1% Thick Film Chip Resistors
(RoHS Compliant)
CR1-RC Series
FEATURES
• Temperature Range: -55°C ~ +125°C
• High purity alumina substrate
• Wave or flow solderable
• Excellent high frequency characteristics
• Wrap around termination
• Inner electrode protection
DERATING CURVE
Rated Load (%)
REEL DIMENSIONS (mm)
13±.50
50
min. 178±2
Ambient Temperature (°C)
10±1
TAPING DIMENSIONS (mm)
øD
E
F W
Rated Load (%)
B
13±.50
A
C
G
T
L
F ± 0.05
3.5
G ± 0.1
4.0
W ± 0.2
8.0
T ± 0.1
0.81
50
min. 178±2
C
T
A ± 0.2
2.00
B ± 0.2
3.60
C ± 0.05
2.0
øD ± 0.1
W
1.5
E ± 0.1
1.75
Ambient Temperature (°C)
10±1
D
PART NUMBERING SYSTEM
2
9
Series
0
1
0
Value
K
-
R
C
Suffix (RoHS Compliant)
SERIES, SIZE, WATTAGE, VOLTAGE, AND DIMENSIONS
L
W
D
C
T
Series
304
302
292
290
Case Size
0402
0603
0805
1206
Watts
(W)
1/16
1/10
1/8
1/4
Voltage (V) (max.)
W.V.
O.V.
25
50
50
150
200
100
300
400
L
1.0 ± .10
1.6 ± .10
2.0 ± .15
3.1 ± .15
.80 ± .15
1.25 ± .15
1.55 ± .15
Dimensions (mm)
W
C
D
.50 ± .05
.20 ± .10
.25 ± .10
.30 ± .20
.40 ± .20
.45 ± .20
.30 ± .20
.40 ± .20
.45 ± .20
T
.35 ± .05
.45± .10
.55± .10
.55 ± .10
XICON PASSIVE COMPONENTS • (800) 628-0544
XC-600037
Date Revised: 09/06/19
Specifications are subject to change without notice. No liability or warranty implied by this information. Environmental compliance based on producer documentation.
1% Thick Film Chip Resistors
(RoHS Compliant)
CR1-RC Series
STANDARD STOCKED VALUES (Ω)
10
10.2
10.5
10.7
11
11.3
11.5
11.8
12.1
12.4
12.7
13
13.3
13.7
14
14.3
14.7
15
15.4
15.8
16.2
16.5
16.9
17.4
17.8
18.2
18.7
19.1
19.6
20
20.5
21
21.5
22.1
22.6
23.2
23.7
24.3
24.9
25.5
26.1
26.7
27.4
28
28.7
29.4
30.1
30.9
31.6
48.7
49.9
51.1
52.3
53.6
54.9
56.2
57.6
59
60.4
61.9
63.4
64.9
66.5
68.1
69.8
71.5
73.2
75
76.8
78.7
80.6
82.5
84.5
86.6
88.7
90.9
93.1
95.3
97.6
100
102
105
107
110
113
115
118
121
124
127
130
133
137
140
143
147
150
154
158
162
165
169
174
178
182
187
191
196
200
205
210
215
221
226
232
237
243
249
255
261
267
274
280
287
294
300
301
309
316
324
332
340
348
357
365
374
383
392
402
412
422
432
665 1.13K 1.91K 3.16K 5.36K 9.09K 15.4K 26.1K
681 1.15K 1.96K 3.24K 5.49K 9.31K 15.8K 26.7K
32.4
33.2
34
34.8
35.7
36.5
37.4
38.3
39.2
40.2
41.2
42.2
43.2
44.2
45.3
46.4
47.5
442 750 1.27K 2.15K 3.57K
453 768 1.3K 2.21K 3.65K
464 787 1.33K 2.26K 3.74K
475 806 1.37K 2.32K 3.83K
487 825 1.40K 2.37K 3.92K
499 845 1.43K 2.43K 4.02K
511 866 1.47K 2.49K 4.12K
523 887 1.5K 2.55K 4.22K
536 909 1.54K 2.61K 4.32K
549 931 1.58K 2.67K 4.42K
562 953 1.62K 2.74K 4.53K
576 976 1.65K 2.8K 4.64K
590 1.0K 1.69K 2.87K 4.75K
604 1.02K 1.74K 2.94K 4.87K
619 1.05K 1.78K 3.0K 4.99K
634 1.07K 1.82K 3.01K 5.11K
649 1.1K 1.87K 3.09K 5.23K
698 1.18K 2.0K 3.32K 5.62K 9.53K 16.2K 27.4K
715 1.21K 2.05K 3.4K 5.76K 9.76K 16.5K 28K
732 1.24K 2.1K 3.48K 5.9K 10K 16.9K 28.7K
6.04K
6.19K
6.34K
6.49K
6.65K
6.81K
6.98K
7.15K
7.32K
7.5K
7.68K
7.87K
8.06K
8.25K
8.45K
8.66K
8.87K
10.2K
10.5K
10.7K
11.K
11.3K
11.5K
11.8K
12.1K
12.4K
12.7K
13K
13.3K
13.7K
14.K
14.3K
14.7K
15K
17.4K 29.4K
17.8K 30K
18.2K 30.1K
18.7K
19.1K
19.6K
20K
20.5K
21.K
21.5K
22.1K
22.6K
23.2K
23.7K
24.3K
24.9K
25.5K
NOTE: RoHS Compliant by Exemption
CONSTRUCTION
No.
