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IRFC43N50KBPBF

产品描述Power Field-Effect Transistor, 500V, 0.09ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, 6 INCH, WAFER
产品类别晶体管   
文件大小106KB,共1页
制造商International Rectifier ( Infineon )
官网地址http://www.irf.com/
标准  
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IRFC43N50KBPBF概述

Power Field-Effect Transistor, 500V, 0.09ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, 6 INCH, WAFER

IRFC43N50KBPBF规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称International Rectifier ( Infineon )
零件包装代码WAFER
包装说明UNCASED CHIP, O-XUUC-N
Reach Compliance Codecompliant
Is SamacsysN
配置SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压500 V
最大漏源导通电阻0.09 Ω
FET 技术METAL-OXIDE SEMICONDUCTOR
JESD-30 代码O-XUUC-N
元件数量1
工作模式ENHANCEMENT MODE
最高工作温度150 °C
封装主体材料UNSPECIFIED
封装形状ROUND
封装形式UNCASED CHIP
峰值回流温度(摄氏度)260
极性/信道类型N-CHANNEL
认证状态Not Qualified
表面贴装YES
端子形式NO LEAD
端子位置UPPER
处于峰值回流温度下的最长时间40
晶体管元件材料SILICON
Base Number Matches1

文档预览

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PD - 94242
IRFC43N50KB
HEXFET
®
Power MOSFET Die
in Wafer Form
G
S
D
500V
R
DS(on)
=0.090Ω
6" Wafer
Electrical Characteristics
Parameter
V
(BR)DSS
R
DS(on)
V
GS(th)
I
DSS
I
GSS
T
J
T
STG
Description
Drain-to-Source Breakdown Voltage
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Drain-to-Source Leakage Current
Gate-to-Source Leakage Current
Operating Junction and
Storage Temperature Range
Guaranteed (Min/Max)
500V Min.
0.090Ω Max.
3.0V Min., 5.0V Max.
50µA Max.
± 100nA Max.
-55°C to 150°C Max.
Test Conditions
V
GS
= 0V, I
D
= 250µA
V
GS
= 10V, I
D
= 28A
V
DS
= V
GS
, I
D
= 250µA
V
DS
= 500V, V
GS
= 0V, T
J
= 25°C
V
GS
= ±30V
Mechanical Data
Nominal Back Metal Composition, Thickness:
Nominal Front Metal Composition, Thickness:
Dimensions:
Wafer Diameter:
Wafer Thickness:
Relevant Die Mechanical Drawing Number
Minimum Street Width
Reject Ink Dot Size
Recommended Storage Environment:
Recommended Die Attach Conditions:
Referenced Package Part:
Cr-NiV-Ag ( 0.1µm-0.2µm-0.5µm )
Al with 1% Si (0.004 mm)
0.315" x 0.470" [ 8.00 mm x 11.94 mm ]
150 mm
0.375 mm ± 0.025 mm
01-5444
0.004"
0.005" Diameter Minimum
Store in original container, in dessicated
nitrogen, with no contamination
For optimum electrical results, die attach
temperature should not exceed 300 °C
IRFPS43N50K
NOT ES:
1. ALL DIMENS IONS ARE S HOWN IN MILLIMETERS [INCHES ].
2. CONTROLLING DIMENS ION: [INCH].
2.08
[.082]
3. LET TER DESIGNATION:
S = S OURCE
G = GAT E
S
Die Outline
1.65
[.065]
S K = S OURCE KELVIN
IS = CURRENT SENS E
E = EMITT ER
4. DIMENS IONAL T OLERANCES :
11.94
[.470]
BONDING PADS :
WIDT H
&
LENGT H
OVERALL DIE:
G
< 0.635 T OLERANCE = + /- 0.013
< [.0250] T OLERANCE = + /- [.0005]
> 0.635 T OLERANCE = + /- 0.025
> [.0250] T OLERANCE = + /- [.0010]
< 1.270 T OLERANCE = + /- 0.102
< [.050] TOLERANCE = + /- [.004]
> 1.270 T OLERANCE = + /- 0.203
> [.050] TOLERANCE = + /- [.008]
WIDT H
0.65
[.026]
&
LENGT H
0.49
[.019]
8.00
[.315]
5. DIE T HICKNES S = 0.254 [.010]
* Notes: Electrical characteristics are reported for the reference packaged part (see above) and cannot guaranteed in die sales form due
to variations in packaging materials, dimension.
www.irf.com
1
07/18/01

IRFC43N50KBPBF相似产品对比

IRFC43N50KBPBF
描述 Power Field-Effect Transistor, 500V, 0.09ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, 6 INCH, WAFER
是否无铅 不含铅
是否Rohs认证 符合
厂商名称 International Rectifier ( Infineon )
零件包装代码 WAFER
包装说明 UNCASED CHIP, O-XUUC-N
Reach Compliance Code compliant
Is Samacsys N
配置 SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压 500 V
最大漏源导通电阻 0.09 Ω
FET 技术 METAL-OXIDE SEMICONDUCTOR
JESD-30 代码 O-XUUC-N
元件数量 1
工作模式 ENHANCEMENT MODE
最高工作温度 150 °C
封装主体材料 UNSPECIFIED
封装形状 ROUND
封装形式 UNCASED CHIP
峰值回流温度(摄氏度) 260
极性/信道类型 N-CHANNEL
认证状态 Not Qualified
表面贴装 YES
端子形式 NO LEAD
端子位置 UPPER
处于峰值回流温度下的最长时间 40
晶体管元件材料 SILICON
Base Number Matches 1

 
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