IRFP460, SiHFP460
Vishay Siliconix
Power MOSFET
PRODUCT SUMMARY
V
DS
(V)
R
DS(on)
(Ω)
Q
g
(Max.) (nC)
Q
gs
(nC)
Q
gd
(nC)
Configuration
V
GS
= 10 V
210
29
110
Single
D
FEATURES
500
0.27
• Dynamic dV/dt Rating
• Repetitive Avalanche Rated
• Isolated Central Mounting Hole
• Fast Switching
• Ease of Paralleling
• Simple Drive Requirements
• Lead (Pb)-free Available
Available
RoHS*
COMPLIANT
TO-247
DESCRIPTION
G
S
D
G
S
N-Channel
MOSFET
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
The TO-247 package is preferred for commercial-industrial
applications where higher power levels preclude the use of
TO-220 devices. The TO-247 is similar but superior to the
earlier TO-218 package because its isolated mounting hole.
It also provides greater creepage distances between pins to
meet the requirements of most safety specifications.
ORDERING INFORMATION
Package
Lead (Pb)-free
SnPb
TO-247
IRFP460PbF
SiHFP460-E3
IRFP460
SiHFP460
ABSOLUTE MAXIMUM RATINGS
T
C
= 25 °C, unless otherwise noted
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain
Linear Derating Factor
Single Pulse Avalanche Energy
b
Repetitive Avalanche Current
a
Repetitive Avalanche Energy
a
Maximum Power Dissipation
Peak Diode Recovery dV/dt
c
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
Mounting Torque
Current
a
V
GS
at 10 V
T
C
= 25 °C
T
C
= 100 °C
SYMBOL
V
DS
V
GS
I
D
I
DM
E
AS
I
AR
E
AR
P
D
dV/dt
T
J
, T
stg
LIMIT
500
± 20
20
13
80
2.2
960
20
28
280
3.5
- 55 to + 150
300
d
10
1.1
UNIT
V
A
W/°C
mJ
A
mJ
W
V/ns
°C
lbf · in
N·m
T
C
= 25 °C
for 10 s
6-32 or M3 screw
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. V
DD
= 50 V, starting T
J
= 25 °C, L = 4.3 mH, R
G
= 25
Ω,
I
AS
= 20 A (see fig. 12).
c. I
SD
≤
20 A, dI/dt
≤
160 A/µs, V
DD
≤
V
DS
, T
J
≤
150 °C.
d. 1.6 mm from case.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91237
S-81360-Rev. A, 28-Jul-08
www.vishay.com
1
IRFP460, SiHFP460
Vishay Siliconix
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum Junction-to-Ambient
Case-to-Sink, Flat, Greased Surface
Maximum Junction-to-Case (Drain)
SYMBOL
R
thJA
R
thCS
R
thJC
TYP.
-
0.24
-
MAX.
40
-
0.45
°C/W
UNIT
SPECIFICATIONS
T
J
= 25 °C, unless otherwise noted
PARAMETER
Static
Drain-Source Breakdown Voltage
V
DS
Temperature Coefficient
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
Drain-Source On-State Resistance
Forward Transconductance
Dynamic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Internal Drain Inductance
Internal Source Inductance
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulsed Diode Forward
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Forward Turn-On Time
Current
a
I
S
I
SM
V
SD
t
rr
Q
rr
t
on
MOSFET symbol
showing the
integral reverse
p - n junction diode
D
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
DS
ΔV
DS
/T
J
V
GS(th)
I
GSS
I
DSS
R
DS(on)
g
fs
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
L
D
L
S
V
GS
= 0 V, I
D
= 250 µA
Reference to 25 °C, I
D
= 1 mA
V
DS
= V
GS
, I
D
= 250 µA
V
GS
= ± 20 V
V
DS
= 500 V, V
GS
= 0 V
V
DS
= 400 V, V
GS
= 0 V, T
J
= 125 °C
V
GS
= 10 V
I
D
= 12 A
b
V
DS
= 50 V, I
D
= 12 A
b
500
-
2.0
-
-
-
-
13
-
0.63
-
-
-
-
-
-
-
-
4.0
± 100
25
250
0.27
-
V
V/°C
V
nA
µA
Ω
S
V
GS
= 0 V,
V
DS
= 25 V,
f = 1.0 MHz, see fig. 5
-
-
-
-
4200
870
350
-
-
-
18
59
110
58
5.0
13
-
-
-
210
29
110
-
-
-
-
-
nH
-
ns
nC
pF
V
GS
= 10 V
I
D
= 20 A, V
DS
= 400 V
see fig. 6 and 13
b
-
-
-
V
DD
= 250 V, I
D
= 20 A ,
R
G
= 4.3
Ω,
R
D
= 13
Ω,
see fig. 10
b
-
-
-
Between lead,
6 mm (0.25") from
package and center of
die contact
D
-
-
G
S
-
-
-
-
-
-
-
-
570
5.7
20
A
80
1.8
860
8.6
V
ns
µC
G
S
T
J
= 25 °C, I
S
= 20 A, V
GS
= 0 V
b
T
J
= 25 °C, I
F
= 20A, dI/dt = 100 A/µs
b
Intrinsic turn-on time is negligible (turn-on is dominated by L
S
and L
D
)
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Pulse width
≤
300 µs; duty cycle
≤
2 %.
