Chip Monolithic Ceramic Capacitor for General
GRM033R60J223KE01_ (0201, X5R:EIA, 22000pF, DC6.3V)
_: packaging code
1.Scope
This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment.
Reference Sheet
2.MURATA Part NO. System
(Ex.)
GRM
03
(1)L/W
Dimensions
3
(2)T
Dimensions
R6
(3)Temperature
Characteristics
0J
(4)Rated
Voltage
223
(5)Nominal
Capacitance
K
(6)Capacitance
Tolerance
E01
(7)Murata’s Control
Code
D
(8)Packaging Code
3. Type & Dimensions
(1)-1 L
0.6±0.03
(1)-2 W
0.3±0.03
(2) T
0.3±0.03
e
0.1 to 0.2
(Unit:mm)
g
0.2 min.
4.Rated value
(3) Temperature Characteristics
(Public STD Code):X5R(EIA)
Temp. coeff
Temp. Range
or Cap. Change
(Ref.Temp.)
(4)
Rated
Voltage
(6)
(5) Nominal
Capacitance
Capacitance
Tolerance
Specifications and Test
Methods
(Operating
Temp. Range)
-15 to 15 %
-55 to 85 °C
(25 °C)
DC 6.3 V
22000 pF
±10 %
-55 to 85 °C
5.Package
mark
D
W
J
(8) Packaging
f180mm
Reel
PAPER W8P2
f180mm
Reel
PAPER W8P1
f330mm
Reel
PAPER W8P2
Packaging Unit
15000 pcs./Reel
30000 pcs./Reel
50000 pcs./Reel
Product specifications in this catalog are as of Jul.5,2016,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
GRM033R60J223KE01-01
1
■
Specifications and Test Methods
No
1
Item
Rated Voltage
Shown in Rated value.
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
The rated voltage is defined as the maximum voltage which may be
applied continuously to the capacitor.
When AC voltage is superimposed on DC voltage, V
P-P
or V
O-P
,
whichever is larger, should be maintained within the rated voltage
range.
2
3
4
Appearance
Dimension
Voltage proof
No defects or abnormalities.
Within the specified dimensions.
No defects or abnormalities.
Visual inspection.
Using calipers. (GRM02 size is based on Microscope)
Measurement Point
Test Voltage
Applied Time
5
Insulation Resistance(I.R.)
More than 2000MΩ or 50Ω
∙
F (Whichever is smaller)
Measurement Point
Measurement Voltage
Charging Time
:Between the terminations
: 1 to 5 s
: Between the terminations
: DC Rated Voltage
: 1 min
: 250% of the rated voltage
Charge/discharge current : 50mA max.
Charge/discharge current : 50mA max.
Measurement Temperature :Room Temperature
6
7
Capacitance
Dissipation Factor (D.F.)
Shown in Rated value.
B1,R1,B3,R6,R7,C6,C7,C8,E7,D7 : 0.1 max.
D8,GRM31CR60J107 : 0.15 max
GRM31CR71E106 : 0.125
max
*Table 1
GRM033 B3/R6 1A 123 to 823
GRM033 B3/R6 1A 104
GRM155 B3/R6 1A 124 to 105
GRM185 B3/R6 1C/1A 105
GRM185 C8/D7 1A 105
GRM188 B3/R6 1C/1A 225
GRM188 R7/C8/D7 1A 225
GRM188 B3/R6 1A 335
GRM219 B3/R6 1C/1A 475
GRM219 C8 1A 475
GRM219 B3/R6 1A 106
GRM21B B3/R6 1C/1A 106
GRM21B R7/C8 1A 106
GRM319 B3/R6 1C/1A 106
Measurement Temperature :Room Temperature
Capacitance
*1 C≦10μF
(10V min.)
*2 C≦10μF
(6.3V max.)
C＞10μF
Frequency
1.0+/-0.1kHz
1.0+/-0.1kHz
120+/-24Hz
Voltage
1.0+/-0.2Vrms
0.5+/-0.1Vrms
0.5+/-0.1Vrms
*1 For items listed in Table 1 on the left, the capacitance should
be measured using a voltage of 0.5+/-0.1Vrms instead of
1.0+/-0.2Vrms.
*2 For item GRM188R70J105, the capacitance should be measured
using a voltage of 1.0+/-0.2Vrms instead of 0.5+/-0.1Vrms.
8
Temperature
Characteristics
of Capacitance
No bias
B1,B3 : Within +/-10%
R1,R7 : Within +/-15%
R6
C6
C7
C8
E7
D7
D8
: Within +/-15%
: Within +/-22%
: Within+/-22%
: Within +/-22%
: Within +22/-56%
: Within +22/-33%
: Within +22/-33%
(-25°C to +85°C)
(-55°C to +125°C)
(-55°C to +85°C)
(-55°C to +85°C)
(-55°C to +125°C)
(-55°C to +105°C)
(-55°C to +125°C)
(-55°C to +125°C)
(-55°C to +105°C)
The capacitance change should be measured after 5 min.
at each specified temp. stage.
In case of applying voltage, the capacitance change should be
measured after 1 min. with applying voltage in equilibration of
each temp. stage.
Capacitance value as a reference is the value in step 3.
· Measurement Voltage
GRM152 B3 0J 104/224, GRM155 B1 0J 124 to 334,
GRM155 B3 0J 394 to 824, GRM155 B3 1A 124 to 105,
GRM188B10G106, GRM21BB10J106
only
: 0.20+/-0.05Vrms
50% of
the rated
voltage
B1: Within +10/-30%
R1: Within +15/-40%
GRM21B R7 1A/1C 475 K/M E51, GRM219 R7 1A/1C 225
only : 0.5+/-0.1Vrms
GRM188R61H474 only : 1.5+/-0.3Vrms
Step
1
2
3
4
5
6
7
8
Temperature(C)
Reference Temp.+/-2
Min.Operating Temp. +/-3
Reference Temp. +/-2
Max.Operating Temp. +/-3
Reference Temp. +/-2
Min.Operating Temp. +/-3
Reference Temp. +/-2
Max.Operating Temp.+/-3
50% of
the rated voltage
(For B1,R1)
Applying Voltage(VDC)
No bias
½Initial
measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
9
Adhesive Strength
of Termination
No removal of the terminations or other defect
should occur.
GRM02
GRM03
GRM15/GRM18
GRM21/GRM31/GRM32
Solder the capacitor on the test substrate shown in Fig.3.
Type
Applied Force(N)
1
2
5
10
Holding Time
: 10+/-1s
capacitor side.
Applied Direction : In parallel with the test substrate and vertical with the
JEMCGS-0052AN
2
No
10 Vibration
Item
Appearance
Capacitance
D.F.
Specification
No defects or abnormalities.
Within the specified initial value.
Within the specified initial value.
Kind of Vibration
Total amplitude
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Solder the capacitor on the test substrate shown in Fig.3.
: A simple harmonic motion
10Hz to 55Hz to 10Hz (1min)
:1.5mm
This motion should be applied for a period of 2h in each 3 mutually
perpendicular directions(total of 6h).
11 Substrate
Bending test
Appearance
Capacitance
Change
No defects or abnormalities.
Within +/-10%
Solder the capacitor on the test substrate shown in Fig.1.
Pressurization method
Flexure
Holding Time
Soldering Method
: Shown in Fig.2
:
1mm
:5+/-1s
: Reflow soldering
: Solder bath method
Solution of rojin ethanol 25(wt)%
: 80℃ to 120℃ for 10s to 30s
: Sn-3.0Ag-0.5Cu
: 245+/-5℃
2+/-0.5s
: Solder bath method
: Sn-3.0Ag-0.5Cu
: 270+/-5℃
10+/-0.5s
: 24+/-2h
: GRM31 size max.: 120℃ to 150℃ for 1 min
GRM32 size : 100℃ to 120℃ for 1 min
and 170℃ to 200℃ for 1 min
· Initial measurement
12 Solderability
95% of the terminations is to be soldered evenly and
continuously.
Test Method
Flux
Preheat
Solder
Solder Temp.
Immersion time
:
<GRM03 size min.>
Test Method
Solder
Solder Temp.
Immersion time
:
Exposure Time
Preheat
13 Resistance
to
Soldering
Heat
Appearance
No defects or abnormalities.
Capacitance
Change
B1,R1,B3,R6,R7,C6,C7,C8,E7,D7,D8
:
Within +/-7.5%
GRM188B30J106M
: Within +/-12.5%
D.F.
Within the specified initial value.
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
<GRM02 size only>
Test Method
: Reflow soldering (hot plate)
: Sn-3.0Ag-0.5Cu
: 270+/-5℃
: 10+/-0.5s
: Glass epoxy PCB
: 24+/-2h
: 120℃ to 150℃ for 1 min
I.R.
Within the specified initial value.
Solder
Solder Temp.
Reflow Time
Test Substrate
Voltage proof No defects.
Exposure Time
Preheat
· Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
14 Temperature
Sudden Change
Capacitance
Change
B1,R1,B3,R6,R7,C6,C7,C8,D7,D8
E7
: Within +/-7.5%
: Within +/-30%
Appearance
No defects or abnormalities.
Solder the capacitor on the test substrate shown in Fig.3.
Perform the five cycles according to the four heat treatments
shown in the following table.
Step
1
Temp.(C)
Min.Operating Temp.+0/-3
Room Temp
Max.Operating Temp.+3/-0
Room Temp
Time
(min)
30+/-3
2 to 3
30+/-3
2 to 3
2
D.F.
Within the specified initial value.
3
4
I.R.
Within the specified initial value.
Exposure Time
· Initial measurement
: 24+/-2h
Voltage proof No defects.
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
·
GRM188B30J106M Measurement after test:
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
15
High
Temperature
High
Humidity
(Steady)
Appearance
No defects or abnormalities.
Solder the capacitor on the test substrate shown in Fig.3.
Test Temperature
Test Humidity
: 40+/-2℃
: 90%RH to 95%RH
: 500+/-12h
: DC Rated Voltage
: 24+/-2h
Capacitance
Change
D.F.
Within +/-12.5%
Test Time
Applied Voltage
Charge/discharge current : 50mA max.
0.2 max.
Exposure Time
· Initial measurement
I.R.
More than 500MΩ or 12.5Ω ∙ F (Whichever is smaller)
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
· Measurement after test
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
JEMCGS-0052AN
3
No
16 Durability
Item
Appearance
Specification
No defects or abnormalities.
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Solder the capacitor on the test substrate shown in Fig.3.
Test Temperature
: Max. Operating Temp. +/-3℃
: 1000+/-12h
: 150% of the rated voltage
: 24+/-2h
Capacitance
Change
Within +/-12.5%
Test Time
Applied Voltage
Exposure Time
Charge/discharge current : 50mA max.
D.F.
0.2 max.
· Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
I.R.
More than 1000MΩ or 25Ω ∙ F (Whichever is smaller)
· Measurement after test
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
Test method : Substrate Bending test
・Test
substrate
Material
: Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm (GRM02/GRM03/GRM15: t:0.8mm)
Copper foil thickness : 0.035mm
: Solder resist
(Coat with heat resistant resin for solder)
Type
Land
1.75±0.1
3.5±0.05
b
f4.5
a
100
GRM02
GRM03
GRM15
GRM18
GRM21
GRM31
GRM32
a
0.2
0.3
0.4
1.0
1.2
2.2
2.2
Dimension (mm)
b
*1,2：2.0±0.05
0.56
0.9
+0.1
φ1.5
-0
1.5
3.0
4.0
Ａ
5.0
5.0
Ｂ
c
4.0±0.1
0.23
＊2
＊1
0.3
0.5
1.2
1.65
2.0
2.9
40
c
c
0.05以下
8.0±0.3
t
Fig.1
・Kind
of Solder : Sn-3.0Ag-0.5Cu
・Pressurization
method
(in mm)
20
50 min.
