Agilent HCPL-0708
High Speed
CMOS Optocoupler
Data Sheet
Features
• +5 V CMOS compatibility
• 15 ns typical pulse width distortion
• 30 ns max. pulse width distortion
Description
Available in SO-8 package, the
HCPL-0708 optocoupler utilizes the
latest CMOS IC technology to
achieve outstanding performance
with very low power consumption.
Basic building blocks of the HCPL-
0708 are a high speed LED and a
CMOS detector IC. The detector
incorporates an integrated
photodiode, a high-speed trans-
impedance amplifier, and a voltage
comparator with an output driver.
• 40 ns max. propagation delay skew
• High speed: 15 MBd
• 60 ns max. propagation delay
• 10 kV/µs minimum common mode
rejection
• –40 to 100°C temperature range
• Safety and regulatory approvals
pending
– UL recognized
3750 V rms for 1 min. per
UL 1577 for HCPL-0708
– CSA component acceptance
Notice #5
– IEC/EN/DIN EN 60747-5-2
approved for HCPL-0708
Option 060
Applications
• Scan drive in PDP
• Digital field bus isolation:
DeviceNet, SDS, Profibus
• Multiplexed data transmission
• Computer peripheral interface
• Microprocessor system interface
• DC/DC converter
Functional Diagram
NC
1
8
V
DD
ANODE
2
7
NC
CATHODE
3
6
V
O
NC
4
5
GND
TRUTH TABLE
LED
OFF
ON
V
O
, OUTPUT
H
L
*A 0.1
µF
bypass capacitor
must be connected between
pins 5 and 8.
CAUTION:
It is advised that normal static precautions be taken in handling and assembly of this
component to prevent damage and/or degradation which may be induced by ESD.
Ordering Information
Specify Part Number followed by Option Number (if desired)
Example
HCPL-0708#XXXX
060 = IEC/EN/DIN EN 60747-5-2 Option.
500 = Tape and Reel Packaging Option.
XXXE = Lead Free Option.
Remarks: The notation “#” is used for existing products, while (new) products launched since 15th July
2001 and lead free option will use “-”
Package Outline Drawing
HCPL-0708 (Small Outline SO-8 Package)
LAND PATTERN RECOMMENDATION
8
7
6
5
3.937 ± 0.127
(0.155 ± 0.005)
XXXV
YWW
5.994 ± 0.203
(0.236 ± 0.008)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
4
7.49 (0.295)
PIN ONE
1
0.406 ± 0.076
(0.016 ± 0.003)
2
3
1.9 (0.075)
1.270 BSC
(0.050)
0.64 (0.025)
*
5.080 ± 0.127
(0.200 ± 0.005)
7°
45° X
0.432
(0.017)
3.175 ± 0.127
(0.125 ± 0.005)
0 ~ 7°
1.524
(0.060)
0.203 ± 0.102
(0.008 ± 0.004)
0.228 ± 0.025
(0.009 ± 0.001)
*
TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
OPTION NUMBER 500 NOT MARKED.
0.305 MIN.
(0.012)
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
2
Solder Reflow Thermal Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
3°C + 1°C/–0.5°C
30
SEC.
30
SEC.
SOLDERING
TIME
200°C
TEMPERATURE (°C)
200
100
PREHEATING TIME
150°C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
50
100
150
200
250
TIME (SECONDS)
Recommended Pb-Free IR Profile
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
t
p
T
p
T
L
260 +0/-5 °C
217 °C
RAMP-UP
3 °C/SEC. MAX.
150 - 200 °C
TEMPERATURE
T
smax
T
smin
RAMP-DOWN
6 °C/SEC. MAX.
t
s
PREHEAT
60 to 180 SEC.
25
t 25 °C to PEAK
t
L
60 to 150 SEC.
