SMBG5913 thru SMBG5956B, e3
SMBJ5913 thru SMBJ5956B, e3
SILICON 2.0 Watt ZENER DIODES
SCOTTSDALE DIVISION
DESCRIPTION
The SMBJ5913-5956B or SMBG5913-5956B series of surface mount 2.0
watt Zeners provides voltage regulation in a selection from 3.3 to 200
volts with different tolerances as identified by suffix letter on the part
number. This series is equivalent to the JEDEC registered 1N5913 thru
1N5956B with identical electrical characteristics except it is rated at 2.0 W
instead of 1.5 W with the lower thermal resistance features of the surface
mount packaging. It is available in J-bend design (SMBJ) with the DO-
214AA package for greater PC board mounting density or in Gull-wing
design (SMBG) in the DO-215AA for visible solder connections. It is also
available as RoHS Compliant with an e3 suffix. Microsemi also offers
numerous other Zener products to meet higher and lower power
applications.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
APPEARANCE
WWW .
Microsemi
.C
OM
NOTE: All SMB series are
equivalent to prior SMS package
identifications.
FEATURES
•
•
•
•
Surface mount equivalent to 1N5913 to 1N5956B
Ideal for high-density and low-profile mounting
Zener voltage available 3.3V to 200V
Standard voltage tolerances are plus/minus 5% with
B suffix and 10 % with A suffix identification
•
Tight tolerances available in plus or minus 2% or 1%
with C or D suffix respectively
•
Options for screening in accordance with MIL-PRF-19500
•
•
•
•
•
•
APPLICATIONS / BENEFITS
Regulates voltage over a broad operating
current and temperature range
Wide selection from 3.3 to 200 V
Popular DO-214AA or DO-215AA packages
and footprints for either high density J-bend or
Gull-wing designs for visible solder joints
Nonsensitive to ESD per MIL-STD-750 Method
1020
Withstands high surge stresses (see Figure 2)
Moisture classification: Level 1 per IPC/JEDEC
J-STD-020B with no dry pack required
MECHANICAL AND PACKAGING
•
CASE: Void-free transfer molded
thermosetting epoxy body meeting UL94V-0
•
TERMINALS: Gull-wing or C-bend (modified
J-bend) tin-lead or RoHS compliant annealed
matte-Tin plating solderable per MIL-STD-750,
method 2026
•
POLARITY: Cathode indicated by band.
Diode to be operated with banded end positive
with respect to opposite end for Zener
regulation
•
MARKING: Includes part number without
prefix (e.g. 5913B, 5913Be3, 5948C, 5956D,
etc.)
•
TAPE & REEL option: Standard per
EIA-481-1-
A
with 12 mm tape, 750 per 7 inch reel or 2500
per 13 inch reel
(add “TR” suffix to part number)
•
WEIGHT: 0.1 grams
•
See package dimensions on last page
for JAN, JANTX, JANTXV, and JANS are available by
adding MQ, MX, MV, or MSP prefixes respectively to part
numbers.
•
RoHS Compliant devices available by adding an “e3” suffix
MAXIMUM RATINGS
•
•
•
Power dissipation at 25
º
C: 2.0 watts (also see
derating in Figure 1).
Operating and Storage temperature: -65
º
C to
+150
º
C
Thermal Resistance: 35
º
C/W junction to lead, or
100
º
C/W junction to ambient when mounted on FR4
PC board (1oz Cu) with recommended footprint (see
last page)
Steady-State Power: 2 watts at T
L
< 80
o
C, or 1.25
watts at T
A
= 25
º
C when mounted on FR4 PC board
with recommended footprint (also see Figure 1)
Forward voltage @200 mA: 1.2 volts (maximum)
Solder Temperatures: 260
º
C for 10 s (maximum)
SMBG(J)5913–5956B, e3
•
•
•
Copyright
©
2006
1-31--2006 REV G
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
SMBG5913 thru SMBG5956B, e3
SMBJ5913 thru SMBJ5956B, e3
SILICON 2.0 Watt ZENER DIODES
SCOTTSDALE DIVISION
ELECTRICAL CHARACTERISTICS @ T
L
= 30
o
C
MICROSEMI PART
NUMBER
GULL-WING
LEAD
C-BEND
(MOD. “J”)
WWW .
