DUAL 100K DIGITAL POTENTIOMETER, 2-WIRE SERIAL CONTROL INTERFACE, 256 POSITIONS, BGA16, BUMP, CSP-16
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Renesas(瑞萨电子) |
| 零件包装代码 | BGA |
| 包装说明 | BUMP, CSP-16 |
| 针数 | 16 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| Is Samacsys | N |
| 其他特性 | NONVOLATILE MEMORY |
| 控制接口 | 2-WIRE SERIAL |
| 转换器类型 | DIGITAL POTENTIOMETER |
| JESD-30 代码 | R-XBGA-B16 |
| 长度 | 4.535 mm |
| 功能数量 | 2 |
| 位置数 | 256 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | VFBGA |
| 封装等效代码 | BGA16,4X4,25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| 电阻定律 | LINEAR |
| 最大电阻容差 | 20% |
| 最大电阻器端电压 | 3 V |
| 最小电阻器端电压 | |
| 座面最大高度 | 0.71 mm |
| 标称供电电压 | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 标称温度系数 | 300 ppm/°C |
| 温度等级 | INDUSTRIAL |
| 端子形式 | BALL |
| 端子节距 | 0.65 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 标称总电阻 | 100000 Ω |
| 宽度 | 2.775 mm |
| Base Number Matches | 1 |
| X9269TB16I-2.7 | X9269TB16I | X9269TV24I | X9269TV24-2.7 | X9269TB16 | X9269TB16-2.7 | |
|---|---|---|---|---|---|---|
| 描述 | DUAL 100K DIGITAL POTENTIOMETER, 2-WIRE SERIAL CONTROL INTERFACE, 256 POSITIONS, BGA16, BUMP, CSP-16 | DUAL 100K DIGITAL POTENTIOMETER, 2-WIRE SERIAL CONTROL INTERFACE, 256 POSITIONS, BGA16, BUMP, CSP-16 | DUAL 100K DIGITAL POTENTIOMETER, 2-WIRE SERIAL CONTROL INTERFACE, 256 POSITIONS, PDSO24, PLASTIC, TSSOP-24 | DUAL 100K DIGITAL POTENTIOMETER, 2-WIRE SERIAL CONTROL INTERFACE, 256 POSITIONS, PDSO24, PLASTIC, TSSOP-24 | DUAL 100K DIGITAL POTENTIOMETER, 2-WIRE SERIAL CONTROL INTERFACE, 256 POSITIONS, BGA16, BUMP, CSP-16 | DUAL 100K DIGITAL POTENTIOMETER, 2-WIRE SERIAL CONTROL INTERFACE, 256 POSITIONS, BGA16, BUMP, CSP-16 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
| 零件包装代码 | BGA | BGA | TSSOP | TSSOP | BGA | BGA |
| 包装说明 | BUMP, CSP-16 | BUMP, CSP-16 | PLASTIC, TSSOP-24 | TSSOP, TSSOP24,.25 | BUMP, CSP-16 | BUMP, CSP-16 |
| 针数 | 16 | 16 | 24 | 24 | 16 | 16 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 其他特性 | NONVOLATILE MEMORY | NONVOLATILE MEMORY | NONVOLATILE MEMORY | NONVOLATILE MEMORY | NONVOLATILE MEMORY | NONVOLATILE MEMORY |
| 控制接口 | 2-WIRE SERIAL | 2-WIRE SERIAL | 2-WIRE SERIAL | 2-WIRE SERIAL | 2-WIRE SERIAL | 2-WIRE SERIAL |
| 转换器类型 | DIGITAL POTENTIOMETER | DIGITAL POTENTIOMETER | DIGITAL POTENTIOMETER | DIGITAL POTENTIOMETER | DIGITAL POTENTIOMETER | DIGITAL POTENTIOMETER |
| JESD-30 代码 | R-XBGA-B16 | R-XBGA-B16 | R-PDSO-G24 | R-PDSO-G24 | R-XBGA-B16 | R-XBGA-B16 |
| 长度 | 4.535 mm | 4.535 mm | 7.8 mm | 7.8 mm | 4.535 mm | 4.535 mm |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 |
| 位置数 | 256 | 256 | 256 | 256 | 256 | 256 |
| 端子数量 | 16 | 16 | 24 | 24 | 16 | 16 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | VFBGA | VFBGA | TSSOP | TSSOP | VFBGA | VFBGA |
| 封装等效代码 | BGA16,4X4,25 | BGA16,4X4,25 | TSSOP24,.25 | TSSOP24,.25 | BGA16,4X4,25 | BGA16,4X4,25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 电源 | 3/5 V | 5 V | 5 V | 3/5 V | 5 V | 3/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 电阻定律 | LINEAR | LINEAR | LINEAR | LINEAR | LINEAR | LINEAR |
| 最大电阻容差 | 20% | 20% | 20% | 20% | 20% | 20% |
| 最大电阻器端电压 | 3 V | 5 V | 5 V | 3 V | 5 V | 3 V |
| 座面最大高度 | 0.71 mm | 0.71 mm | 1.2 mm | 1.2 mm | 0.71 mm | 0.71 mm |
| 标称供电电压 | 3 V | 5 V | 5 V | 3 V | 5 V | 3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 标称温度系数 | 300 ppm/°C | 300 ppm/°C | 300 ppm/°C | 300 ppm/°C | 300 ppm/°C | 300 ppm/°C |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | BALL | BALL | GULL WING | GULL WING | BALL | BALL |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | BOTTOM | BOTTOM | DUAL | DUAL | BOTTOM | BOTTOM |
| 标称总电阻 | 100000 Ω | 100000 Ω | 100000 Ω | 100000 Ω | 100000 Ω | 100000 Ω |
| 宽度 | 2.775 mm | 2.775 mm | 4.4 mm | 4.4 mm | 2.775 mm | 2.775 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| Is Samacsys | N | N | N | N | - | - |
| JESD-609代码 | - | e0 | e0 | e0 | e0 | e0 |
| 端子面层 | - | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
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