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HCD6433823R: 产品描述MICROCONTROLLER; 产品类别微控制器和处理器; 文件大小2MB，共563页; 制造商Renesas(瑞萨电子); 官网地址https://www.renesas.com/

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HCD6433823R概述

MICROCONTROLLER

HCD6433823R规格参数

参数名称	属性值
厂商名称	Renesas(瑞萨电子)
零件包装代码	DIE
包装说明	,
针数	24
Reach Compliance Code	compliant
Is Samacsys	N
技术	CMOS
uPs/uCs/外围集成电路类型	MICROCONTROLLER
Base Number Matches	1

文档解析

H8/300L系列单片机的低功耗模式是通过多种专门的电源管理模式来实现的，这些模式可以显著降低系统在不需要全速运行时的能耗。具体的低功耗模式包括：

睡眠模式（Sleep Mode）：在睡眠模式下，CPU停止工作，但片上外设功能仍然可以根据系统时钟运行。这种模式适用于需要低功耗同时保持外设活动的场景。
待机模式（Standby Mode）：在待机模式下，系统时钟脉冲发生器停止工作，导致CPU和所有片上外设模块停止功能，但只要供电电压在额定范围内，CPU寄存器、片上RAM和一些片上外设模块寄存器的内容得以保留。这种模式适用于需要极低功耗的场景。
观察模式（Watch Mode）：观察模式下，CPU停止工作，但时间基准功能（如定时器A、定时器F、定时器G、异步事件计数器和LCD控制器/驱动器）可以根据子时钟运行。这种模式适用于需要周期性唤醒执行任务的场景。
亚活动模式（Subactive Mode）：在亚活动模式下，CPU以子时钟的频率运行，适用于需要较低操作频率的场景。
亚睡眠模式（Subsleep Mode）：亚睡眠模式下，除了时间基准功能外，所有片上外设模块的运行都被停止，适用于需要进一步降低功耗的场景。
模块待机模式（Module Standby Mode）：在模块待机模式下，可以通过软件设置，使特定的片上外设模块进入待机状态，停止其时钟供应并停止其功能。
直接传输（Direct Transfer）：直接传输允许CPU在不同的活动模式之间转换，而不会停止程序执行，这有助于减少由于模式转换引起的功耗。
系统控制寄存器（System Control Registers）：通过系统控制寄存器，可以设置和清除不同的低功耗模式，如通过SYSCR1和SYSCR2寄存器来控制。
时钟脉冲生成器（Clock Pulse Generators）：通过配置时钟脉冲生成器，可以优化时钟频率和时钟源，以适应不同的功耗需求。

通过这些低功耗模式和相关配置，H8/300L系列单片机能够在保证性能的同时，实现在不同应用场景下的能耗优化。

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REJ09B0144-0300O

The revision list can be viewed directly by

clicking the title page.

The revision list summarizes the locations of

revisions and additions. Details should always

be checked by referring to the relevant text.

H8/3827R

Group

, H8/3827S

Group

Hardware Manual

Renesas 8-Bit Single-Chip Microcomputer

H8 Family/H8/300L Super Low Power Series

Rev.3.00

Revision Date: Mar.12, 2004

Keep safety first in your circuit designs!

1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and

more reliable, but there is always the possibility that trouble may occur with them. Trouble with

semiconductors may lead to personal injury, fire or property damage.

Remember to give due consideration to safety when making your circuit designs, with appropriate

measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material

or (iii) prevention against any malfunction or mishap.

Notes regarding these materials

1. These materials are intended as a reference to assist our customers in the selection of the Renesas

Technology Corp. product best suited to the customer's application; they do not convey any license

under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp.

or a third party.

2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-

party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or

circuit application examples contained in these materials.

3. All information contained in these materials, including product data, diagrams, charts, programs and

algorithms represents information on products at the time of publication of these materials, and are

subject to change by Renesas Technology Corp. without notice due to product improvements or

other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or

an authorized Renesas Technology Corp. product distributor for the latest product information

before purchasing a product listed herein.

The information described here may contain technical inaccuracies or typographical errors.

Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising

from these inaccuracies or errors.

Please also pay attention to information published by Renesas Technology Corp. by various

means, including the Renesas Technology Corp. Semiconductor home page

(http://www.renesas.com).

4. When using any or all of the information contained in these materials, including product data,

diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total

system before making a final decision on the applicability of the information and products. Renesas

Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from

the information contained herein.

5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device

or system that is used under circumstances in which human life is potentially at stake. Please

contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor

when considering the use of a product contained herein for any specific purposes, such as

apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea

repeater use.

6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in

whole or in part these materials.

7. If these products or technologies are subject to the Japanese export control restrictions, they must

be exported under a license from the Japanese government and cannot be imported into a country

other than the approved destination.

Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the

country of destination is prohibited.

8. Please contact Renesas Technology Corp. for further details on these materials or the products

contained therein.

HCD6433823R相似产品对比

	HCD6433823R	HCD6433824R	HCD6433827R	HCD6433827S	HCD6433822R	HCD6433826S	HCD6433825S
描述	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER
零件包装代码	DIE	DIE	DIE	DIE	DIE	DIE	DIE
包装说明	,	DIE,	DIE,	DIE,	DIE,	DIE,	DIE,
针数	24	24	24	80	24	80	80
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
uPs/uCs/外围集成电路类型	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER
厂商名称	Renesas(瑞萨电子)	Renesas(瑞萨电子)	-	-	-	Renesas(瑞萨电子)	Renesas(瑞萨电子)
Base Number Matches	1	1	1	1	1	-	-
具有ADC	-	YES	YES	YES	YES	YES	YES
位大小	-	8	8	8	8	8	8
最大时钟频率	-	16 MHz	16 MHz	16 MHz	16 MHz	16 MHz	16 MHz
DMA 通道	-	NO	NO	NO	NO	NO	NO
I/O 线路数量	-	64	64	64	64	64	64
PWM 通道	-	YES	YES	YES	YES	YES	YES
封装代码	-	DIE	DIE	DIE	DIE	DIE	DIE
封装形状	-	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
封装形式	-	UNCASED CHIP	UNCASED CHIP	UNCASED CHIP	UNCASED CHIP	UNCASED CHIP	UNCASED CHIP
速度	-	8 MHz	8 MHz	8 MHz	8 MHz	8 MHz	8 MHz
最大供电电压	-	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压	-	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
标称供电电压	-	3 V	3 V	3 V	3 V	3 V	3 V
表面贴装	-	YES	YES	YES	YES	YES	YES
端子形式	-	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
端子位置	-	UPPER	UPPER	UPPER	UPPER	UPPER	UPPER

HCD6433823R

HCD6433823R概述

HCD6433823R规格参数

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