9GHz, SILICON, STEP RECOVERY DIODE, METAL CERAMIC PACKAGE-1
| 参数名称 | 属性值 |
| 厂商名称 | TE Connectivity(泰科) |
| 包装说明 | O-CUPM-N1 |
| 针数 | 1 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| Is Samacsys | N |
| 其他特性 | HIGH RELIABILITY |
| 最小击穿电压 | 300 V |
| 配置 | SINGLE |
| 最大二极管电容 | 2 pF |
| 最小二极管电容 | 1.5 pF |
| 二极管元件材料 | SILICON |
| 二极管类型 | STEP RECOVERY DIODE |
| JESD-30 代码 | O-CUPM-N1 |
| 元件数量 | 1 |
| 端子数量 | 1 |
| 最大输出频率 | 9 GHz |
| 最小输出频率 | 8 GHz |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | ROUND |
| 封装形式 | POST/STUD MOUNT |
| 认证状态 | Not Qualified |
| 表面贴装 | NO |
| 端子形式 | NO LEAD |
| 端子位置 | UPPER |
| Base Number Matches | 1 |
| MA44958 | MA44959 | MA44957 | MA44956 | MA44953 | MA44955 | MA44952 | MA44951 | MA44954 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | 9GHz, SILICON, STEP RECOVERY DIODE, METAL CERAMIC PACKAGE-1 | 10GHz, SILICON, STEP RECOVERY DIODE, METAL CERAMIC PACKAGE-1 | 8GHz, SILICON, STEP RECOVERY DIODE, METAL CERAMIC PACKAGE-1 | 7GHz, SILICON, STEP RECOVERY DIODE, METAL CERAMIC PACKAGE-1 | 4GHz, SILICON, STEP RECOVERY DIODE, METAL CERAMIC PACKAGE-1 | 6GHz, SILICON, STEP RECOVERY DIODE, METAL CERAMIC PACKAGE-1 | 3GHz, SILICON, STEP RECOVERY DIODE, METAL CERAMIC PACKAGE-1 | 2GHz, SILICON, STEP RECOVERY DIODE, METAL CERAMIC PACKAGE-1 | 5GHz, SILICON, STEP RECOVERY DIODE, METAL CERAMIC PACKAGE-1 |
| 包装说明 | O-CUPM-N1 | O-CUPM-N1 | O-CUPM-N1 | O-CUPM-N1 | O-CUPM-N1 | O-CUPM-N1 | O-CUPM-N1 | O-CUPM-N1 | O-CUPM-N1 |
| 针数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 其他特性 | HIGH RELIABILITY | HIGH RELIABILITY | HIGH RELIABILITY | HIGH RELIABILITY | HIGH RELIABILITY | HIGH RELIABILITY | HIGH RELIABILITY | HIGH RELIABILITY | HIGH RELIABILITY |
| 最小击穿电压 | 300 V | 300 V | 300 V | 300 V | 400 V | 300 V | 400 V | 400 V | 400 V |
| 配置 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
| 最大二极管电容 | 2 pF | 1.5 pF | 2.5 pF | 2.8 pF | 5 pF | 3 pF | 6 pF | 7 pF | 4 pF |
| 最小二极管电容 | 1.5 pF | 1 pF | 2 pF | 2.2 pF | 4 pF | 2.5 pF | 5 pF | 6 pF | 3 pF |
| 二极管元件材料 | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON |
| 二极管类型 | STEP RECOVERY DIODE | STEP RECOVERY DIODE | STEP RECOVERY DIODE | STEP RECOVERY DIODE | STEP RECOVERY DIODE | STEP RECOVERY DIODE | STEP RECOVERY DIODE | STEP RECOVERY DIODE | STEP RECOVERY DIODE |
| JESD-30 代码 | O-CUPM-N1 | O-CUPM-N1 | O-CUPM-N1 | O-CUPM-N1 | O-CUPM-N1 | O-CUPM-N1 | O-CUPM-N1 | O-CUPM-N1 | O-CUPM-N1 |
| 元件数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 最大输出频率 | 9 GHz | 10 GHz | 8 GHz | 7 GHz | 4 GHz | 6 GHz | 3 GHz | 2 GHz | 5 GHz |
| 最小输出频率 | 8 GHz | 9 GHz | 7 GHz | 6 GHz | 3 GHz | 5 GHz | 2 GHz | 1 GHz | 4 GHz |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND |
| 封装形式 | POST/STUD MOUNT | POST/STUD MOUNT | POST/STUD MOUNT | POST/STUD MOUNT | POST/STUD MOUNT | POST/STUD MOUNT | POST/STUD MOUNT | POST/STUD MOUNT | POST/STUD MOUNT |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子位置 | UPPER | UPPER | UPPER | UPPER | UPPER | UPPER | UPPER | UPPER | UPPER |
| 厂商名称 | TE Connectivity(泰科) | TE Connectivity(泰科) | TE Connectivity(泰科) | - | TE Connectivity(泰科) | TE Connectivity(泰科) | TE Connectivity(泰科) | TE Connectivity(泰科) | TE Connectivity(泰科) |
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