EE PLD, 30ns, PQCC28, PLASTIC, LCC-28
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Texas Instruments(德州仪器) |
零件包装代码 | QLCC |
包装说明 | QCCJ, LDCC28,.5SQ |
针数 | 28 |
Reach Compliance Code | unknown |
Is Samacsys | N |
其他特性 | 10 MACROCELLS; SHARED INPUT/CLOCK; REGISTER PRELOAD |
架构 | PAL-TYPE |
最大时钟频率 | 22.2 MHz |
JESD-30 代码 | S-PQCC-J28 |
JESD-609代码 | e0 |
长度 | 11.48 mm |
专用输入次数 | 11 |
I/O 线路数量 | 10 |
输入次数 | 22 |
输出次数 | 10 |
产品条款数 | 132 |
端子数量 | 28 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 11 DEDICATED INPUTS, 10 I/O |
输出函数 | MACROCELL |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QCCJ |
封装等效代码 | LDCC28,.5SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5 V |
可编程逻辑类型 | EE PLD |
传播延迟 | 30 ns |
认证状态 | Not Qualified |
座面最大高度 | 4.57 mm |
最大供电电压 | 5.5 V |
最小供电电压 | 4.5 V |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 11.48 mm |
Base Number Matches | 1 |
GAL22V10-30LVI | GAL22V10-15LNC | GAL22V10-15LVC | GAL22V10-20LVI | GAL22V10-20LNI | GAL22V10-25LVC | GAL22V10-25LNC | GAL22V10-30LNI | |
---|---|---|---|---|---|---|---|---|
描述 | EE PLD, 30ns, PQCC28, PLASTIC, LCC-28 | EE PLD, 15ns, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24 | EE PLD, 15ns, PQCC28, PLASTIC, LCC-28 | EE PLD, 20ns, PQCC28, PLASTIC, LCC-28 | EE PLD, 20ns, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24 | EE PLD, 25ns, PQCC28, PLASTIC, LCC-28 | EE PLD, 25ns, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24 | EE PLD, 30ns, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
零件包装代码 | QLCC | DIP | QLCC | QLCC | DIP | QLCC | DIP | DIP |
包装说明 | QCCJ, LDCC28,.5SQ | DIP, DIP24,.3 | QCCJ, LDCC28,.5SQ | QCCJ, LDCC28,.5SQ | DIP, DIP24,.3 | QCCJ, LDCC28,.5SQ | DIP, DIP24,.3 | DIP, DIP24,.3 |
针数 | 28 | 24 | 28 | 28 | 24 | 28 | 24 | 24 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
Is Samacsys | N | N | N | N | N | N | N | N |
其他特性 | 10 MACROCELLS; SHARED INPUT/CLOCK; REGISTER PRELOAD | 10 MACROCELLS; SHARED INPUT/CLOCK; REGISTER PRELOAD | 10 MACROCELLS; SHARED INPUT/CLOCK; REGISTER PRELOAD | 10 MACROCELLS; SHARED INPUT/CLOCK; REGISTER PRELOAD | 10 MACROCELLS; SHARED INPUT/CLOCK; REGISTER PRELOAD | 10 MACROCELLS; SHARED INPUT/CLOCK; REGISTER PRELOAD | 10 MACROCELLS; SHARED INPUT/CLOCK; REGISTER PRELOAD | 10 MACROCELLS; SHARED INPUT/CLOCK; REGISTER PRELOAD |
架构 | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE |
最大时钟频率 | 22.2 MHz | 45.5 MHz | 45.5 MHz | 34.5 MHz | 34.5 MHz | 33.3 MHz | 33.3 MHz | 22.2 MHz |
JESD-30 代码 | S-PQCC-J28 | R-PDIP-T24 | S-PQCC-J28 | S-PQCC-J28 | R-PDIP-T24 | S-PQCC-J28 | R-PDIP-T24 | R-PDIP-T24 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 11.48 mm | 31.915 mm | 11.48 mm | 11.48 mm | 31.915 mm | 11.48 mm | 31.915 mm | 31.915 mm |
专用输入次数 | 11 | 11 | 11 | 11 | 11 | 11 | 11 | 11 |
I/O 线路数量 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
输入次数 | 22 | 22 | 22 | 22 | 22 | 22 | 22 | 22 |
输出次数 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
产品条款数 | 132 | 132 | 132 | 132 | 132 | 132 | 132 | 132 |
端子数量 | 28 | 24 | 28 | 28 | 24 | 28 | 24 | 24 |
最高工作温度 | 85 °C | 75 °C | 75 °C | 85 °C | 85 °C | 75 °C | 75 °C | 85 °C |
组织 | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O |
输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QCCJ | DIP | QCCJ | QCCJ | DIP | QCCJ | DIP | DIP |
封装等效代码 | LDCC28,.5SQ | DIP24,.3 | LDCC28,.5SQ | LDCC28,.5SQ | DIP24,.3 | LDCC28,.5SQ | DIP24,.3 | DIP24,.3 |
封装形状 | SQUARE | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
传播延迟 | 30 ns | 15 ns | 15 ns | 20 ns | 20 ns | 25 ns | 25 ns | 30 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.57 mm | 5.08 mm | 4.57 mm | 4.57 mm | 5.08 mm | 4.57 mm | 5.08 mm | 5.08 mm |
最大供电电压 | 5.5 V | 5.25 V | 5.25 V | 5.5 V | 5.5 V | 5.25 V | 5.25 V | 5.5 V |
最小供电电压 | 4.5 V | 4.75 V | 4.75 V | 4.5 V | 4.5 V | 4.75 V | 4.75 V | 4.5 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | YES | YES | NO | YES | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | INDUSTRIAL | INDUSTRIAL | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | J BEND | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
端子位置 | QUAD | DUAL | QUAD | QUAD | DUAL | QUAD | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 11.48 mm | 7.62 mm | 11.48 mm | 11.48 mm | 7.62 mm | 11.48 mm | 7.62 mm | 7.62 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved