Form No:
T00374-2-0000-TBM01-110500580
Specification for Approval
Date:
2019/1/10
Customer :
天誠
Halogen
Halogen-free
Pb
Pb-free
TAI-TECH
P/N:
FCM1005KF-102T03
CUSTOMER P/N:
DESCRIPTION:
QUANTITY:
pcs
REMARK:
Customer Approval Feedback
西 北 臺 慶 科 技 股 ½ 有 限 公 司
TAI-TECH Advanced Electronics Co., Ltd
代理商：
■
深圳市天誠科技有限公司
Shenzhen TsaSun Technology Co.,Ltd.
ROOM601,BLOCK F,CULTURE CREATIVE PARK,NO.4001FUQIANG ROAD
FUTIAN DISTRICT,SHENZHEN CHINA
TEL: +86-755-83358885 FAX: +86-0755-83351010
E-mail: sales@tsasun.com
Sales Dep.
APPROVED
CHECKED
□西北臺慶科技股½有限公司
TAI-TECH Advanced Electronics Co., Ltd Headquarter:
NO.1 YOU 4TH ROAD, YOUTH INDUSTRIAL DISTRICT, YANG-MEI,
TAO-YUAN HSIEN, TAIWAN, R.O.C.
TEL: +886-3-4641148 FAX: +886-3-4643565
http://www.tai-tech.com.tw
E-mail: sales@tai-tech.com.tw
蒯青榮
王歡
□臺慶精密電子(昆山)有限公司
TAI-TECH ADVANCED ELECTRONICS(KUNSHAN) CO., LTD
SHINWHA ROAD, KUNJIA HI-TECH INDUSTRIAL PARK, KUN-SHAN,
JIANG-SU, CHINA
TEL: +86-512-57619396 FAX: +86-512-57619688
E-mail: sales@tai-tech.cn
R&D Center
APPROVED
CHECKED
DRAWN
□慶邦電子元器件(泗洪)有限公司
TAIPAQ ELECTRONICS (SIHONG) CO., LTD
JIN SHA JIANG ROAD , CONOMIC DEVELOPMENT ZONE SIHONG , JIANGSU ,
CHINA.
TEL: +86-527-88601191 FAX: +86-527-88601190
E-mail: sales@taipaq.cn
鄧福興
浦冬生
王俞琴
TAKQ-E4-001
TAI-TECH
P1.
Ferrite Chip Bead(Lead Free)
1.Features
1.Monolithic inorganic material construction.
2.Closed magnetic circuit avoids crosstalk.
3.S.M.T. type.
4.Suitable for flow and reflow soldering.
5.Shapes and dimensions follow E.I.A. spec.
6.Available in various sizes.
7.Excellent solderability and heat resistance.
8.High reliability.
9.This component is compliant with RoHS legislation and also support lead-free soldering.
FCM1005KF-102T03
Halogen
Halogen-free
Pb
Pb-free
2.Dimensions
D
Chip Size
A
A
1.00±0.10
0.50±0.10
0.50±0.10
0.25±0.10
B
C
D
Units: mm
C
B
3.Part Numbering
FCM
A
1005
B
KF
C
-
102
D
T
E
03
F
A: Series
B: Dimension
C: Material
D: Impedance
E: Packaging
F: Rated Current
LxW
Lead Free Material
102=1000Ω
T=Taping and Reel, B=Bulk(Bags)
03=300mA
4.Specification
Tai-Tech
Part Number
FCM1005KF-102T03
Impedance (Ω)
1000±25%
Test Frequency
(Hz)
60mV/100M
DC Resistance
(Ω) max.
1.20
Rated Current
(mA) max.
300
Impedance-Frequency Characteristics
1500
1250
FCM1005KF-102T03
IMPEDANCE(Ohm)
1000
Z
750
500
250
R
0
1
10
100
X
1000
FREQUENCY(MHz)
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TAI-TECH
P2.
