Agilent HCPL-314J
0.6 Amp Output Current
IGBT Gate Drive Optocoupler
Data Sheet
Description
The HCPL-314J family of devices
consists of an AlGaAs LED
optically coupled to an
integrated circuit with a power
output stage. These optocouplers
are ideally suited for driving
power IGBTs and MOSFETs used
in motor control inverter
applications. The high operating
voltage range of the output stage
provides the drive voltages
required by gate controlled
devices. The voltage and current
supplied by this optocoupler
makes it ideally suited for
directly driving small or medium
power IGBTs. For IGBTs with
higher ratings the HCPL-3150
(0.6 A) or HCPL-3120 (2.5 A)
optocouplers can be used.
Functional Diagram
N/C
ANODE
CATHODE
1
2
3
SHIELD
16
15
14
V
CC
V
O
V
EE
ANODE
CATHODE
N/C
6
7
8
SHIELD
11
10
9
V
CC
V
O
V
EE
HCPL-314J
Features
• 0.6 A maximum peak output
current
• 0.4 A minimum peak output
current
• High speed response: 0.7
µs
max.
propagation delay over temp.
range
• Ultra high CMR: min.
10 kV/µs at V
CM
= 1.5 kV
• Bootstrappable supply current:
max. 3 mA
• Wide operating temp. range: -40°C
to 100°C
• Wide V
CC
operating range: 10 V to
30 V over temp. range
• Available in DIP8 (Single) and
SO16 (Dual) package
• Safety Approvals: UL Recognized,
3750 V
rms
for 1 Minute. CSA
Approval. IEC/EN/DIN EN 60747-
5-2 Approval V
IORM
= 891 V
peak
Applications
• Isolated IGBT/Power MOSFET
Gate Drive
• AC and Brushless DC Motor Drides
• Inverters for appliances
• Industrial inverters
• Switch Mode Power Supplies
(SMPS)
• Uninterruptable Power Supplies
(UPS)
Truth Table
LED
OFF
ON
V
O
LOW
HIGH
A 0.1
µF
bypass capacitor must be connected between pins V
CC
and V
EE
.
CAUTION:
It is advised that normal static precautions be taken in handling and assembly of this
component to prevent damage and/or degradation which may be induced by ESD.
Selection Guide
Package Type
SO16
Part Number
HCPL-314J
Number of Channels
2
Ordering Information
Specify part number followed by option number (if desired)
Example:
HCPL-314J#YYYY
No option = SO16 Package.
500 = Tape and Reel Packaging Option.
XXXE = Lead Free Option
Remarks: The notation “#” is used for existing products, while (new) products launched since 15th July
2001 and lead free option will use “–”.
Package Outline Drawing
HCPL-314J SO16 Package:
LAND PATTERN RECOMMENDATION
TOP VIEW
16 15 14
GND
1
V
CC1
V
O1
11 10
V
CC2
V
O2
9
GND
2
8.76 ± 0.20
(0.345 ± 0.008)
V
IN1
HCPL-314J
7.49 ± 0.10
(0.295 ± 0.004)
11.63 (0.458)
V
IN2
NC
1
2
3
6
7
NC
V
1
V
2
8
2.16 (0.085)
0.64 (0.025)
0.10 - 0.30
(0.004 - 0.0118)
STANDOFF
VIEW
FROM
PIN 16
9°
0.64
(0.025 MIN.)
VIEW
FROM
PIN 1
3.51 ± 0.13
(0.138 ± 0.005)
10.36 ± 0.20
(0.408 ± 0.008)
0.23
(0.0091)
8.76 ± 0.20
(0.345 ± 0.008)
0 - 8°
1.27
0.457
(0.050)
(0.018)
0.016 ± 0.0003
(0.406 ± 0.007)
ALL LEADS TO BE COPLANAR ± 0.05 mm (0.002 INCHES) .
DIMENSIONS IN MILLIMETERS AND (INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
2
Solder Reflow Thermal Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
3°C + 1°C/–0.5°C
30
SEC.
30
SEC.
SOLDERING
TIME
200°C
Regulatory Information
The HCPL-314J has been
approved by the following
organizations:
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01.
UL
Approval under UL 1577,
component recognition program
up to V
ISO
= 3750 V
rms
. File
E55361.
CSA
Approved under CSA
Component Acceptance Notice
#5, File CA 88324.
