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SIS443DN-T1-GE3

产品描述漏源电压(Vdss):40V 连续漏极电流(Id)(25°C 时):35A 栅源极阈值电压:2.3V @ 250uA 漏源导通电阻:11.7mΩ @ 15A,10V 最大功率耗散(Ta=25°C):3.7W 类型:P沟道
产品类别分立半导体    晶体管   
文件大小562KB,共13页
制造商Vishay(威世)
官网地址http://www.vishay.com
标准
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SIS443DN-T1-GE3概述

漏源电压(Vdss):40V 连续漏极电流(Id)(25°C 时):35A 栅源极阈值电压:2.3V @ 250uA 漏源导通电阻:11.7mΩ @ 15A,10V 最大功率耗散(Ta=25°C):3.7W 类型:P沟道

SIS443DN-T1-GE3规格参数

参数名称属性值
是否Rohs认证符合
厂商名称Vishay(威世)
包装说明HALOGEN FREE AND ROHS COMPLIANT, LEADLESS, 1212-8, POWERPAK-8
Reach Compliance Codenot_compliant
ECCN代码EAR99
Factory Lead Time12 weeks
外壳连接DRAIN
配置SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压40 V
最大漏极电流 (ID)0.035 A
最大漏源导通电阻0.0117 Ω
FET 技术METAL-OXIDE SEMICONDUCTOR
JESD-30 代码S-PDSO-C5
JESD-609代码e3
湿度敏感等级1
元件数量1
端子数量5
工作模式ENHANCEMENT MODE
最高工作温度150 °C
最低工作温度-55 °C
封装主体材料PLASTIC/EPOXY
封装形状SQUARE
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)NOT SPECIFIED
极性/信道类型P-CHANNEL
表面贴装YES
端子面层Matte Tin (Sn) - annealed
端子形式C BEND
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
晶体管应用SWITCHING
晶体管元件材料SILICON

文档预览

下载PDF文档
SiS443DN
Vishay Siliconix
P-Channel 40 V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
V
DS
(V)
- 40
R
DS(on)
() Max.
0.0117 at V
GS
= - 10 V
0.0160 at V
GS
= - 4.5 V
I
D
(A)
- 35
d
- 35
d
Q
g
(Typ.)
41.5 nC
• TrenchFET
®
Power MOSFET
• 100% R
g
and UIS Tested
• Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
PowerPAK
®
1212-8
APPLICATIONS
Notebook Computers and Mobile
S
3.30 mm
S
1
2
3
S
S
3.30 mm
G
4
D
8
7
6
5
D
D
D
Computing
- Adaptor Switch
- Load Switch
- DC/DC Converter
- Power Management
G
Bottom View
D
P-Channel MOSFET
Ordering Information:
SiS443DN-T1-GE3 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS
(T
A
= 25 °C, unless otherwise noted)
Parameter
Drain-Source Voltage
Gate-Source Voltage
T
C
= 25 °C
T
C
= 70 °C
T
A
= 25 °C
T
A
= 70 °C
T
C
= 25 °C
T
A
= 25 °C
L = 0.1 mH
T
C
= 25 °C
T
C
= 70 °C
T
A
= 25 °C
T
A
= 70 °C
Symbol
V
DS
V
GS
Limit
- 40
± 20
- 35
d
- 35
d
- 13.3
a, b
- 10.6
a, b
- 80
- 35
d
- 3
a, b
- 20
20
52
33
3.7
a, b
2.4
a, b
- 55 to 150
260
Unit
V
Continuous Drain Current (T
J
= 150 °C)
I
D
Pulsed Drain Current (t = 300 µs)
Continuous Source-Drain Diode Current
Avalanche Current
Single-Pulse Avalanche Energy
I
DM
I
S
I
AS
E
AS
A
mJ
Maximum Power Dissipation
P
D
W
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
e, f
T
J
, T
stg
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambient
a, c
Maximum Junction-to-Case
t
10
s
Steady State
Symbol
R
thJA
R
thJC
Typical
26
1.9
Maximum
33
2.4
Unit
°C/W
Notes:
a. Surface mounted on 1" x 1" FR4 board.
b. t = 10 s.
c. Maximum under steady state conditions is 81 °C/W.
d. Package limited.
e. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
f. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 63253
S13-1708-Rev. C, 05-Aug-13
For technical questions, contact:
pmostechsupport@vishay.com
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000

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