NOTE: Boost Topology ISRs are not Short-Circuit Protected.
Specifications
Characteristics
Output Current
(Unless otherwise stated, T
a
=25°C, V
in
=5V, I
o
=I
o
max, C
3
=100µF)
PT5040 SERIES
Symbol
I
o
Conditions
Over V
in
range
PT5049
PT5047
PT5041/48
PT5042
PT5044
PT5045/46
PT5047/5049
Min
0.1
0.1
0.1
0.1
0.1
0.1
(1)
(1)
(1)
(1)
(1)
(1)
Typ
—
—
—
—
—
—
—
—
±1.5
±0.5
±0.5
85
±2
500
3.0
150
(2)
5.5
(3)
1
650
800
—
40
—
—
5
20
(5)
4.5
6.5
Max
0.5
0.6
1.0
0.75
1.5
1.2
(V
o
–
1)
14
±3.0
±1.0
±1.0
—
±5
—
5.0
—
—
—
800
950
+85
—
+125
G’s
—
—
—
—
(4)
Units
A
Input Voltage Range
Output Voltage Tolerance
Line Regulation
Load Regulation
Efficiency
V
o
Ripple (pk-pk)
Transient Response
Current Limit
Inrush Current
Switching Frequency
Operating Temperature Range
Thermal Resistance
Storage Temperature
Mechanical Shock
Mechanical Vibration
Per Mil-STD-883D, 20-2000 Hz
Weight
Notes:
(1)
(2)
(3)
(4)
(5)
V
in
∆V
o
Reg
line
Reg
load
η
V
r
t
tr
V
os
I
lim
I
ir
t
ir
ƒ
s
T
a
Over Io range
4.75
4.75
—
—
—
—
—
—
—
—
—
—
V
%V
o
%V
o
%V
o
%
%V
o
µSec
%V
o
%I
o
max
A
mSec
kHz
°C
°C/W
°C
Over V
in
Range
T
a
= -20°C to SOA derating limit
(3)
Over V
in
range
I
o
min
≤
I
o
≤
I
o
max
I
o
=0.5A
20MHz bandwidth
25% load change
V
o
over/undershoot
On start up
Over V
in
and I
o
ranges
—
Free Air Convection
(40-60LFM)
Per Mil-STD-883D, Method 2002.3
1 msec, Half Sine, mounted to a fixture
Suffixes N, A, & C
Suffixes L & M
Suffixes N, A, & C
Suffixes L & M
V
o
<15V
V
o
>15V
500
650
-20
—
-40
θ
ja
T
s
—
500
—
—
—
—
G’s
grams
The ISR will operate at no load with reduced specifications.
Boost topology ISRs are not short circuit protected.
The inrush current stated is above the normal input current for the associated output load.
See Safe Operating Area curves or consult the factory for the appropriate derating
The tab pins on the 5-pin mount package types (suffixes L & M) must be soldered. For more information see the applicable package outline drawing.
For technical support and more information, see inside back cover or visit www.ti.com
PT5040 Series
1-A Positive Step-up
Integrated Switching Regulator
Typical Characteristics
PT5041, +12.0 VDC
(See Note A)
PT5042, +15.0 VDC
(See Note A)
Efficiency vs Output Current
100
90
Efficiency - %
10 0
90
V in
11.0V
Efficiency vs Output Current
80
70
60
50
40
0
0 .2
0 .4
Iout-(Amps)
0 .6
0 .8
1
Efficiency - %
80
70
60
50
40
0
0.1 5
0 .3
0.4 5
0 .6
0.7 5
V in
14.0V
12.0V
10.0V
8.0V
6.0V
5.0V
8.0V
6.0V
5.0V
Iout-(Amps)
Ripple Voltage vs Output Current
25 0
20 0
V in
Ripple Voltage vs Output Current
250
200
V in
15 0
10 0
50
0
0
0 .2
0 .4
0 .6
0 .8
1
5.0V
6.0V
8.0V
11.0V
Ripple-(mV)
Ripple-(mV)
150
100
50
0
0
0.15
0 .3
0.45
0 .6
0.75
5.0V
6.0V
8.0V
10.0V
12.0V
14.0V
Iout-(Amps)
Iout-(Amps)
Power Dissipation vs Output Current
2.5
2
Vin
Power Dissipation vs Output Current
3
2.5
PD-(Watts)
Vin
PD-(Watts)
1.5
1
0.5
0
0
0.2
0.4
Iout-(Amps)
0.6
0.8
1
2
1.5
1
0.5
0
0
0.15
0.3
0.45
0.6
0.75
Iout-(Amps)
5.0V
6.0V
8.0V
11.0V
5.0V
6.0V
8.0V
10.0V
12.0V
14.0V
Safe Operating Area (V
IN
=5V)
(See Note B)
90
90
Safe Operating Area (V
IN
=5V)
(See Note B)
Ambient Temperature - (C°)
80
Ambient Temperature - (C°)
80
70
60
70
60
Airflow
50
40
30
20
0
0.2
0.4
0.6
0.8
1
0 LFM
60 LFM
90 LFM
Airflow
50
40
0 LFM
60 LFM
90 LFM
30
20
0.00
0.25
0.50
0.75
Maximum Output Current - (Amps)
Maximum Output Current - (Amps)
Note A:
Characteristic data has been developed from actual products tested at 25°C. This data is considered typical data for the Converter.