TEMPERATURE (°C)
200
100
PREHEATING TIME
150°C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
50
100
150
200
250
TIME (SECONDS)
Recommended Pb-Free IR Profile
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
t
p
T
p
T
L
260 +0/-5 °C
217 °C
RAMP-UP
3 °C/SEC. MAX.
150 - 200 °C
TEMPERATURE
T
smax
T
smin
RAMP-DOWN
6 °C/SEC. MAX.
t
s
PREHEAT
60 to 180 SEC.
25
t 25 °C to PEAK
t
L
60 to 150 SEC.
TIME
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200 °C, T
smin
= 150 °C
3
IEC/EN/DIN EN 60747-5-2 Insulation Characteristics
Description
Installation classification per DIN VDE 0110/1.89, Table 1
for rated mains voltage
≤
150 V
rms
for rated mains voltage
≤
300 V
rms
for rated mains voltage
≤
600 V
rms
Climatic Classification
Pollution Degree (DIN VDE 0110/1.89)
Maximum Working Insulation Voltage
Input to Output Test Voltage, Method b*
V
IORM
x 1.875 = V
PR
, 100% Production Test with
t
m
= 1 sec, Partial discharge < 5 pC
Input to Output Test Voltage, Method a*
V
IORM
x 1.5 = V
PR
, Type and Sample Test, t
m
= 60 sec,
Partial discharge < 5 pC
Highest Allowable Overvoltage
(Transient Overvoltage t
ini
= 10 sec)
Safety-limiting values – maximum values allowed in the
event of a failure.
Case Temperature
Input Current**
Output Power**
Insulation Resistance at T
S
, V
IO
= 500 V
Symbol
Characteristic
I - IV
I - III
I-II
55/100/21
2
891
1670
Unit
V
IORM
V
PR
V
peak
V
peak
V
PR
V
IOTM
1336
6000
V
peak
V
peak
T
S
I
S,INPUT
P
S, OUTPUT
R
S
175
400
1200
>10
9
°C
mA
mW
Ω
*Refer to the optocoupler section of the Isolation and Control Components Designer’s Catalog, under Product Safety Regulations section, IEC/EN/DIN
EN 60747-5-2, for a detailed description of Method a and Method b partial discharge test profiles.
**Refer to the following figure for dependence of P
S
and I
S
on ambient temperature.
OUTPUT POWER – P
S
, INPUT CURRENT – I
S
800
700
600
500
400
300
200
100
0
0
25
50
75 100 125 150 175 200
P
S
(mW)
I
S
(mA)
T
S
– CASE TEMPERATURE – °C
4
Insulation and Safety Related Specifications
Parameter
Symbol
Minimum External Air Gap
L(101)
(Clearance)
Minimum External Tracking
L(102)
(Creepage)
Minimum Internal Plastic Gap
(Internal Clearance)
Tracking Resistance
(Comparative Tracking Index)
Isolation Group
CTI
HCPL-314J
8.3
8.3
0.5
Units
mm
mm
mm
>175
IIIa
V
Conditions
Measured from input terminals to output
terminals, shortest distance through air.
Measured from input terminals to output
terminals, shortest distance path along body.
Through insulation distance conductor to
conductor, usually the straight line distance
thickness between the emitter and detector.
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
Absolute Maximum Ratings
Parameter
Storage Temperature
Operating Temperature
Average Input Current
Peak Transient Input Current (<1
µs
pulse
width, 300 pps)
Reverse Input Voltage
“High” Peak Output Current
“Low” Peak Output Current
Supply Voltage
Output Voltage
Output Power Dissipation
Input Power Dissipation
Lead Solder Temperature
Solder Reflow Temperature Profile
Symbol
T
S
T
A
I
F(AVG)
I
F(TRAN)
Min.
-55
-40
Max.
125
100
25
1.0
Units
°C
°C
mA
A
V
A
A
V
V
mW
mW
Note
1
V
R
3
I
OH(PEAK)
0.6
I
OL(PEAK)
0.6
V
CC
- V
EE
-0.5
35
V
O(PEAK)
-0.5
V
CC
P
O
260
P
I
105
260°C for 10 sec., 1.6 mm below seating plane
See Package Outline Drawings section
2
2
3
4
Recommended Operating Conditions
Parameter
Symbol
Power Supply
V
CC
- V
EE
Input Current (ON)
I
F(ON)
Input Voltage (OFF)
V
F(OFF)
Operating Temperature
T
A
Min.
10
8
-3.0
-40
Max.
30
12
0.8
100
Units
V
mA
V
°C
Note
5
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