IC,DECODER/DEMUX,2-TO-4-LINE,CMOS,DIP,16PIN,PLASTIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | NXP(恩智浦) |
| 包装说明 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| JESD-30 代码 | R-PDIP-T16 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | OTHER DECODER/DRIVER |
| 功能数量 | 2 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5/15 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| MC14556BCPD | MC14555BCPD | MC14555BCPDS | MC14555BCLD | MC14555BCLDS | PTN1206K2701JSTS | |
|---|---|---|---|---|---|---|
| 描述 | IC,DECODER/DEMUX,2-TO-4-LINE,CMOS,DIP,16PIN,PLASTIC | IC,DECODER/DEMUX,2-TO-4-LINE,CMOS,DIP,16PIN,PLASTIC | IC,DECODER/DEMUX,2-TO-4-LINE,CMOS,DIP,16PIN,PLASTIC | IC,DECODER/DEMUX,2-TO-4-LINE,CMOS,DIP,16PIN,CERAMIC | IC,DECODER/DEMUX,2-TO-4-LINE,CMOS,DIP,16PIN,CERAMIC | Fixed Resistor, Thin Film, 0.4W, 2700ohm, 200V, 5% +/-Tol, 100ppm/Cel, Surface Mount, 1206, CHIP |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 符合 |
| 包装说明 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | CHIP |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | compliant |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 2 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 155 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -55 °C |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | SMT |
| 表面贴装 | NO | NO | NO | NO | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | THIN FILM |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) - with Nickel (Ni) barrier |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - |
| Is Samacsys | N | N | N | N | N | - |
| JESD-30 代码 | R-PDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | - |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | - |
| 逻辑集成电路类型 | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | - |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC | - |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | - |
| 封装等效代码 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 电源 | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | - |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | - |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - |
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