Pressurization
speed
1.0mm/s
acitor
R5
Pressurize
45
Support
Capacitance meter
45
45
Flexure
Fig.2
(in mm)
Adhesive Strength of Termination, Vibration, Temperature Sudden Change, Resistance to Soldering Heat (Reflow method)
High Temperature High Humidity(Steady) , Durability
・Test
substrate
Material
: Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm or 0.8mm
Copper foil thickness : 0.035mm
・
Kind of Solder : Sn-3.0Ag-0.5Cu
・
Land Dimensions
Chip Capacitor
Land
Type
GRM02
GRM03
GRM15
GRM18
GRM21
GRM31
GRM32
b
a
Solder Resist
a
0.2
0.3
0.4
1.0
1.2
2.2
2.2
Dimension (mm)
b
0.56
0.9
1.5
3.0
4.0
5.0
5.0
c
0.23
0.3
0.5
1.2
1.65
2.0
2.9
c
Fig.3
JEMCGS-0052AN
4
Package
GRM Type
1.Tape Carrier Packaging(Packaging Code:D/E/W/L/J/F/K)
1.1 Minimum Quantity(pcs./reel)
Type
GRM01
GRM02
GRM03
2
3
5
2
3/X
5(LWT Dimensions Tolerance:±0.05)
15000(W8P2)
15000(W8P2) 30000(W8P1)
10000(W8P2)
20000(W8P2)
10000(W8P2)
10000(W8P2) 20000(W8P1)
10000(W8P2)
10000(W8P2)
10000(W8P2)
φ180mm reel
Paper Tape
Plastic Tape
Code:D/E
Code:W
Code:L
50000(W4P1)
40000(W4P1)
φ330mm reel
Paper Tape Plastic Tape
Code:J/ F
Code:K
50000(W8P2)
50000(W8P2)
50000(W8P2)
50000(W8P2)
50000(W8P2)
50000(W8P2)
40000(W8P2)
50000(W8P2)
GRM15
5(LWT Dimensions Tolerance:±0.1min.)
5 (LW Dimensions Tolerance:±0.1min.
and T Dimensions Tolerance:±0.05)
5(LW Dimensions Tolerance:±0.2
and T Dimensions:0.5 +0/-0.1)
GRM18
GRM21
6
9
A/B
6/9
M/X
C
9
A/M
N
C
R/D/E
M
N/R/D
E
S
M
N/C/R/D
E
F
4000
4000
4000
4000
3000
3000
3000
2000
10000
10000
10000
10000
10000
10000
10000
6000
GRM31
4000
3000
2000
2000
1000
1000
1000
500
500
1000
1000
500
300
10000
10000
8000
6000
4000
5000
4000
2000
1500
5000
4000
1500
GRM32
GRM43
GRM55
0.9±0.05
1.2 Dimensions of Tape
(1)GRM01/02 (W4P1 CODE:L)
*1,2：1.0±0.02
φ0.8±0.04
2.0±0.04
*1
*2
＊ 1,2：1.0± 0.02
(in:mm)
φ 0.8±0.04
2.0±
＊1
0.15½0.25
1.8±0.02
4.0±0.05
Ａ
Ａ
Ｂ
Ｂ
0.05以下
0.05 max.
t
Type
GRM01
GRM02
1
2
Dimensions(Chip)
L
W
T
0.25±0.013 0.125±0.013 0.125±0.013
0.4±0.02
0.2±0.02
0.2±0.02
0.4±0.05
0.2±0.05
0.2±0.05
A *3
0.145
0.23
0.26
*3 Nominal value
B *3
0.27
0.43
0.46
t
0.4 max.
0.5 max.
JEMCGP-01796E
5
FPGA/CPLD
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