Bus Exchanger, CB3Q/3VH/3C/2B Series, 1-Func, 4-Bit, True Output, CMOS, PDSO16, QSOP-16
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | SOIC |
| 包装说明 | QSOP-16 |
| 针数 | 16 |
| Reach Compliance Code | not_compliant |
| Is Samacsys | N |
| 系列 | CB3Q/3VH/3C/2B |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e0 |
| 长度 | 4.9 mm |
| 逻辑集成电路类型 | BUS EXCHANGER |
| 湿度敏感等级 | 1 |
| 位数 | 4 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SSOP |
| 封装等效代码 | SSOP16,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 225 |
| 电源 | 2.5/3.3 V |
| 传播延迟（tpd） | 0.2 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 2.3 V |
| 标称供电电压 (Vsup) | 2.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING |
| 端子节距 | 0.635 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 3.9116 mm |
| Base Number Matches | 1 |
| IDTQS3VH257Q | IDTQS3VH257QG | IDTQS3VH257PA | IDTQS3VH257S1 | |
|---|---|---|---|---|
| 描述 | Bus Exchanger, CB3Q/3VH/3C/2B Series, 1-Func, 4-Bit, True Output, CMOS, PDSO16, QSOP-16 | Bus Exchanger, CB3Q/3VH/3C/2B Series, 1-Func, 4-Bit, True Output, CMOS, PDSO16, QSOP-16 | Bus Exchanger, CB3Q/3VH/3C/2B Series, 1-Func, 4-Bit, True Output, CMOS, PDSO16, TSSOP-16 | Bus Exchanger, CB3Q/3VH/3C/2B Series, 1-Func, 4-Bit, True Output, CMOS, PDSO16, SOIC-16 |
| 是否Rohs认证 | 不符合 | 符合 | 不符合 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 零件包装代码 | SOIC | SOIC | TSSOP | SOIC |
| 包装说明 | QSOP-16 | GREEN, QSOP-16 | TSSOP, TSSOP16,.25 | SOP, SOP16,.25 |
| 针数 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | not_compliant | compliant | not_compliant | not_compliant |
| 系列 | CB3Q/3VH/3C/2B | CB3Q/3VH/3C/2B | CB3Q/3VH/3C/2B | CB3Q/3VH/3C/2B |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609代码 | e0 | e3 | e0 | e0 |
| 长度 | 4.9 mm | 4.9 mm | 5 mm | 9.9 mm |
| 逻辑集成电路类型 | BUS EXCHANGER | BUS EXCHANGER | BUS EXCHANGER | BUS EXCHANGER |
| 湿度敏感等级 | 1 | 1 | 1 | 1 |
| 位数 | 4 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 |
| 端子数量 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SSOP | SSOP | TSSOP | SOP |
| 封装等效代码 | SSOP16,.25 | SSOP16,.25 | TSSOP16,.25 | SOP16,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 225 | 260 | 225 | 225 |
| 电源 | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V |
| 传播延迟（tpd） | 0.2 ns | 0.2 ns | 0.2 ns | 0.2 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.75 mm | 1.75 mm | 1.2 mm | 1.75 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 2.3 V | 2.3 V | 2.3 V | 2.3 V |
| 标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) | Matte Tin (Sn) - annealed | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.635 mm | 0.635 mm | 0.65 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 |
| 宽度 | 3.9116 mm | 3.9116 mm | 4.4 mm | 3.9 mm |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
