EEPROM, 32KX8, Serial, CMOS, PDSO8, LEAD AND HALOGEN FREE, EIAJ, SOIC-8
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Catalyst |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP8,.3 |
| 针数 | 8 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| Is Samacsys | N |
| 最大时钟频率 (fCLK) | 1 MHz |
| 数据保留时间-最小值 | 100 |
| 耐久性 | 100000 Write/Erase Cycles |
| I2C控制字节 | 1010DDDR |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e3 |
| 长度 | 5.3 mm |
| 内存密度 | 262144 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 32768 words |
| 字数代码 | 32000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 105 °C |
| 最低工作温度 | -40 °C |
| 组织 | 32KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP8,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.03 mm |
| 串行总线类型 | I2C |
| 最大待机电流 | 0.00001 A |
| 最大压摆率 | 0.004 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | MATTE TIN |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 5.25 mm |
| 最长写入周期时间 (tWC) | 5 ms |
| 写保护 | HARDWARE |
| Base Number Matches | 1 |
| CAT24FC256XA-TE13 | CAT24FC256KA-TE13 | CAT24FC256JI-TE13 | RNC50H2180BMB1431 | RNC50H2640DSRE631 | CAT24FC256KE-TE13 | CAT24FC256KI-TE13 | CAT24FC256JA-TE13 | CAT24FC256JE-TE13 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | EEPROM, 32KX8, Serial, CMOS, PDSO8, LEAD AND HALOGEN FREE, EIAJ, SOIC-8 | EEPROM, 32KX8, Serial, CMOS, PDSO8, EIAJ, SOIC-8 | EEPROM, 32KX8, Serial, CMOS, PDSO8, SOIC-8 | Fixed Resistor, Metal Film, 0.05W, 218ohm, 200V, 0.1% +/-Tol, 50ppm/Cel, Through Hole Mount, AXIAL LEADED | Fixed Resistor, Metal Film, 0.05W, 264ohm, 200V, 0.5% +/-Tol, 50ppm/Cel, Through Hole Mount, AXIAL LEADED | EEPROM, 32KX8, Serial, CMOS, PDSO8, EIAJ, SOIC-8 | EEPROM, 32KX8, Serial, CMOS, PDSO8, EIAJ, SOIC-8 | EEPROM, 32KX8, Serial, CMOS, PDSO8, SOIC-8 | EEPROM, 32KX8, Serial, CMOS, PDSO8, SOIC-8 |
| 是否Rohs认证 | 符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | SOP, SOP8,.3 | SOP, SOP8,.3 | SOP, SOP8,.25 | AXIAL LEADED | AXIAL LEADED | SOP, SOP8,.3 | SOP, SOP8,.3 | SOP, SOP8,.25 | SOP, SOP8,.25 |
| Reach Compliance Code | unknown | unknown | unknown | not_compliant | not_compliant | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| JESD-609代码 | e3 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 8 | 8 | 8 | 2 | 2 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 105 °C | 105 °C | 85 °C | 175 °C | 175 °C | 125 °C | 85 °C | 105 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -65 °C | -65 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | Axial | Axial | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 表面贴装 | YES | YES | YES | NO | NO | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | METAL FILM | METAL FILM | CMOS | CMOS | CMOS | CMOS |
| 端子面层 | MATTE TIN | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 厂商名称 | Catalyst | Catalyst | Catalyst | - | - | Catalyst | Catalyst | Catalyst | Catalyst |
| 零件包装代码 | SOIC | SOIC | SOIC | - | - | SOIC | SOIC | SOIC | SOIC |
| 针数 | 8 | 8 | 8 | - | - | 8 | 8 | 8 | 8 |
| 最大时钟频率 (fCLK) | 1 MHz | 1 MHz | 1 MHz | - | - | 1 MHz | 1 MHz | 1 MHz | 1 MHz |
| 数据保留时间-最小值 | 100 | 100 | 100 | - | - | 100 | 100 | 100 | 100 |
| 耐久性 | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | - | - | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
| I2C控制字节 | 1010DDDR | 1010DDDR | 1010DDDR | - | - | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | - | - | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| 长度 | 5.3 mm | 5.3 mm | 4.9 mm | - | - | 5.3 mm | 5.3 mm | 4.9 mm | 4.9 mm |
| 内存密度 | 262144 bit | 262144 bit | 262144 bit | - | - | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | - | - | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | - | - | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | - | - | 1 | 1 | 1 | 1 |
| 字数 | 32768 words | 32768 words | 32768 words | - | - | 32768 words | 32768 words | 32768 words | 32768 words |
| 字数代码 | 32000 | 32000 | 32000 | - | - | 32000 | 32000 | 32000 | 32000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 组织 | 32KX8 | 32KX8 | 32KX8 | - | - | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | SOP | - | - | SOP | SOP | SOP | SOP |
| 封装等效代码 | SOP8,.3 | SOP8,.3 | SOP8,.25 | - | - | SOP8,.3 | SOP8,.3 | SOP8,.25 | SOP8,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 并行/串行 | SERIAL | SERIAL | SERIAL | - | - | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度（摄氏度） | 260 | 240 | 240 | - | - | 240 | 240 | 240 | 240 |
| 电源 | 3/5 V | 3/5 V | 3/5 V | - | - | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.03 mm | 2.03 mm | 1.75 mm | - | - | 2.03 mm | 2.03 mm | 1.75 mm | 1.75 mm |
| 串行总线类型 | I2C | I2C | I2C | - | - | I2C | I2C | I2C | I2C |
| 最大待机电流 | 0.00001 A | 0.00001 A | 0.000001 A | - | - | 0.00001 A | 0.000001 A | 0.00001 A | 0.00001 A |
| 最大压摆率 | 0.004 mA | 0.004 mA | 0.004 mA | - | - | 0.004 mA | 0.004 mA | 0.004 mA | 0.004 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | - | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | - | - | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 标称供电电压 (Vsup) | 3 V | 3 V | 3 V | - | - | 3 V | 3 V | 3 V | 3 V |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | - | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE |
| 端子形式 | GULL WING | GULL WING | GULL WING | - | - | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | - | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | - | - | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | 30 | 30 | - | - | 30 | 30 | 30 | 30 |
| 宽度 | 5.25 mm | 5.25 mm | 3.9 mm | - | - | 5.25 mm | 5.25 mm | 3.9 mm | 3.9 mm |
| 最长写入周期时间 (tWC) | 5 ms | 5 ms | 5 ms | - | - | 5 ms | 5 ms | 5 ms | 5 ms |
| 写保护 | HARDWARE | HARDWARE | HARDWARE | - | - | HARDWARE | HARDWARE | HARDWARE | HARDWARE |
| Base Number Matches | 1 | 1 | 1 | - | - | 1 | 1 | - | - |
51单片机
嵌入式系统
stm32/stm8
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实时操作系统RTOS
微控制器 MCU
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