Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. These ratings are limiting values above which the serviceability of the diode may be impaired.
THERMAL CHARACTERISTICS
Parameter
Power Dissipation
Thermal Resistance, Junction−to−Ambient
Symbol
P
D
R
qJA
Max
500
300
Unit
mW
°C
ELECTRICAL CHARACTERISTICS
(Values are at T
A
= 25°C unless otherwise noted) (Note 2)
Symbol
V
R
Parameter
Breakdown Voltage
Conditions
I
R
= 100
mA
I
R
= 5.0
mA
V
F
Forward Voltage
914B / 4448
916B
914 / 916 / 4148
914A / 916A
916B
914B / 4448
I
R
Reverse Leakage
I
F
= 5.0 mA
I
F
= 5.0 mA
I
F
= 10 mA
I
F
= 20 mA
I
F
= 20 mA
I
F
= 100 mA
V
R
= 20 V
V
R
= 20 V, T
A
= 150°C
V
R
= 75 V
C
T
Total Capacitance
916/916A/916B/4448
914/914A/914B/4148
t
rr
Reverse Recovery Time
V
R
= 0, f = 1.0 MHz
V
R
= 0, f = 1.0 MHz
I
F
= 10 mA, V
R
= 6.0 V (600 mA)
I
rr
= 1.0 mA, R
L
= 100
W
Min
100
75
0.62
0.63
0.72
0.73
1.0
1.0
1.0
1.0
0.025
50
5.0
2.0
4.0
4.0
Max
Unit
V
V
V
V
V
V
V
V
mA
mA
mA
pF
pF
ns
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Non−recurrent square wave P
W
= 8.3 ms.
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2
1N91x, 1N4x48, FDLL914, FDLL4x48
TYPICAL PERFORMANCE CHARACTERISTICS
120
160
Ta=25 C
100
150
o
Ta= 25 C
Reverse Current, I
R
[nA]
o
Reverse Voltage, V
R
[V]
80
140
60
130
40
120
20
110
1
2
3
5
10
20
30
50
100
0
10
20
30
50
70
100
Reverse Current, I
R
[uA]
Reverse Voltage, V
R
[V]
GENERAL RULE: The Reverse Current of a diode will approximately
double for every ten (10) Degree C increase in Temperature
Figure 1. Reverse Voltage vs. Reverse Current
B
V
− 1.0 to 100
mA
Figure 2. Reverse Current vs. Reverse Voltage
I
R
− 10 to 100 V
550
750
Ta= 25 C
o
Ta= 25 C
700
o
Forward Voltage, V
R
[mV]
Forward Voltage, V
F
[mV]
500
450
650
400
600
350
550
300
500
250
450
1
2
3
5
10
20
30
50
100
0.1
0.2
0.3
0.5
1
2
3
5
10
Forward Current, I
F
[uA]
Forward Current, I
F
[mA]
Figure 3. Forward Voltage vs. Forward Current
V
F
− 1 to 100
mA
Figure 4. Forward Voltage vs. Forward Current
V
F
− 0.1 to 10 mA
1.6
900
Ta= 25 C
800
o
Typical
Ta= −40 C
o
Forward Voltage, V
F
[mV]
Forward Voltage, V
F
[mV]
1.4
700
1.2
600
Ta= 25 C
o
1.0
500
Ta= +65 C
o
0.8
400
300
0.6
10
20
30
50
100
200
300
500
800
0.01
0.03
0.1
0.3
1
3
10
Forward Current, I
F
[mA]
Forward Current, I
F
[mA]
Figure 5. Forward Voltage vs. Forward Current
V
F
− 10 to 800 mA
Figure 6. Forward Voltage vs. Ambient Temperature
V
F
- 0.01 - 20 mA (- 40 to +65°C)
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3
1N91x, 1N4x48, FDLL914, FDLL4x48
TYPICAL PERFORMANCE CHARACTERISTICS
0.90
4.0
Reverse Recovery Time, t
rr
[ns]
T
A
= 25 C
o
Ta = 25 C
3.5
o
Total Capacitance (pF)
0.85
3.0
2.5
0.80
2.0
1.5
0.75
0
2
4
6
8
10
12
14
1.0
10
20
30
40
50
60
REVERSE VOLTAGE (V)
Reverse Recovery Current, I
rr
[mA]
IF = 10mA , IRR = 1.0 mA , Rloop = 100 Ohms
Figure 7. Total Capacitance
Figure 8. Reverse Recovery Time vs.
Reverse Recovery Current
500
500
400
Power Dissipation, P
D
[mW]
400
DO−35 and LL−34 / SOD−80
300
Current (mA)
300
I
F(AV)
− Average Rectified Current − mA
200
200
100
100
0
0
50
100
150
0
0
50
100
150
o
200
Ambient Temperature (
o
C)
Temperature ( C)
Figure 9. Average Rectified Current (I
F(AV)
)
vs. Ambient Temperature (T
A
)
Figure 10. Power Derating Curve
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4
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
AXIAL LEAD
CASE 017AG
ISSUE O
DATE 31 AUG 2016
T50 = 25.40 MIN (2X)
T26 = 14.00 MIN (2X)
4.56
3.05
0.533
0.460
NOTES: UNLESS OTHERWISE SPECIFIED
A) PACKAGE STANDARD REFERENCE:
JEDEC DO−204, VARIATION AH.
B) HERMETICALLY SEALED GLASS PACKAGE.
C) PACKAGE WEIGHT IS 0.137 GRAM.
D) ALL DIMENSIONS ARE IN MILLIMETERS.
1.91
1.53
DOCUMENT NUMBER:
DESCRIPTION:
98AON13443G
AXIAL LEAD
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Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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