PLL Based Clock Driver, 2305 Series, 4 True Output(s), 0 Inverted Output(s), CMOS, PDSO8, 0.150 INCH, LEAD FREE, SOIC-8
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | IDT (Integrated Device Technology) |
零件包装代码 | SOIC |
包装说明 | 0.150 INCH, LEAD FREE, SOIC-8 |
针数 | 8 |
Reach Compliance Code | compliant |
Is Samacsys | N |
系列 | 2305 |
输入调节 | STANDARD |
JESD-30 代码 | R-PDSO-G8 |
JESD-609代码 | e3 |
长度 | 4.9 mm |
逻辑集成电路类型 | PLL BASED CLOCK DRIVER |
最大I(ol) | 0.012 A |
湿度敏感等级 | 1 |
功能数量 | 1 |
反相输出次数 | |
端子数量 | 8 |
实输出次数 | 4 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP8,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
峰值回流温度(摄氏度) | 260 |
电源 | 3.3 V |
认证状态 | Not Qualified |
Same Edge Skew-Max(tskwd) | 0.25 ns |
座面最大高度 | 1.75 mm |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 3 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Matte Tin (Sn) - annealed |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 3.9 mm |
最小 fmax | 133 MHz |
Base Number Matches | 1 |
ICS2305MI-1LF | RNC65J1290BPBSL | RNC65J1290BPRE665 | RNC65J1290BRB1465 | ICS2305MI-1LFT | |
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描述 | PLL Based Clock Driver, 2305 Series, 4 True Output(s), 0 Inverted Output(s), CMOS, PDSO8, 0.150 INCH, LEAD FREE, SOIC-8 | RESISTOR, METAL FILM, 0.25 W, 0.1 %, 25 ppm, 129 ohm, THROUGH HOLE MOUNT, AXIAL LEADED | Fixed Resistor, Metal Film, 0.25W, 129ohm, 300V, 0.1% +/-Tol, 25ppm/Cel, Through Hole Mount, AXIAL LEADED | Fixed Resistor, Metal Film, 0.25W, 129ohm, 300V, 0.1% +/-Tol, 25ppm/Cel, Through Hole Mount, AXIAL LEADED | PLL Based Clock Driver, 2305 Series, 4 True Output(s), 0 Inverted Output(s), CMOS, PDSO8, 0.150 INCH, LEAD FREE, SOIC-8 |
是否Rohs认证 | 符合 | 不符合 | 不符合 | 不符合 | 符合 |
包装说明 | 0.150 INCH, LEAD FREE, SOIC-8 | Axial, | AXIAL LEADED | AXIAL LEADED | 0.150 INCH, LEAD FREE, SOIC-8 |
Reach Compliance Code | compliant | unknown | not_compliant | not_compliant | compliant |
JESD-609代码 | e3 | e0 | e0 | e0 | e3 |
端子数量 | 8 | 2 | 2 | 2 | 8 |
最高工作温度 | 85 °C | 175 °C | 175 °C | 175 °C | 85 °C |
最低工作温度 | -40 °C | -65 °C | -65 °C | -65 °C | -40 °C |
封装形式 | SMALL OUTLINE | Axial | Axial | Axial | SMALL OUTLINE |
表面贴装 | YES | NO | NO | NO | YES |
技术 | CMOS | METAL FILM | METAL FILM | METAL FILM | CMOS |
端子面层 | Matte Tin (Sn) - annealed | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) - annealed |
是否无铅 | 不含铅 | 含铅 | - | - | 不含铅 |
Objectid | - | 2043847738 | 949288858 | 949288862 | - |
Country Of Origin | - | USA | USA | USA | - |
ECCN代码 | - | EAR99 | EAR99 | EAR99 | EAR99 |
YTEOL | - | 6.8 | 6.8 | 6.8 | - |
其他特性 | - | PRECISION | PRECISION | PRECISION | - |
构造 | - | Tubular | Tubular | Tubular | - |
引线直径 | - | 0.64 mm | 0.64 mm | 0.64 mm | - |
安装特点 | - | THROUGH HOLE MOUNT | THROUGH HOLE MOUNT | THROUGH HOLE MOUNT | - |
封装直径 | - | 4.57 mm | 4.57 mm | 4.57 mm | - |
封装长度 | - | 14.27 mm | 14.27 mm | 14.27 mm | - |
包装方法 | - | BULK | TR, 7.5 INCH | BULK | - |
额定功率耗散 (P) | - | 0.25 W | 0.25 W | 0.25 W | - |
额定温度 | - | 125 °C | 125 °C | 125 °C | - |
参考标准 | - | MIL-PRF-55182 | MIL-PRF-55182 | MIL-PRF-55182 | - |
电阻 | - | 129 Ω | 129 Ω | 129 Ω | - |
电阻器类型 | - | FIXED RESISTOR | FIXED RESISTOR | FIXED RESISTOR | - |
温度系数 | - | 25 ppm/°C | 25 ppm/°C | 25 ppm/°C | - |
端子形状 | - | WIRE | WIRE | WIRE | - |
容差 | - | 0.1% | 0.1% | 0.1% | - |
工作电压 | - | 300 V | 300 V | 300 V | - |
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