60
±0
,0
7
,07
9
0 ,8
,0
±0
7
1
8
8
1
1
8
17,19 0,677
15,46 0,609
9,15 0,360
1
45,22 1,780
1,100 )
2 X 13.97 = (27,94
28,50 1,122 MAX
5,85 0,230
25,50 1,004 MAX
8
1
8
1
8
1
4,57 0,180
0,063
±
0,003
X8
3,20
±0,30
0,126
±0,012
2,13 0,084
2,79 0,110
39,37 1,550
2,13 0,084
2,79 0,110
IMPROVED CONTACT DESIGN
(PRE BEND)
1
8
1
8
1
8
NOTE 1: GROUNDING PIN BETWEEN EVERY PORT (T)
NOTE 2: 3 SIDE GROUNDBS EACH SIDE, STAGGERED (S1)
TA
NOTE 3: RoHS COMPLIANT
PART NO.
IDENT. NR.
TRANSMISSION REQUIREMENT
ÜBERTRAGUNGSANFORDERUNG
CATEGORY 5
CATEGORY 5E
Tolerances
All Dimensions
in mm[in]
1:1
ISOLATIONS BODY
PA66
PBT 30%GF
Scale
T e chnical sp e cif icat io ns
T e st D ata
Mate ri al s & F i n i sh
Stan d ard ap p l i c . Val u e
Stan d ard ap p l i c . Val u e
Insulation body
Standard description see chart
Me c h ani c al p ro p e rti e s
Co ntact mate ri al
Standard de scriptio n C5210 (acc. JIS)
Inse rti o n/withdrawal fo rce IEC 603-7
max. 20 N
Contact finish, mating zone
Thickness of plating 30 µin Au over 50 µin Ni
Mechanical operations
IEC 512-5, 9a
min. 1.000
Contact finish termination zone Thickness of plating 80 µin matte Sn over 50 µin Ni
Effectiveness of connector
Standard de scriptio n C2680 (acc. JIS)
She ll/shi e ld mate ri al
co upli ng de vice IEC 512-8, 15f
50 N
Shell/shield plating
Thickness of plating 50 µin Ni
El e c tri c al p ro p e rti e s
Cre e p ag e / c l e aran c e d i stan c e s
A sse mb l y p ro c e ss
a) Contact - contact
IEC 807-3
0,52 mm
P ackagi ng
T ray
b) Co ntact - she ll
IEC 807-3
min. 1, 0 mm
So lde r te mpe rature
235°C at 3-5s
Vo l tag e p ro o f (Di e l e c tri c Wi thstan d Vo l tag e )
Suitable asse mbly pro ce ss
IEC 512-2, 4a
mi n. 1. 000 V AC/ DC
wave
a) Co ntact - co ntact
b) Contact - shell/testpanel IEC 512-2, 4a
min. 1.500 V AC/DC
Current carrying capacity
IEC 512-3, 5b
1,5 A @ 25° C
A p p ro v al s
V0
UL i nsulatio n bo dy
UL 94
Co ntact re sistance
IEC 512-2, 2a
max. 30 mOhm
IEC 512-2, 3a
UL Fi le N o .
E145613
Insulati o n re sistance
mi n. 500 MOhm
Ro HS co mpli ant
En v i ro n me n tal p ro p e rti e s
Yes
0 - 70° C
Ope rati o n te mpe rature
133053
133673
Copyright by ERNI GmbH
Proprietary notice pursuant to ISO 16016 to be observed.
Information:
2:1
Designation
All rights reserved.
Only for Information.
To insure that this is the latest
version of this drawing, please
contact one of the ERNI companies
before using.
B
Index
25.07.2007
Date
Class
Subject to modification without
prior notice.
Drawing will not be updated.
MOD - JACK - MJD
8P8C, 2X3
www.ERNI.com
133926
MJ
8,89 0,350
X2
I (1/1)
A3
11,40 0,449
0,003
2,54 0,100
0,128
±
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