Note B:
Thermal derating graphs are developed in free-air convection cooling, which corresponds to approximately 40–60LFM of airflow.
For technical support and more information, see inside back cover or visit www.ti.com
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jan-2013
PACKAGING INFORMATION
Orderable Device
PT5041A
PT5041C
PT5041J
PT5041L
PT5041M
PT5041N
PT5042A
PT5042L
PT5042M
PT5042N
PT5044A
PT5044C
PT5044L
PT5044M
PT5044N
PT5045A
PT5045C
PT5046A
PT5046M
Status
(1)
Package Type Package Pins Package Qty
Drawing
EAA
EAC
EAJ
EAL
EAM
EAD
EAA
EAL
EAM
EAD
EAA
EAC
EAL
EAM
EAD
EAA
EAC
EAA
EAM
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
35
35
35
35
35
35
35
35
35
35
35
35
35
35
35
Eco Plan
(2)
Lead/Ball Finish
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
MSL Peak Temp
(3)
Samples
(Requires Login)
LIFEBUY SIP MODULE
LIFEBUY SIP MODULE
OBSOLETE SIP MODULE
LIFEBUY SIP MODULE
LIFEBUY SIP MODULE
LIFEBUY SIP MODULE
LIFEBUY SIP MODULE
LIFEBUY SIP MODULE
LIFEBUY SIP MODULE
LIFEBUY SIP MODULE
LIFEBUY SIP MODULE
LIFEBUY SIP MODULE
OBSOLETE SIP MODULE
LIFEBUY SIP MODULE
LIFEBUY SIP MODULE
LIFEBUY SIP MODULE
OBSOLETE SIP MODULE
OBSOLETE SIP MODULE
LIFEBUY SIP MODULE
Pb-Free
(RoHS)
Pb-Free
(RoHS)
TBD
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
TBD
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
TBD
TBD
Pb-Free
(RoHS)
N / A for Pkg Type
Level-1-215C-UNLIM
Call TI
Level-1-215C-UNLIM
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
Level-1-215C-UNLIM
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
Level-1-215C-UNLIM
Call TI
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
Call TI
Call TI
N / A for Pkg Type
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jan-2013
Orderable Device
PT5046N
PT5047C
PT5047H
PT5048A
PT5048C
PT5049A
PT5049C
PT5049N
Status
(1)
Package Type Package Pins Package Qty
Drawing
EAD
EAC
EAH
EAA
EAC
EAA
EAC
EAD
3
3
3
3
3
3
3
3
35
35
35
35
16
35
Eco Plan
(2)
Lead/Ball Finish
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
MSL Peak Temp
(3)
Samples
(Requires Login)
LIFEBUY SIP MODULE
LIFEBUY SIP MODULE
LIFEBUY SIP MODULE
LIFEBUY SIP MODULE
OBSOLETE SIP MODULE
LIFEBUY SIP MODULE
OBSOLETE SIP MODULE
LIFEBUY SIP MODULE
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
TBD
Pb-Free
(RoHS)
TBD
Pb-Free
(RoHS)
N / A for Pkg Type
Level-1-215C-UNLIM
N / A for Pkg Type
N / A for Pkg Type
Call TI
N / A for Pkg Type
Call TI
N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability
information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The
information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
//声程处理
void rangeprocess(long int nMyRange,long int nMyPDelay)
{
//float screenvalue;
long int nTotal;
long int nDiv;
long int nAverage,nResidual,temp;
int i,j; ......
射频识别(Radio Frequency Identification，RFID)技术是一种利用无线射频通信实现的非接触式自动识别技术，与目前广泛采用的条形码技术相比，RFID具有容量大、识别距离远、穿透能力强、抗污性强等特点。RFID技术已经发展得比较成熟并获得了大规模商用，但超高频RFID技术相对滞后。本文分析了射频芯片nRF9E5的功能特性，并将其用于RFID系统中，设计了一套有源超高频(...[详细]
消费电子
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