1
2
3
4
5
6
Part Name
Protective coating: Epoxy
Al
2
O
3
high purity alumina substrate: Al 96fi
Resistive element: metal film
Termination (Inner): Ag/Pd
Termination (Between): Ni plating film
Termination (Outer): Sn plating film
1
1M
4
CHARACTERISTICS
Characteristics
Limits
2
3
4
5
Test Methods
( JIS C 5201-1 )
5.2 Natural resistance change per temp.
degree centigrade.
R
2
-R
1
x10
6
(PPM/°C)
R
1
(t
2
-t
1
)
R
1
: Resistance value at room temperature (t
1
)
R
2
: Resistance value at room temp.plus 100°C (t
2
)
5.5 Permanent resistance change after the
application of a potential of 2.5 times RCWV
for 5 seconds.
5.6 Apply 500V DC between protective coating
and termination for 1 minute
5.7 Apply 500V AC between protective coating
and termination for 1 minute
6.1.4 Twist of Test Board:
Y/X=5/90mm for 10 seconds
Temperature
coefficient
1Ω ~ 10Ω ≤ ±400 PPM / °C
11Ω ~ 10MΩ ≤ ±200 PPM / °C
Short time
overload
Insulation
resistance
Dielectric
withstanding
voltage
Terminal bending
Resistance change rate is
± (2.0 % + 0.1Ω) Max.
1,000M Ω or more
No evidence of flashover
mechanical damage,arcing or
insulation break down.
±(1.0% +0.05Ω) Max.
XICON PASSIVE COMPONENTS • (800) 628-0544
XC-600037
Date Revised: 09/06/19
Specifications are subject to change without notice. No liability or warranty implied by this information. Environmental compliance based on producer documentation.
1% Thick Film Chip Resistors
(RoHS Compliant)
CR1-RC Series
CHARACTERISTICS
(Cont.)
Characteristics
Limits
Test Methods
( JIS C 5201-1 )
7.4 Resistance change after continuous
5 cycles for duty shown below:
Step
Temperature
1
-55°C ±3°C
2
Room temp.
3
+155°C ±2°C
4
Room temp.
7.9 Resistance change after 1,000 hours
(1.5 hours "on", 0.5 hour "off") at RCWV
in a humidity chamber controlled at
40°C ± 2°C and 90 to 95 % relative humidity
7.10 Permanent resistance change after 1,000 hours
operating at RCWV, with duty cycle of
( 1.5 hours "on", 0.5 hour "off" ) at 70°C ± 2°C ambient
Solder bath method
Pre-Heat: 100 ro 105°C, 30 ±5 sec.
Temperature: 265 ± 3°C, 5 +1/-0 sec
Reflow soldering method
Peak: 250 +5/-0°C
230°C or higher, 30 ±10Sec.
Solder iron method
Bit temperature: 350° ±10°C
Application time of soldering iron: 3 +1/-0 seconds
Solderability
95% Coverage min.
6.5 Test temperature of solder: 245° ±3°C
Dipping them solder: 2~3 seconds
Time
30 mins
10~15 mins
30 mins
10~15 mins
Temperature
cycling
± (1.0% + 0.05Ω) Max.
Load life in
humidity
Load life
Resistance change rate is
± (3.0% + 0.1Ω) Max.
Resistance change rate is
± (3.0% + 0.1Ω) Max.
Electrical characteristics shall be satisfied.
Without distinct deformation in
appearance.
Soldering Heat
XICON PASSIVE COMPONENTS • (800) 628-0544
XC-600037
Date Revised: 09/06/19
Specifications are subject to change without notice. No liability or warranty implied by this information. Environmental compliance based on producer documentation.
NXP MCU
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