Microsemi
.C
OM
ZENER
VOLTAGE
V
Z
Volts
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
7.5
8.2
9.1
10
11
12
13
15
16
18
20
22
24
27
30
33
36
39
43
47
51
56
62
68
75
82
91
100
110
120
130
150
160
180
200
SMBG5913
SMBG5914
SMBG5915
SMBG5916
SMBG5917
SMBG5918
SMBG5919
SMBG5920
SMBG5921
SMBG5922
SMBG5923
SMBG5924
SMBG5925
SMBG5926
SMBG5927
SMBG5928
SMBG5929
SMBG5930
SMBG5931
SMBG5932
SMBG5933
SMBG5934
SMBG5935
SMBG5936
SMBG5937
SMBG5938
SMBG5939
SMBG5940
SMBG5941
SMBG5942
SMBG5943
SMBG5944
SMBG5945
SMBG5946
SMBG5947
SMBG5948
SMBG5949
SMBG5950
SMBG5951
SMBG5952
SMBG5953
SMBG5954
SMBG5955
SMBG5956
SMBJ5913
SMBJ5914
SMBJ5915
SMBJ5916
SMBJ5917
SMBJ5918
SMBJ5919
SMBJ5920
SMBJ5921
SMBJ5922
SMBJ5923
SMBJ5924
SMBJ5925
SMBJ5926
SMBJ5927
SMBJ5928
SMBJ5929
SMBJ5930
SMBJ5931
SMBJ5932
SMBJ5933
SMBJ5934
SMBJ5935
SMBJ5936
SMBJ5937
SMBJ5938
SMBJ5939
SMBJ5940
SMBJ5941
SMBJ5942
SMBJ5943
SMBJ5944
SMBJ5945
SMBJ5946
SMBJ5947
SMBJ5948
SMBJ5949
SMBJ5950
SMBJ5951
SMBJ5952
SMBJ5953
SMBJ5954
SMBJ5955
SMBJ5956
TEST
DYNAMIC
CURRENT IMPEDANCE
I
ZT
Z
ZT
mA
Ohms
113.6
10.0
104.2
9.0
96.1
7.5
87.2
6.0
79.8
5.0
73.5
4.0
66.9
2.0
60.5
2.0
55.1
2.5
50.0
3.0
45.7
3.5
41.2
4.0
37.5
4.5
34.1
5.5
31.2
6.5
28.8
7.0
25.0
9.0
23.4
10.0
20.8
12.0
18.7
14.0
17.0
17.5
15.6
19.0
13.9
23.0
12.5
28.0
11.4
33.0
10.4
38.0
9.6
45.0
8.7
53.0
8.0
67.0
7.3
70.0
6.7
86.0
6.0
100.0
5.5
120.0
5.0
140.0
4.6
160.0
4.1
200.0
3.7
250.0
3.4
300.0
3.1
380.0
2.9
450.0
2.5
600.0
2.3
700.0
2.1
900.0
1.9
1200.0
KNEE
CURRENT
I
ZK
mA
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
0.5
0.5
0.5
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
KNEE
IMPEDANCE
Z
ZK
Ohms
500
500
500
500
500
350
250
200
200
400
400
500
500
550
550
550
600
600
650
650
650
700
700
750
800
850
900
950
1000
1100
1300
1500
1700
2000
2500
3000
3100
4000
4500
5000
6000
6500
7000
8000
REVERSE
CURRENT
I
R
μadc
100.0
75.0
25.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
REVERSE
VOLTAGE
V
R
Volts
1.0
1.0
1.0
1.0
1.5
2.0
3.0
4.0
5.2
6.0
6.5
7.0
8.0
8.4
9.1
9.9
11.4
12.2
13.7
15.2
16.7
18.2
20.6
22.8
25.1
27.4
29.7
32.7
35.8
38.8
42.6
47.1
51.2
56.0
62.2
69.2
76.0
83.6
91.2
98.8
114.0
121.6
136.8
152.0
MAX. DC
CURRENT
I
ZM
mA
606
554
512
464
425
392
356
321
293
266
242
218
200
181
166
153
133
122
110
100
90
82
73
66
60
54
50
45
41
38
34
32
29
26
24
10
20
17
16
14
13
12
10
9
SMBG(J)5913–5956B, e3
NOTE 1:
No suffix indicates a +/- 20% tolerance on nominal
V
Z
. Suffix A denotes a +/-10% tolerance, B denotes a
+/-5% tolerance, C denotes a +/-2% tolerance, and D denotes a +/-1% tolerance.
NOTE 2:
Zener voltage (Vz) is measured at T
L
= 30
o
C and 20 seconds after application of dc current.
NOTE 3:
The zener impedance is derived from 1 kHz ac voltage resulting from an ac current modulation having an
rms value equal to 10% of the dc zener current (
I
ZT
or I
ZK
) superimposed on
I
ZT
or I
ZK
. See Micro Note 202 for
zener impedance variation with different operating currents.
NOTE 4:
The maximum dc current (I
ZM
) is based only on the maximum power of 2.0 watts at T
L
< 80
o
C. These
values must be reduced by 37.5% (1.25 W) when mounted on PC boards as described in Maximum Ratings.
Copyright
©
2006
1-31--2006 REV G
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 2
SMBG5913 thru SMBG5956B, e3
SMBJ5913 thru SMBJ5956B, e3
SILICON 2.0 Watt ZENER DIODES
SCOTTSDALE DIVISION
GRAPHS
WWW .
Microsemi
.C
OM
Pd, Maximum Power Dissipation (Watts)
T
L
T
A
on FR4
PC BOARD
Temperature ( C)
T
L
Lead temp (ºC), or T
A
on FR4 PC Board
o
Typical Maximum Power in Watts
Time in Milliseconds
FIGURE 1 –
Power Derating Curve
FIGURE 2
– Transient Surge Capability
Square-Wave Pulse Width
(non-Repetitive) in Milliseconds
PACKAGE DIMENSIONS & PAD LAYOUT
C – Capacitance - Picofarads
SMBJ
A
MIN
MAX
MIN
MAX
.077
.083
1.96
2.10
SMBG
B
.160
.180
4.06
4.57
C
.130
.155
3.30
3.94
D
.205
.220
5.21
5.59
E
.077
.104
1.95
2.65
F
.235
.255
5.97
6.48
K
.015
.030
.381
.762
L
.030
.060
.760
1.520
DIMENSIONS IN MILLIMETERS
SMBG(J)5913–5956B, e3
A
B
C
A
B
C
V
Z
– Zener Voltage – Volts
INCHES
0.320
0.085
0.110
INCHES
.260
.085
.110
mm
8.13
2.16
2.79
mm
6.60
2.16
2.79
SMBG
SMBJ
FIGURE 3 –
Capacitance vs Zener Voltage
Copyright
©
2006
1-31--2006 REV G
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 3
NXP MCU
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