www.vishay.com
2
Document Number: 91237
S-81360-Rev. A, 28-Jul-08
IRFP460, SiHFP460
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
I
D
, Drain Current (A)
I
D
, Drain Current (A)
15
V
10
V
8.0 V
7.0
V
6.0
V
5.5
V
5.0
V
Bottom 4.5
V
Top
V
GS
150
°
C
10
1
4.5
V
10
1
25
°
C
10
0
91237_01
20
µs
Pulse
Width
T
C
=
25 °C
10
0
10
1
10
0
4
91237_03
20
µs
Pulse
Width
V
DS
=
50
V
5
6
7
8
9
10
V
DS
, Drain-to-Source
Voltage
(V)
Fig. 1 - Typical Output Characteristics, T
C
= 25 °C
V
GS,
Gate-to-Source
Voltage
(V)
Fig. 3 - Typical Transfer Characteristics
I
D
, Drain Current (A)
10
1
V
GS
Top
15
V
10
V
8.0 V
7.0
V
6.0
V
5.5
V
5.0
V
Bottom 4.5
V
R
DS(on)
, Drain-to-Source On Resistance
(Normalized)
3.5
3.0
2.5
2.0
1.5
1.0
0.5
I
D
= 20 A
V
GS
= 10
V
4.5
V
10
0
10
0
91237_02
20
µs
Pulse
Width
T
C
=
150 °C
10
1
0.0
- 60 - 40 - 20
0 20
40 60
80
100 120 140 160
V
DS,
Drain-to-Source
Voltage
(V)
91237_04
T
J,
Junction Temperature (°C)
Fig. 2 - Typical Output Characteristics, T
C
= 150 °C
Fig. 4 - Normalized On-Resistance vs. Temperature
Document Number: 91237
S-81360-Rev. A, 28-Jul-08
www.vishay.com
3
IRFP460, SiHFP460
Vishay Siliconix
10 000
8000
6000
C
iss
4000
C
oss
I
SD
, Reverse Drain Current (A)
Capacitance (pF)
V
GS
= 0
V,
f = 1 MHz
C
iss
= C
gs
+ C
gd
, C
ds
Shorted
C
rss
= C
gd
C
oss
= C
ds
+ C
gd
10
2
150
°
C
25
°
C
V
GS
= 0
V
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2000
C
rss
0
10
0
91237_05
10
1
10
1
0.6
91237_07
V
DS,
Drain-to-Source
Voltage
(V)
V
SD
, Source-to-Drain
Voltage
(V)
Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage
Fig. 7 - Typical Source-Drain Diode Forward Voltage
20
V
GS
, Gate-to-Source
Voltage
(V)
I
D
= 20 A
V
DS
= 400
V
V
DS
= 250
V
10
3
5
Operation in this area limited
by
R
DS(on)
I
D
, Drain Current (A)
16
2
10
2
5
12
V
DS
= 100
V
8
10
µs
100
µs
2
10
5
4
For test circuit
see figure 13
2
1
ms
T
C
= 25
°C
T
J
= 150
°C
Single Pulse
1
2
5
10
ms
10
2
2
5
0
0
91237_06
1
40
80
120
160
200
91237_08
10
2
5
10
3
Q
G
, Total Gate Charge (nC)
V
DS
, Drain-to-Source
Voltage
(V)
Fig. 6 - Typical Gate Charge vs. Gate-to-Source Voltage
Fig. 8 - Maximum Safe Operating Area
www.vishay.com
4
Document Number: 91237
S-81360-Rev. A, 28-Jul-08
IRFP460, SiHFP460
Vishay Siliconix
R
D
V
DS
V
GS
D.U.T.
+
-
V
DD
10
V
Pulse
width
≤
1
µs
Duty factor
≤
0.1
%
20
R
G
I
D
, Drain Current (A)
16
12
Fig. 10a - Switching Time Test Circuit
8
V
DS
4
90
%
0
25
91237_09
50
75
100
125
150
10
%
V
GS
t
d(on)
t
r
t
d(off)
t
f
T
C
, Case Temperature (°C)
Fig. 9 - Maximum Drain Current vs. Case Temperature
Fig. 10b - Switching Time Waveforms
1
Thermal Response (Z
thJC
)
0
-
0.5
0.1
0.2
0.1
0.05
0.02
0.01
P
DM
Single Pulse
(Thermal Response)
t
1
t
2
Notes:
1. Duty Factor, D = t
1
/t
2
2. Peak T
j
= P
DM
x Z
thJC
+ T
C
10
-5
10
-4
10
-3
10
-2
0.1
1
10
10
-2
10
-3
91237_11
t
1
, Rectangular Pulse Duration (S)
Fig. 11a - Maximum Effective Transient Thermal Impedance, Junction-to-Case
L
Vary
t
p
to obtain
required I
AS
R
G
V
DS
t
p
V
DD
D.U.T
I
AS
10
V
t
p
0.01
Ω
I
AS
Fig. 12b - Unclamped Inductive Waveforms
V
DS
+
-
V
DD
A
V
DS
Fig. 12a - Unclamped Inductive Test Circuit
Document Number: 91237
S-81360-Rev. A, 28-Jul-08
www.vishay.com
5
Linux开发
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
