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SIR624DP-T1-GE3

产品类别分立半导体    MOS(场效应管)   
文件大小417KB,共13页
制造商Vishay(威世)
官网地址http://www.vishay.com
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SiR624DP
www.vishay.com
Vishay Siliconix
N-Channel 200 V (D-S) MOSFET
PRODUCT SUMMARY
V
DS
(V)
200
R
DS(on)
() MAX.
0.060 at V
GS
= 10 V
0.064 at V
GS
= 7.5 V
I
D
(A)
a
18.6
18
D
8
FEATURES
Q
g
(TYP.)
15 nC
• ThunderFET
®
technology optimizes balance
of R
DS(on)
, Q
g
, Q
sw
, and Q
oss
• 100 % R
g
and UIS tested
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
PowerPAK
®
SO-8 Single
D
6
D
7
D
5
APPLICATIONS
• Fixed telecom
• DC/DC converter
D
6.
15
m
m
1
Top View
5.1
m
5m
4
G
Bottom View
3
S
2
S
1
S
• Primary and secondary side switch
• Synchronous rectification
G
Ordering Information:
SiR624DP-T1-GE3 (lead (Pb)-free and halogen-free)
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS
(T
A
= 25 °C, unless otherwise noted)
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
T
C
= 25 °C
Continuous Drain Current (T
J
= 150 °C)
T
C
= 70 °C
T
A
= 25 °C
T
A
= 70 °C
Pulsed Drain Current (t = 100 μs)
Continuous Source-Drain Diode Current
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
T
C
= 25 °C
T
A
= 25 °C
L = 0.1 mH
T
C
= 25 °C
Maximum Power Dissipation
T
C
= 70 °C
T
A
= 25 °C
T
A
= 70 °C
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak temperature)
d, e
T
J
, T
stg
P
D
I
DM
I
S
I
AS
E
AS
I
D
SYMBOL
V
DS
V
GS
LIMIT
200
± 20
18.6
14.8
5.7
b, c
4.6
b, c
50
26
4.5
b, c
15
11.25
52
33
5
b, c
3.2
b, c
-55 to +150
260
°C
W
mJ
A
UNIT
V
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum Junction-to-Ambient
b, f
Maximum Junction-to-Case (Drain)
t
10 s
Steady State
SYMBOL
R
thJA
R
thJC
TYPICAL
20
1.9
MAXIMUM
25
2.4
UNIT
°C/W
Notes
a. T
C
= 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 65 °C/W.
S16-0998-Rev. A, 23-May-16
Document Number: 67607
1
For technical questions, contact:
pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000

 
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