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IS41C16256-50T

产品描述EDO DRAM, 256KX16, 50ns, CMOS, PDSO40, 0.400 INCH, TSOP2-44/40
产品类别存储    存储   
文件大小201KB,共19页
制造商Integrated Silicon Solution ( ISSI )
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IS41C16256-50T概述

EDO DRAM, 256KX16, 50ns, CMOS, PDSO40, 0.400 INCH, TSOP2-44/40

IS41C16256-50T规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Integrated Silicon Solution ( ISSI )
零件包装代码TSOP2
包装说明TSOP2, TSOP40/44,.46,32
针数44
Reach Compliance Codenot_compliant
ECCN代码EAR99
Is SamacsysN
访问模式FAST PAGE WITH EDO
最长访问时间50 ns
其他特性RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O 类型COMMON
JESD-30 代码R-PDSO-G40
JESD-609代码e0
长度18.41 mm
内存密度4194304 bit
内存集成电路类型EDO DRAM
内存宽度16
功能数量1
端口数量1
端子数量40
字数262144 words
字数代码256000
工作模式ASYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织256KX16
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码TSOP2
封装等效代码TSOP40/44,.46,32
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE
峰值回流温度(摄氏度)NOT SPECIFIED
电源5 V
认证状态Not Qualified
刷新周期512
座面最大高度1.2 mm
自我刷新NO
最大待机电流0.002 A
最大压摆率0.18 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn/Pb)
端子形式GULL WING
端子节距0.8 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度10.16 mm
Base Number Matches1

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IS41C16256
IS41LV16256
256K x 16 (4-MBIT) DYNAMIC RAM
WITH EDO PAGE MODE
FEATURES
Extended Data-Out (EDO) Page Mode access cycle
TTL compatible inputs and outputs
Refresh Interval: 512 cycles/8 ms
Refresh Mode :
RAS
-Only,
CAS
-before-
RAS
(CBR),
and Hidden
• JEDEC standard pinout
• Single power supply
5V
±
10% (IS41C16256)
3.3V
±
10% (IS41LV16256)
• Byte Write and Byte Read operation via two
CAS
• Industrail temperature available -40
°C
to 85°C
ISSI
May 1999
®
DESCRIPTION
The
ISSI
IS41C16256 and IS41LV16257 is a 262,144 x 16-
bit high-performance CMOS Dynamic Random Access
Memory. The IS41C16256 offers an accelerated cycle access
called EDO Page Mode. EDO Page Mode allows 512 random
accesses within a single row with access cycle time as short
as 10 ns per 16-bit word. The Byte Write control, of upper and
lower byte, makes the IS41C16256 ideal for use in 16-, 32-bit
wide data bus systems.
These features make the IS41C16256 and IS41LV1626 ide-
ally suited for high band-width graphics, digital signal process-
ing, high-performance computing systems, and peripheral
applications.
The IS41C16256 is packaged in a 40-pin 400-mil SOJ and
TSOP (Type II).
KEY TIMING PARAMETERS
Parameter
Max.
RAS
Access Time (t
RAC
)
Max.
CAS
Access Time (t
CAC
)
Max. Column Address Access Time (t
AA
)
Min. EDO Page Mode Cycle Time (t
PC
)
Min. Read/Write Cycle Time (t
RC
)
-25
(5V,SOJ)
25
8
12
10
45
-35
35
10
18
12
60
-50
50
14
25
20
90
-60
60
15
30
25
110
Unit
ns
ns
ns
ns
ns
PIN CONFIGURATIONS
40-Pin TSOP (Type II)
VCC
I/O0
I/O1
I/O2
I/O3
VCC
I/O4
I/O5
I/O6
I/O7
1
2
3
4
5
6
7
8
9
10
40
39
38
37
36
35
34
33
32
31
GND
I/O15
I/O14
I/O13
I/O12
GND
I/O11
I/O10
I/O9
I/O8
40-Pin SOJ
VCC
I/O0
I/O1
I/O2
I/O3
VCC
I/O4
I/O5
I/O6
I/O7
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
GND
I/O15
I/O14
I/O13
I/O12
GND
I/O11
I/O10
I/O9
I/O8
NC
LCAS
UCAS
OE
A8
A7
A6
A5
A4
GND
PIN DESCRIPTIONS
A0-A8
I/O0-15
Address Inputs
Data Inputs/Outputs
Write Enable
Output Enable
Row Address Strobe
Upper Column Address Strobe
Lower Column Address Strobe
Power
Ground
No Connection
NC
NC
WE
RAS
NC
A0
A1
A2
A3
VCC
11
12
13
14
15
16
17
18
19
20
30
29
28
27
26
25
24
23
22
21
NC
LCAS
UCAS
OE
A8
A7
A6
A5
A4
GND
NC
WE
RAS
NC
A0
A1
A2
A3
VCC
WE
OE
RAS
UCAS
LCAS
Vcc
GND
NC
ISSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any errors which
may appear in this publication. © Copyright 1998, Integrated Silicon Solution, Inc.
Integrated Silicon Solution, Inc. — 1-800-379-4774
DR001-1I
05/27/99
1

