8-CHANNEL, SGL ENDED MULTIPLEXER, PDSO16, 0.150 INCH, 0.025 INCH PITCH, MO-137AB, QSOP-16
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Rochester Electronics |
零件包装代码 | SSOP |
包装说明 | 0.150 INCH, 0.025 INCH PITCH, MO-137AB, QSOP-16 |
针数 | 16 |
Reach Compliance Code | unknown |
Is Samacsys | N |
其他特性 | ALSO OPERATE WITH 3V TO 15V SINGLE SUPPLY |
模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER |
JESD-30 代码 | R-PDSO-G16 |
JESD-609代码 | e0 |
长度 | 4.89 mm |
湿度敏感等级 | 1 |
负电源电压最大值(Vsup) | -8 V |
负电源电压最小值(Vsup) | -3 V |
标称负供电电压 (Vsup) | -5 V |
信道数量 | 8 |
功能数量 | 1 |
端子数量 | 16 |
标称断态隔离度 | 75 dB |
通态电阻匹配规范 | 6 Ω |
最大通态电阻 (Ron) | 100 Ω |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SSOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, SHRINK PITCH |
峰值回流温度(摄氏度) | 245 |
座面最大高度 | 1.75 mm |
最大供电电压 (Vsup) | 8 V |
最小供电电压 (Vsup) | 3 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
最长断开时间 | 150 ns |
最长接通时间 | 150 ns |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | TIN LEAD |
端子形式 | GULL WING |
端子节距 | 0.635 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 3.9 mm |
Base Number Matches | 1 |
MAX398CEE | MAX398CSE | MAX398CPE | MAX398EGE | |
---|---|---|---|---|
描述 | 8-CHANNEL, SGL ENDED MULTIPLEXER, PDSO16, 0.150 INCH, 0.025 INCH PITCH, MO-137AB, QSOP-16 | 8-CHANNEL, SGL ENDED MULTIPLEXER, PDSO16, 0.150 INCH, MS-012AC, SOIC-16 | 8-CHANNEL, SGL ENDED MULTIPLEXER, PDIP16, PLASTIC, DIP-16 | 8-CHANNEL, SGL ENDED MULTIPLEXER, QCC16, 5 X 5 MM, 0.90 MM HEIGHT, MO-220, QFN-16 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
零件包装代码 | SSOP | SOIC | DIP | QFN |
包装说明 | 0.150 INCH, 0.025 INCH PITCH, MO-137AB, QSOP-16 | SOP, | PLASTIC, DIP-16 | 5 X 5 MM, 0.90 MM HEIGHT, MO-220, QFN-16 |
针数 | 16 | 16 | 16 | 16 |
Reach Compliance Code | unknown | unknown | unknown | unknow |
其他特性 | ALSO OPERATE WITH 3V TO 15V SINGLE SUPPLY | ALSO OPERATE WITH 3V TO 15V SINGLE SUPPLY | ALSO OPERATE WITH 3V TO 15V SINGLE SUPPLY | ALSO OPERATE WITH 3V TO 15V SINGLE SUPPLY |
模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T16 | S-XQCC-N16 |
JESD-609代码 | e0 | e0 | e0 | e0 |
长度 | 4.89 mm | 9.9 mm | 19.175 mm | 5 mm |
湿度敏感等级 | 1 | 1 | 1 | NOT APPLICABLE |
负电源电压最大值(Vsup) | -8 V | -8 V | -8 V | -8 V |
负电源电压最小值(Vsup) | -3 V | -3 V | -3 V | -3 V |
标称负供电电压 (Vsup) | -5 V | -5 V | -5 V | -5 V |
信道数量 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 16 | 16 | 16 | 16 |
标称断态隔离度 | 75 dB | 75 dB | 75 dB | 75 dB |
通态电阻匹配规范 | 6 Ω | 6 Ω | 6 Ω | 6 Ω |
最大通态电阻 (Ron) | 100 Ω | 100 Ω | 100 Ω | 100 Ω |
最高工作温度 | 70 °C | 70 °C | 70 °C | 85 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED |
封装代码 | SSOP | SOP | DIP | HVQCCN |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
封装形式 | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | IN-LINE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 245 | 245 | 245 | 245 |
座面最大高度 | 1.75 mm | 1.75 mm | 4.572 mm | 0.8 mm |
最大供电电压 (Vsup) | 8 V | 8 V | 8 V | 8 V |
最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | NO | YES |
最长断开时间 | 150 ns | 150 ns | 150 ns | 150 ns |
最长接通时间 | 150 ns | 150 ns | 150 ns | 150 ns |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | GULL WING | GULL WING | THROUGH-HOLE | NO LEAD |
端子节距 | 0.635 mm | 1.27 mm | 2.54 mm | 0.8 mm |
端子位置 | DUAL | DUAL | DUAL | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 3.9 mm | 3.9 mm | 7.62 mm | 5 mm |
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