Standard SRAM, 128KX8, 10ns, CMOS, PDSO32, LEAD FREE, TSOP2-32
参数名称 | 属性值 |
厂商名称 | Cypress(赛普拉斯) |
零件包装代码 | TSOP2 |
包装说明 | TSOP2, |
针数 | 32 |
Reach Compliance Code | unknown |
ECCN代码 | 3A991.B.2.B |
Factory Lead Time | 1 week |
Is Samacsys | N |
最长访问时间 | 10 ns |
JESD-30 代码 | R-PDSO-G32 |
JESD-609代码 | e3 |
长度 | 20.95 mm |
内存密度 | 1048576 bit |
内存集成电路类型 | STANDARD SRAM |
内存宽度 | 8 |
功能数量 | 1 |
端子数量 | 32 |
字数 | 131072 words |
字数代码 | 128000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 128KX8 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSOP2 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE |
并行/串行 | PARALLEL |
认证状态 | Not Qualified |
座面最大高度 | 1.2 mm |
最大供电电压 (Vsup) | 3.63 V |
最小供电电压 (Vsup) | 2.97 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | TIN |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
宽度 | 10.16 mm |
Base Number Matches | 1 |
CY7C1019CV33-10ZXCT | CY7C1019CV33-12BVXIT | CY7C1019CV33-10VCT | CY7C1019CV33-15VCT | CY7C1019CV33-12ZCT | CY7C1019CV33-15ZXCT | CY7C1019CV33-12VIT | CY7C1019CV33-12VCT | |
---|---|---|---|---|---|---|---|---|
描述 | Standard SRAM, 128KX8, 10ns, CMOS, PDSO32, LEAD FREE, TSOP2-32 | Standard SRAM, 128KX8, 12ns, CMOS, PBGA48, 6 X 8 MM, 1 MM HEIGHT, LEAD FREE, VFBGA-48 | Standard SRAM, 128KX8, 10ns, CMOS, PDSO32, 0.400 INCH, SOJ-32 | Standard SRAM, 128KX8, 15ns, CMOS, PDSO32, 0.400 INCH, SOJ-32 | Standard SRAM, 128KX8, 12ns, CMOS, PDSO32, TSOP2-32 | Standard SRAM, 128KX8, 15ns, CMOS, PDSO32, LEAD FREE, TSOP2-32 | Standard SRAM, 128KX8, 12ns, CMOS, PDSO32, 0.400 INCH, SOJ-32 | Standard SRAM, 128KX8, 12ns, CMOS, PDSO32, 0.400 INCH, SOJ-32 |
零件包装代码 | TSOP2 | BGA | SOJ | SOJ | TSOP2 | TSOP2 | SOJ | SOJ |
包装说明 | TSOP2, | VFBGA, | SOJ, | 0.400 INCH, SOJ-32 | TSOP2, | TSOP2, | SOJ, | SOJ, |
针数 | 32 | 48 | 32 | 32 | 32 | 32 | 32 | 32 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B |
最长访问时间 | 10 ns | 12 ns | 10 ns | 15 ns | 12 ns | 15 ns | 12 ns | 12 ns |
JESD-30 代码 | R-PDSO-G32 | R-PBGA-B48 | R-PDSO-J32 | R-PDSO-J32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-J32 | R-PDSO-J32 |
JESD-609代码 | e3 | e1 | e0 | e0 | e0 | e3 | e0 | e0 |
长度 | 20.95 mm | 8 mm | 20.955 mm | 20.955 mm | 20.95 mm | 20.95 mm | 20.955 mm | 20.955 mm |
内存密度 | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 32 | 48 | 32 | 32 | 32 | 32 | 32 | 32 |
字数 | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
字数代码 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 85 °C | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C |
组织 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSOP2 | VFBGA | SOJ | SOJ | TSOP2 | TSOP2 | SOJ | SOJ |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.2 mm | 1 mm | 3.7592 mm | 3.7592 mm | 1.2 mm | 1.2 mm | 3.7592 mm | 3.7592 mm |
最大供电电压 (Vsup) | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V |
最小供电电压 (Vsup) | 2.97 V | 2.97 V | 2.97 V | 2.97 V | 2.97 V | 2.97 V | 2.97 V | 2.97 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
端子面层 | TIN | TIN SILVER COPPER | TIN LEAD | TIN LEAD | TIN LEAD | TIN | TIN LEAD | TIN LEAD |
端子形式 | GULL WING | BALL | J BEND | J BEND | GULL WING | GULL WING | J BEND | J BEND |
端子节距 | 1.27 mm | 0.75 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | BOTTOM | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 10.16 mm | 6 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm |
厂商名称 | Cypress(赛普拉斯) | - | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) |
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