IS41C16256-50T相似产品对比

IS41C16256-50T IS41LV16256-50KI IS41C16256-50K IS41C16256-35TI IS41LV16256-50TI IS41C16256-35KI IS41LV16256-35KI IS41LV16256-35TI
描述 EDO DRAM, 256KX16, 50ns, CMOS, PDSO40, 0.400 INCH, TSOP2-44/40 EDO DRAM, 256KX16, 50ns, CMOS, PDSO40, 0.400 INCH, SOJ-40 EDO DRAM, 256KX16, 50ns, CMOS, PDSO40, 0.400 INCH, SOJ-40 EDO DRAM, 256KX16, 35ns, CMOS, PDSO40, 0.400 INCH, TSOP2-44/40 EDO DRAM, 256KX16, 50ns, CMOS, PDSO40, 0.400 INCH, TSOP2-40 EDO DRAM, 256KX16, 35ns, CMOS, PDSO40, 0.400 INCH, SOJ-40 EDO DRAM, 256KX16, 35ns, CMOS, PDSO40, 0.400 INCH, SOJ-40 EDO DRAM, 256KX16, 35ns, CMOS, PDSO40, 0.400 INCH, TSOP2-40
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合
零件包装代码 TSOP2 SOJ SOJ TSOP2 TSOP2 SOJ SOJ TSOP2
包装说明 TSOP2, TSOP40/44,.46,32 SOJ, SOJ, SOJ40,.44 TSOP2, TSOP40/44,.46,32 TSOP2, 0.400 INCH, SOJ-40 0.400 INCH, SOJ-40 0.400 INCH, TSOP2-40
针数 44 40 40 44 40 40 40 40
Reach Compliance Code not_compliant _compli not_compliant not_compliant not_compliant unknown unknown unknown
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
访问模式 FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO
最长访问时间 50 ns 50 ns 50 ns 35 ns 50 ns 35 ns 35 ns 35 ns
JESD-30 代码 R-PDSO-G40 R-PDSO-J40 R-PDSO-J40 R-PDSO-G40 R-PDSO-G40 R-PDSO-J40 R-PDSO-J40 R-PDSO-G40
JESD-609代码 e0 e0 e0 e0 e0 e0 e0 e0
长度 18.41 mm 26.035 mm 26.035 mm 18.41 mm 18.41 mm 26.035 mm 26.035 mm 18.41 mm
内存密度 4194304 bit 4194304 bi 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit
内存集成电路类型 EDO DRAM EDO DRAM EDO DRAM EDO DRAM EDO DRAM EDO DRAM EDO DRAM EDO DRAM
内存宽度 16 16 16 16 16 16 16 16
功能数量 1 1 1 1 1 1 1 1
端口数量 1 1 1 1 1 1 1 1
端子数量 40 40 40 40 40 40 40 40
字数 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words
字数代码 256000 256000 256000 256000 256000 256000 256000 256000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 85 °C 70 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 - -40 °C - -40 °C -40 °C -40 °C -40 °C -40 °C
组织 256KX16 256KX16 256KX16 256KX16 256KX16 256KX16 256KX16 256KX16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSOP2 SOJ SOJ TSOP2 TSOP2 SOJ SOJ TSOP2
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.2 mm 3.7592 mm 3.7592 mm 1.2 mm 1.2 mm 3.7592 mm 3.7592 mm 1.2 mm
最大供电电压 (Vsup) 5.5 V 3.6 V 5.5 V 5.5 V 3.6 V 5.5 V 3.6 V 3.6 V
最小供电电压 (Vsup) 4.5 V 3 V 4.5 V 4.5 V 3 V 4.5 V 3 V 3 V
标称供电电压 (Vsup) 5 V 3.3 V 5 V 5 V 3.3 V 5 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 GULL WING J BEND J BEND GULL WING GULL WING J BEND J BEND GULL WING
端子节距 0.8 mm 1.27 mm 1.27 mm 0.8 mm 0.8 mm 1.27 mm 1.27 mm 0.8 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm
厂商名称 Integrated Silicon Solution ( ISSI ) - Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI )
Base Number Matches 1 1 1 1 1 - - -

 
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