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MC10H334
Quad Bus Driver/Receiver
with Transmit and Receiver
Latches
Description
The MC10H334 is a Quad Bus Driver/Receiver with transmit and
receiver latches. When disabled, (OE = high) the bus outputs will fall
to
−2.0
V. Data to be transmitted or received is passed through its
respective latch when the respective latch enable (DLE and RLE) is at
a low level. Information is latched on the positive transition of DLE
and RLE. The parameters specified are with 25
W
loading on the bus
drivers and 50
W
loads on the receivers.
Features
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MARKING DIAGRAMS*
MC10H352L
AWLYYWW
CDIP−20
L SUFFIX
CASE 732
•
Propagation Delay, 1.6 ns Typical Data−to−Output
•
Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
•
Voltage Compensated
•
MECL 10K™ Compatible
•
Pb−Free Packages are Available*
V
CC
BUS1
BUS0
VCC02
D1
D0
DLE
R0
R1
V
EE
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
1 20
20 1
V
CC03
BUS2
10H334G
AWLYYWW
BUS3
OE
D2
D3
RLE
R3
R2
V
CC02
PLLC−20
FN SUFFIX
CASE 775
A
WL
YY
WW
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*For additional marking information, refer to
Application Note AND8002/D.
Figure 1. Pin Assignment
Pin assignment is for Dual−in−Line Package.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2006
February, 2006
−
Rev. 7
1
Publication Order Number:
MC10H334/D
MC10H334
Table 1. MAXIMUM RATINGS
Symbol
V
EE
V
I
I
out
T
A
T
stg
Power Supply (V
CC
= 0)
Input Voltage (V
CC
= 0)
Output Current
−
Continuous
−
Surge
Characteristic
Rating
−8.0
to 0
0 to V
EE
50
100
0 to +75
−55
to +150
−55
to +165
Unit
Vdc
Vdc
mA
°C
°C
°C
Operating Temperature Range
Storage Temperature Range
−
Plastic
−
Ceramic
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
Table 2. ELECTRICAL CHARACTERISTICS
(V
EE
=
−5.2
V
±5%)
(Note 1)
0°
Symbol
I
E
I
inH
Characteristic
Power Supply Current
Input Current High
Pins 5,6,15,16
Pins 7,14
Pin 17
Input Current Low
High Output Voltage
Low Output Voltage
High Input Voltage
Low Input Voltage
Min
−
−
−
−
0.5
−1.02
−1.95
−1.17
−1.95
Max
161
397
460
520
−
−0.84
−1.63
−0.84
−1.48
Min
−
−
−
−
0.5
−0.98
−1.95
−1.13
−1.95
25°
Max
161
273
297
357
−
−0.81
−1.63
−0.81
−1.48
Min
−
−
−
−
0.3
−0.92
−1.95
−1.07
−1.95
75°
Max
161
273
297
357
−
−0.735
−1.60
−0.735
−1.45
mA
Vdc
Vdc
Vdc
Vdc
Unit
mA
mA
I
inL
V
OH
V
OL
V
IH
V
IL
1. Each MECL 10H™ series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained.
Receiver outputs are terminated through a 50
W
resistor to
−2.0
V dc. Bus outputs are terminated through a 25
W
resistor to
−2.0
Vdc.
Table 3. AC PARAMETERS
0°
Symbol
t
pd
Characteristic
Propagation Delay
Data−to−Bus Output
DLE−to−Bus Output
OE−to−Bus Output
Bus−to−R0
RLE−to−R0
Data−to−Receiver R0
Rise Time
Fall Time
Min
0.5
1.0
0.5
0.5
0.5
1.0
0.5
0.5
Max
2.5
2.7
2.5
1.9
2.1
3.8
2.2
2.2
Min
0.5
1.0
0.5
0.5
0.5
1.0
0.5
0.5
25°
Max
2.5
2.7
2.5
1.9
2.1
3.8
2.2
2.2
Min
0.5
1.0
0.5
0.5
0.5
1.0
0.5
0.5
75°
Max
2.5
2.7
2.5
1.9
2.1
3.8
2.2
2.2
ns
ns
Unit
ns
t
r
t
f
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
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2
MC10H334
LOGIC DIAGRAM
17
7
6
5
16
15
OE
DLE
D0
D1
D2
D3
G
D
D
D
D
Q
Q
Q
Q
BUS0
BUS1
BUS2
BUS3
3
2
19
18
14
8
9
12
13
10
1
4
11
20
RLE
R0
R1
R2
R3
V
EE
V
CC
V
CC01
V
CC02
V
CC03
OUTPUT
LATCH
G
Q
Q
Q
Q
D
D
D
D
RECEIVER
LATCH
DRIVER TRUTH TABLE
D
X
D
X
DLE
X
L
H
OE
H
L
L
Bus
n+1
−2.0
V
D
Bus
n
RECEIVER TRUTH TABLE
Bus
Bus
X
RLE
L
H
R
n+1
Bus
R
n
ORDERING INFORMATION
Device
MC10H334FN
MC10H334FNG
MC10H334FNR2
MC10H334FNR2G
MC10H334L
Package
PLLC−20
PLLC−20
(Pb−Free)
PLLC−20
PLLC−20
(Pb−Free)
CDIP−20
Shipping
†
46 Units / Rail
46 Units / Rail
500 / Tape & Reel
500 / Tape & Reel
19 Unit / Rail
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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3
MC10H334
PACKAGE DIMENSIONS
20 LEAD PLLC
CASE 775−02
ISSUE E
B
−N−
Y BRK
D
−L−
−M−
W
D
V
0.010 (0.250)
T L−M
N
Z
0.007 (0.180)
M
T L−M
U
S
N
S
S
0.007 (0.180)
M
T L−M
N
S
20
1
X
VIEW D−D
G1
S
S
S
A
Z
R
0.007 (0.180)
M
T L−M
0.007 (0.180)
M
T L−M
S
N
N
S
S
S
H
K1
0.007 (0.180)
M
T L−M
S
N
S
C
E
G
G1
0.010 (0.250)
S
T L−M
0.004 (0.100)
J
−T−
VIEW S
S
SEATING
PLANE
K
F
VIEW S
0.007 (0.180)
M
T L−M
S
N
S
N
S
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
2. DIMENSIONS IN INCHES.
3. DATUMS
−L−, −M−,
AND
−N−
DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM
−T−,
SEATING PLANE.
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
−−−
0.025
−−−
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
−−−
0.020
2
_
10
_
0.310
0.330
0.040
−−−
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
−−−
0.64
−−−
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
−−−
0.50
2
_
10
_
7.88
8.38
1.02
−−−
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4
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