NAND Gate 2-Element 2-IN CMOS 8-Pin VSSOP T/R
| 参数名称 | 属性值 |
| 欧盟限制某些有害物质的使用 | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| HTS | 8542.39.00.01 |
| Logic Family | LVC |
| Logic Function | NAND |
| Number of Elements per Chip | 2 |
| Number of Element Inputs | 2-IN |
| Number of Output Enables per Element | 0 |
| Number of Selection Inputs per Element | 0 |
| Number of Element Outputs | 1 |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 6@3.3V|5@5V |
| Absolute Propagation Delay Time (ns) | 16 |
| Process Technology | CMOS |
| Input Type | Schmitt Trigger |
| 输出类型 Output Type | Push-Pull |
| Maximum Low Level Output Current (mA) | 32 |
| Maximum High Level Output Current (mA) | -32 |
| Minimum Operating Supply Voltage (V) | 1.65 |
| Typical Operating Supply Voltage (V) | 5|1.8|2.5|3.3 |
| Maximum Operating Supply Voltage (V) | 5.5 |
| Maximum Quiescent Current (uA) | 10 |
| Propagation Delay Test Condition (pF) | 50 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| Supplier Temperature Grade | Commercial |
| 系列 Packaging | Tape and Reel |
| Standard Package Name | SOP |
| Pin Count | 8 |
| Supplier Package | VSSOP |
| Mounting | Surface Mount |
| Package Height | 0.8(Max) |
| Package Length | 2.1(Max) |
| Package Width | 2.4(Max) |
| PCB changed | 8 |
| Lead Shape | Gull-wing |
| SN74LVC2G132DCUR | 74LVC2G132DCUTG4 | SN74LVC2G132YEPR | |
|---|---|---|---|
| 描述 | NAND Gate 2-Element 2-IN CMOS 8-Pin VSSOP T/R | Logic Gates Dual 2-input NAND Gate | IC GATE NAND SCHMITT 2CH 8DSBGA |
| 是否Rohs认证 | - | 符合 | 不符合 |
| 厂商名称 | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 包装说明 | - | VSSOP, | VFBGA, BGA8,2X4,20 |
| Reach Compliance Code | - | compliant | not_compliant |
| Factory Lead Time | - | 6 weeks | 1 week |
| 系列 | - | LVC/LCX/Z | LVC/LCX/Z |
| JESD-30 代码 | - | R-PDSO-G8 | R-XBGA-B8 |
| 长度 | - | 2.3 mm | 1.9 mm |
| 逻辑集成电路类型 | - | NAND GATE | NAND GATE |
| 最大I（ol） | - | 0.032 A | 0.024 A |
| 功能数量 | - | 2 | 2 |
| 输入次数 | - | 2 | 2 |
| 端子数量 | - | 8 | 8 |
| 最高工作温度 | - | 125 °C | 85 °C |
| 最低工作温度 | - | -40 °C | -40 °C |
| 封装主体材料 | - | PLASTIC/EPOXY | UNSPECIFIED |
| 封装代码 | - | VSSOP | VFBGA |
| 封装形状 | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | - | 260 | NOT SPECIFIED |
| 传播延迟（tpd） | - | 17 ns | 16 ns |
| 施密特触发器 | - | YES | YES |
| 座面最大高度 | - | 0.9 mm | 0.5 mm |
| 最大供电电压 (Vsup) | - | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | - | 1.65 V | 1.65 V |
| 标称供电电压 (Vsup) | - | 1.8 V | 1.8 V |
| 表面贴装 | - | YES | YES |
| 技术 | - | CMOS | CMOS |
| 温度等级 | - | AUTOMOTIVE | INDUSTRIAL |
| 端子形式 | - | GULL WING | BALL |
| 端子节距 | - | 0.5 mm | 0.5 mm |
| 端子位置 | - | DUAL | BOTTOM |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | - | 2 mm | 0.9 mm |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
