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MIG10J503L

产品描述Insulated Gate Bipolar Transistor, 10A I(C), 600V V(BR)CES
产品类别晶体管   
文件大小309KB,共14页
制造商Mitsubishi(日本三菱)
官网地址http://www.mitsubishielectric.com/semiconductors/
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MIG10J503L概述

Insulated Gate Bipolar Transistor, 10A I(C), 600V V(BR)CES

MIG10J503L规格参数

参数名称属性值
厂商名称Mitsubishi(日本三菱)
包装说明,
Reach Compliance Codeunknown
Is SamacsysN
最大集电极电流 (IC)10 A
集电极-发射极最大电压600 V
元件数量1
最高工作温度100 °C
VCEsat-Max2.1 V
Base Number Matches1

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MIG10J503L
MITSUBISHI SEMICONDUCTOR <Intelligent Power Module>
MIG10J503L
MIG10J503L is an intelligent power module for three-phase
inverter system. The 4th generation low saturation voltage
trench gate IGBT and FRD are connected to a three-phase full
bridge type, and IC by the original high-voltage SOI
(silicon-on-insulator) process drives these directly in response to a
PWM signal. Moreover, since high-voltage level-shifter is built in
high-voltage IC, while being able to perform a direct drive
without the interface with which the upper arm IGBT is
insulated, the drive power supply of an upper arm can be driven
with a bootstrap system, and the simplification of a system is
Weight: 18 g (typ.)
possible. Furthermore, each lower arm emitter terminal has been
independent so that detection can perform current detection at
the time of vector control by current detection resistance of a lower arm. The protection function builds in Under
Voltage Protection, Short Circuit Protection for a low arm IGBT, and Over Temperature Protection. Original high
thermal conduction resin is adopted as a package, and low heat resistance is realized.
Features
The 4th generation trench gate thin wafer NPT IGBT is adopted.
FRD is built in.
The level shift circuit by high-voltage IC is built in.
The simplification of a high side driver power supply is possible by the bootstrap system.
Short circuit protection for a low arm IGBT, over temperature protection, and the power supply under voltage
protection function are built in.
Short circuit protection for a low arm IGBT and over temperature protection state are outputted.
The lower arm emitter terminal has been independent by each phase for the purpose of the current detection at
the time of vector control.
Low thermal resistance by adoption of original high thermal conduction resin.
Since this product is MOS structure, it should be careful of static electricity in the case of handling.
2005-03-01 1/14
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