TIME
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200 °C, T
smin
= 150 °C
Regulatory Information
The HCPL-0708 has been
approved by the following
organizations:
UL
Recognized under UL 1577,
component recognition program,
File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File
CA88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01
(Option 060 only)
3
Insulation and Safety Related Specifications
Parameter
Symbol
Minimum External Air
L(I01)
Gap (Clearance)
Minimum External
L(I02)
Tracking (Creepage)
Minimum Internal Plastic
Gap (Internal Clearance)
Tracking Resistance
(Comparative Tracking Index)
Isolation Group
All Agilent data sheets report the
creepage and clearance inherent
to the optocoupler component
itself. These dimensions are
needed as a starting point for the
equipment designer when
determining the circuit insulation
requirements. However, once
mounted on a printed circuit
CTI
Value
4.9
4.8
0.08
Units
mm
mm
mm
≥175
Volts
Conditions
Measured from input terminals to output
terminals, shortest distance through air.
Measured from input terminals to output
terminals, shortest distance path along body.
Insulation thickness between emitter and
detector; also known as distance through
insulation.
DIN IEC 112/VDE 0303 Part 1
IIIa
Material Group (DIN VDE 0110, 1/89, Table 1)
There are recommended
techniques such as grooves and
ribs which may be used on a
printed circuit board to achieve
desired creepage and clearances.
Creepage and clearance distances
will also change depending on
factors such as pollution degree
and insulation level.
board, minimum creepage and
clearance requirements must be
met as specified for individual
equipment standards. For
creepage, the shortest distance
path along the surface of a
printed circuit board between the
solder fillets of the input and
output leads must be considered.
4
IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics (Option 060)
Description
Symbol
Installation classification per DIN VDE 0110/1.89, Table 1
for rated mains voltage
≤150
V rms
for rated mains voltage
≤300
V rms
for rated mains voltage
≤450
V rms
Climatic Classification
Pollution Degree (DIN VDE 0110/1.89)
Maximum Working Insulation Voltage
V
IORM
Input to Output Test Voltage, Method b†
V
PR
V
IORM
x 1.875 = V
PR
, 100% Production
Test with t
m
= 1 sec, Partial Discharge < 5 pC
Input to Output Test Voltage, Method a†
V
PR
V
IORM
x 1.5 = V
PR
, Type and Sample Test,
t
m
= 60 sec, Partial Discharge < 5 pC
Highest Allowable Overvoltage†
V
IOTM
(Transient Overvoltage, t
ini
= 10 sec)
Safety Limiting Values
(Maximum values allowed in the event of a failure,
also see Thermal Derating curve, Figure 11.)
Case Temperature
T
S
Input Current
I
S,INPUT
Output Power
P
S,OUTPUT
Insulation Resistance at T
S
, V
10
= 500 V
R
IO
HCPL-0708 Option 060
I-IV
I-III
55/85/21
2
560
1050
Units
V peak
V peak
840
V peak
4000
V peak
150
150
600
≥10
9
°C
mA
mW
Ω
†Refer to the front of the optocoupler section of the
Isolation and Control Component Designer’s Catalog
, under Product Safety Regulations section
IEC/EN/DIN EN 60747-5-2, for a detailed description.
Note: These optocouplers are suitable for “safe electrical isolation” only within the safety limit data. Maintenance of the safety data shall be
ensured by means of protective circuits.
Note: The surface mount classification is Class A in accordance with CECC 00802.
Absolute Maximum Ratings
Parameter
Storage Temperature
Ambient Operating Temperature
[1]
Supply Voltages
Output Voltage
Average Output Current
Average Forward Input Current
Lead Solder Temperature
Solder Reflow Temperature Profile
Symbol
T
S
T
A
V
DD
V
O
I
O
I
F
Max.
Units
125
°C
+100
°C
6
Volts
V
DD2
+0.5
Volts
2
mA
20
mA
260°C for 10 sec., 1.6 mm below seating plane
See
Solder Reflow Temperature Profile
Section
Min.
–55
–40
0
–0.5
Figure
Recommended Operating Conditions
Parameter
Ambient Operating Temperature
Supply Voltages
Input Current (ON)
5
Symbol
T
A
V
DD
I
F
Min.
–40
4.5
10
Max.
+100
5.5
16
Units
°C
V
mA
Figure
1, 2
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