5. Reliability and Test Condition
Item
Series No.
Operating Temperature
FCB
FCM
HCB
HPB
Performance
HFB
FCA
FCI
FHI
FCH
HCI
--
Test Condition
-55~+125℃
(Including self-temperature rise)
-55~+125℃
-40~+85℃
(Including self-temperaturerise)
--
-40~+85℃
--
Storage Temperature
Impedance (Z)
Inductance (Ls)
Q Factor
DC Resistance
Rated Current
Temperature Rise Test
HP4291A, HP4287A+16092A
Refer to standard electrical characteristics list
HP4338B
**
30℃ max. (ΔT)
1. Applied the allowed DC current.
2. Temperature measured by digital surface
thermometer.
Preheat: 150℃,60sec.
Solder: Sn-Ag3.0-Cu0.5
Solder tamperature: 260±5℃
Flux for lead free: rosin
Dip time: 10±0.5sec.
Solder heat Resistance
Appearance: No significant abnormality.
Impedance change: Within
±
30%.
No mechanical damage.
Preheating Dipping Natural cooling
Remaining terminal electrode:70% min.
260°C
150°C
60
second
10±0.5
second
Preheating Dipping Natural cooling
More than 90% of the terminal
Solderability
245° C
electrode should be covered
with solder.
150° C
60
second
4±1
second
Preheat: 150
℃
,60sec.
Solder: Sn-Ag3.0-Cu0.5
Solder tamperature: 245±5℃
Flux for lead free: rosin
Dip time: 4±1sec.
For FCB FCM HCB HPB HFB
FCI FHI FCH HCI:
Size
Force (Kgf) Time(sec)
1005
0.2
1608
0.5
2012
0.6
3216
1.0
>25
3225
1.0
4516
1.0
4532
1.5
5750
2.0
For FCA:
Size
Force (Kgf) Time(sec)
3216
0.5
>25
W
The terminal electrode and the dielectric must
Terminal strength
not be damaged by the forces applied on the
right conditions.
W
20(.787)
The terminal electrode and the dielectric must
Flexture strength
Bending
45(1.772)
45(1.772)
not be damaged by the forces applied on the
right conditions.
Solder a chip on a test substrate, bend the
substrate by 2mm (0.079in)and return.
40(1.575)
100(3.937)
Size
mm(inches)
0.80(0.033)
1.40(0.055)
2.00(0.079)
2.00(0.079)
2.70(0.106)
P-Kgf
0.3
1.0
1.5
2.5
2.5
R 0.5(0.02)
Bending Strength
The ferrite should not be damaged by
Forces applied on the right condition.
1608
2012
FCA3216
3216
3225
4516
4532
5750
Appearance: Cracking, shipping and any other defects harmful to the
Random Vibration Test
characteristics should not be allowed.
Impedance: within±30%
Frequency: 10-55-10Hz for 1 min.
Amplitude: 1.52mm
Directions and times: X, Y, Z directions for 2 hours.
A period of 2 hours in each of 3 mutually
perpendicular directions (Total 6 hours).
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TAI-TECH
Item
Loading at High
Temperature
P3.
Performance
Test Condition
Temperature: 125±5℃(bead),85±5℃(inductor)
Applied current: rated current.
Duration: 1008±12hrs.
Measured at room temperature after placing
for 2 to 3hrs.
Humidity: 90~95%RH.
Temperature: 40±2℃.
Temperature: 60±2℃.(HCI)
Duration: 1008±12hrs.
Measured at room temperature after placing
for 2 to 3hrs.
For FCB FCM HCB HPB HFB FCA：
Condition for 1 cycle
Step1: -55±2℃
30±3 min.
Step2: +125±5℃ 30±3 min.
Number of cycles: 5
For FCI FHI FCH HCI：
Condition for 1 cycle
Step1: -40±2℃
30±3 min.
Step2: +85±5℃
30±3 min.
