Power Supply Management Circuit, Fixed, 1 Channel, BICMOS, PDSO5, MO-178AA, SOT-23, 5 PIN
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | SOIC |
| 包装说明 | MO-178AA, SOT-23, 5 PIN |
| 针数 | 5 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| Is Samacsys | N |
| 可调阈值 | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY MANAGEMENT CIRCUIT |
| JESD-30 代码 | R-PDSO-G5 |
| JESD-609代码 | e0 |
| 长度 | 2.9 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 5 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LSSOP |
| 封装等效代码 | TSOP5/6,.11,37 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | 1.2/5.5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.45 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.2 V |
| 标称供电电压 (Vsup) | 2.5 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.95 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 1.625 mm |
| Base Number Matches | 1 |
| MAX6864UK225D1L-T | MAX6865UK225D1L-T | HCHP1005K2104FFTF | MAX6869UK225D4L-T | MAX6869UK225D4L+T | MAX6866UK225D2L-T | MAX6866UK225D2L+T | MAX6864UK225D1L+T | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Power Supply Management Circuit, Fixed, 1 Channel, BICMOS, PDSO5, MO-178AA, SOT-23, 5 PIN | Power Supply Management Circuit, Fixed, 1 Channel, BICMOS, PDSO5, MO-178AA, SOT-23, 5 PIN | Fixed Resistor, Metal Glaze/thick Film, 0.25W, 2100000ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1005, CHIP | Power Supply Management Circuit, Fixed, 1 Channel, BICMOS, PDSO5, MO-178AA, SOT-23, 5 PIN | Power Supply Management Circuit, Fixed, 1 Channel, BICMOS, PDSO5, LEAD FREE, MO-178AA, SOT-23, 5 PIN | Power Supply Management Circuit, Fixed, 1 Channel, BICMOS, PDSO5, MO-178AA, SOT-23, 5 PIN | Power Supply Management Circuit, Fixed, 1 Channel, BICMOS, PDSO5, LEAD FREE, MO-178AA, SOT-23, 5 PIN | Power Supply Management Circuit, Fixed, 1 Channel, BICMOS, PDSO5, LEAD FREE, MO-178AA, SOT-23, 5 PIN |
| 是否Rohs认证 | 不符合 | 不符合 | 符合 | 不符合 | 符合 | 不符合 | 符合 | 符合 |
| 包装说明 | MO-178AA, SOT-23, 5 PIN | MO-178AA, SOT-23, 5 PIN | SMT, 1005 | MO-178AA, SOT-23, 5 PIN | LSSOP, TSOP5/6,.11,37 | MO-178AA, SOT-23, 5 PIN | LSSOP, TSOP5/6,.11,37 | LSSOP, TSOP5/6,.11,37 |
| Reach Compliance Code | not_compliant | not_compliant | unknown | not_compliant | compliant | not_compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| JESD-609代码 | e0 | e0 | e2 | e0 | e3 | e0 | e3 | e3 |
| 端子数量 | 5 | 5 | 2 | 5 | 5 | 5 | 5 | 5 |
| 最高工作温度 | 85 °C | 85 °C | 155 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -55 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMT | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | BICMOS | BICMOS | METAL GLAZE/THICK FILM | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Silver (Sn/Ag) - with Nickel (Ni) barrier | Tin/Lead (Sn/Pb) | MATTE TIN | Tin/Lead (Sn/Pb) | MATTE TIN | MATTE TIN |
| 是否无铅 | 含铅 | 含铅 | - | 含铅 | 不含铅 | 含铅 | 不含铅 | 不含铅 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | SOIC | SOIC | - | SOIC | SOIC | SOIC | SOIC | SOIC |
| 针数 | 5 | 5 | - | 5 | 5 | 5 | 5 | 5 |
| Is Samacsys | N | N | - | N | N | N | N | N |
| 可调阈值 | NO | NO | - | NO | NO | NO | NO | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | - | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT |
| JESD-30 代码 | R-PDSO-G5 | R-PDSO-G5 | - | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 |
| 长度 | 2.9 mm | 2.9 mm | - | 2.9 mm | 2.9 mm | 2.9 mm | 2.9 mm | 2.9 mm |
| 湿度敏感等级 | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 |
| 信道数量 | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LSSOP | LSSOP | - | LSSOP | LSSOP | LSSOP | LSSOP | LSSOP |
| 封装等效代码 | TSOP5/6,.11,37 | TSOP5/6,.11,37 | - | TSOP5/6,.11,37 | TSOP5/6,.11,37 | TSOP5/6,.11,37 | TSOP5/6,.11,37 | TSOP5/6,.11,37 |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 峰值回流温度（摄氏度） | 240 | 240 | - | 240 | 260 | 240 | 260 | 260 |
| 电源 | 1.2/5.5 V | 1.2/5.5 V | - | 1.2/5.5 V | 1.2/5.5 V | 1.2/5.5 V | 1.2/5.5 V | 1.2/5.5 V |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.45 mm | 1.45 mm | - | 1.45 mm | 1.45 mm | 1.45 mm | 1.45 mm | 1.45 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.2 V | 1.2 V | - | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| 标称供电电压 (Vsup) | 2.5 V | 2.5 V | - | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | - | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.95 mm | 0.95 mm | - | 0.95 mm | 0.95 mm | 0.95 mm | 0.95 mm | 0.95 mm |
| 端子位置 | DUAL | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | 40 | NOT SPECIFIED | 40 | 40 |
| 宽度 | 1.625 mm | 1.625 mm | - | 1.625 mm | 1.625 mm | 1.625 mm | 1.625 mm | 1.625 mm |
| Base Number Matches | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 |
电源技术
NXP MCU
WindowsCE
嵌入式系统
传感器
嵌入式系统
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