Number of cycles: 100
Measured at room temperature after placing
for 2 to 3 hrs.
Temperature: -55±2℃.
Duration: 1008±12hrs.
Measured at room temperature after placing
for 2 to 3hrs.
Appearance: no damage.
Impedance: within±30%of initial value.
Inductance: within±10%of initial value.
Q: within±30%of initial value. (FCI FHI FCH)
Q: within±20%of initial value. (HCI )
Humidity
For Bead：
Appearance: no damage.
Thermal shock
Phase
Temperature(℃) Time(min.)
30±3
Impedance: within±30%of initial value.
30±3
Inductance: within±10%of initial value.
Q: within±30%of initial value.
(FCI FHI FCH)
For Inductor：
Q: within±20%of initial value.
Phase Temperature(℃) Time(min.)
(HCI)
1
-40±2℃
2
+85±5℃
Measured: 100 times
30±3
30±3
1
-55±2℃
2
+125±5℃
Measured: 5 times
Low temperature storage
test
a: No mechanical damage
Drop
b: Impedance change:
±30%
Drop 10 times on a concrete floor from a
height of 75cm
Derating
**
Derating Curve
For the ferrite chip bead which withstanding current over 1.5A, as the
operating temperature over 85℃, the derating current information is
necessary to consider with. For the detail derating of current, please
refer to the Derated Current vs. Operating Temperature curve.
Derated Current(A)
6
5
4
3
2
1
0
6A
5A
4A
3A
2A
1.5A
1A
6.Soldering and Mounting
6-1. Recommended PC Board Pattern
Chip Size
Series
FCB
FCM
HCB
HPB
HFB
FCI
FHI
FCH
HCI
UHI
2520
3216
3225
4516
4532
5750
85
125
Operating Temperature(°C)
Land Patterns For
Reflow Soldering
0.50±0.10 0.25±0.10
0.80±0.15 0.30±0.20
0.85±0.20 0.50±0.30
1.25±0.20 0.50±0.30
1.60±0.20 0.50±0.30
1.10±0.20 0.50±0.30
1.30±0.20 0.50±0.30
1.60±0.20 0.50±0.30
1.50±0.20 0.50±0.30
1.80±0.20 0.50±0.30
3.90
4.40
4.40
5.70
5.90
8.00
1.50
2.20
2.20
2.70
2.57
4.00
1.50
1.40
3.40
1.40
4.22
5.80
2.10
2.60
3.00
0.50
0.60
1.00
0.55
0.80
1.00
2.2-2.6
0.8
FCA3216
2.8
Land
Solder Resist
Type
1005
1608
2012
A(mm) B(mm) C(mm) D(mm) L(mm) G(mm) H(mm)
1.0±0.10
1.6±0.15
2.0±0.20
2.0±0.20
2.5±0.20
3.2±0.20
3.2±0.20
4.5±0.20
4.5±0.20
5.7±0.20
0.50±0.10
0.80±0.15
1.25±0.20
1.25±0.20
2.00±0.20
1.60±0.20
2.50±0.20
1.60±0.20
3.20±0.20
5.00±0.30
0.8
Pitch
0.4
L
PC board should be designed so that products are not sufficient under
mechanical stress as warping the board.
Products shall be positioned in the sideway direction against the mechanical
stress to prevent failure.
G
6-2. Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all
wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot
air soldering tools.
H
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TAI-TECH
6-2.1 Lead Free Solder re-flow:
Recommended temperature profiles for lead free re-flow soldering in Figure 1.
P4.
6-2.2 Solder Wave:
Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature
seen by the circuit when immersed in the molten solder wave , Due to the risk of thermal damage to products, wave
soldering of large size products is discouraged. Recommended temperature profile for wave soldering is shown in Figure
2.
6-2.3 Soldering Iron(Figure 3):
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a
soldering iron must be employed the following precautions are recommended.
Note：•Preheat circuit and products to 150℃
•350℃
tip temperature for Ferrite chip bead (max)
Reflow Soldering
PRE-HEATING
SOLDERING
•Never
contact the ceramic with the iron tip
•1.0mm
tip diameter (max)
•Use
a 20 watt soldering iron with tip diameter of 1.0mm
•Limit
soldering time to 3 sec.
PRE-HEATING
SOLDERING
20~40s
TEMPERATURE(°C)
TP(260° C / 10s max.)
NATURAL
COOLING
NATURAL
COOLING
PRE-HEATING
SOLDERING
NATURAL
COOLING
3s(max.)
260
350
10s(max.)
TEMPERATURE C
0
245
TEMPERATURE C
217
200
150
60~150s
60~180s
150
0
330
150
480s max.
25
TIME( sec.)
Over 2 min.
Within 10 sec.
Gradual Cooling
Over 1 min.
Gradual Cooling
Figure 1. Re-flow Soldering(Lead Free)
Figure 2. Wave Soldering
Figure 3. Hand Soldering
6-2.4 Solder Volume:
Accordingly increasing the solder volume, the mechanical stress to
product is also increased. Exceeding solder volume may cause the
failure of mechanical or electrical performance. Solder shall be used
not to be exceed as shown in right side:
Upper limit
Recommendable
t
7.Packaging Information
7-1. Reel Dimension
A
.5
±0
.5
2±0.5
D
B
0
R1
C
R1
.9
13
.5
Type
7”x8mm
7”x12mm
A(mm)
9.0±0.5
13.5±0.5
B(mm)
60±2
60±2
C(mm)
13.5±0.5
13.5±0.5
D(mm)
178±2
178±2
R0.
5
120°
7"x8mm
7"x12mm
7-2.1 Tape Dimension / 8mm
■
Material of taping is paper
P
2
:2±0.1
E:1.75±0.1
P
0
:4±0.1
5
.0
-0
.1
0
6+
.5
:1
D
W:8.0±0.1
t
Series
FCB.FCM.HCB
HPB.HFB.FCI
FHI.FCH.HCI
Size
100505
160808
201209
Bo(mm) Ao(mm) Ko(mm) P(mm)
1.12±0.03 0.62±0.03 0.60±0.03
1.85±0.05 1.05±0.05 0.95±0.05
2.30±0.05 1.50±0.05 0.95±0.05
2.0±0.10
4.0±0.10
4.0±0.10
t(mm)
0.60±0.03
0.95±0.05
0.95±0.05
D1(mm)
none
none
none
F:3.5±0.1
P
A0
B0
Ko
■
Material of taping is plastic
P
2
:2±0.05
E:1.75±0.1
Po:4±0.1
.1
+0
.5
1
D:
t
A
Series
FCB,FCM
Size
160808
201209
201212
321611
322513
321609
Bo(mm) Ao(mm) Ko(mm)
1.95±0.10 1.05±0.10 1.05±0.10
2.25±0.10 1.42±0.10 1.04±0.10
2.35±0.10 1.50±0.10 1.45±0.10
3.50±0.10 1.88±0.10 1.27±0.10
3.42±0.10 2.77±0.10 1.55±0.10
3.40±0.10 1.77±0.10 1.04±0.10
P(mm)
4.0±0.10
4.0±0.10
4.0±0.10
4.0±0.10
4.0±0.10
4.0±0.10
t(mm)
0.23±0.05
0.22±0.05
0.22±0.05
0.22±0.05
0.22±0.05
0.22±0.05
D1(mm)
none
1.0±0.10
1.0±0.10
1.0±0.10
1.0±0.10
1.0±0.10
W:8.0±0.1
HCB,HPB
Bo
HFB.FCI
FHI.FCH
F:3.5±0.05
±
:1
D1
P
A
Ao
Ko
HCI
SECTION A-A
1
0.
FCA
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