SMW3225S102HTE
PACKING DIMENSIONS (mm)
A
Epoxy
B
3225
C
D
Dimensions
3.2 ± 0.2
2.5 ± 0.2
2.2 ± 0.2
0.2 ± 0.1
0.80 Typ
0.65 Typ
Termination
Wires
E
A
B
C
D
E
F
E
F
F
EXPLANATION OF PART NUMBERS
1
2
3
4
5
6
7
8
9
10
11
12
S
W
(1)
M
3
2
(2)
2
5
S
1
0
(3)
2
H
(1) Product name
(2) Shapes and dimensions
(3) Impedance【 at 100MHz】
102:1000
Ω
ELECTRICAL CHARACTERISTICS
Z(Ω)
Impedance
at 100MHz
SMW3225S102HTE
1000
Operating temperature : -25 to +85℃
P/N
Common Mode
DCR (Ω)
[ Max ]
0.35
Rated
current
Idc(A)
[ Max ]
1.2
Rated
Voltage
Vdc
(V)Typical
50
Insulation
Resistance
IR
(MΩ)Min.
10
Storage temp. and humidity : -40 to +85℃ ,70%RH max
Typical Heat Rating DC Current would cause an approximately △T of 40℃
Recommended Footprint(mm)
3.7
0.75
2.55
0.9
1.9
Rev.01
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SMW3225S102HTE
Test Equipment
Impedance
Measured by using Agilent 4291A RF Impedance Analyzer.
Measurement terminal
①
②
④
③
DC Resistance
Measurement terminal
Measured by using Chroma 16502 mill ohm meter.
Measurement terminal
①
②
④
③
Measurement terminal
Insulation Resistance
Measured by using Chroma 19073
Measurement voltage : 50v ,Measurement time : 60 sec.
Measurement terminal
①
②
④
③
Rev.01
Page 3 of 5
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SMW3225S102HTE
RECOMMENDED SOLDERING TEMP. GRAPH
Preheat 100sec. Max.
255℃
℃
200℃
℃
Natural cooling
150℃
℃
60sec. Min.
20sec.
10sec. Max.
MECHANICAL RELIABILITY
TEST
Solderability
Specification & Requirement
The surface of terminal/pin tested shall
be covered with new solder by 90%
Method Used
Solder heat proof:
Preheating: 150 ±10℃ 60 seconds
Soldering: 245 ±5℃ for 4 ±1 sec
Components should have not evidence of
Preheating:150℃ 60secs
Solder temperature: 260±5℃
Flux:rosin
Dip time:10±0.5 secs
Solder Heat
Resistance
electrical and mechannical damage
Impedance:within ±15% of initial value
Series No.
1608
F（Kg）
0.5
0.5
1.0
1.0
Solder a chip to test substrate and then
laterally apply a force in the arrow direction
Terminal strength
2012
3216
3225
φ1.0
Test Board
ENDURANCE RELIABILITY
TEST
Specification & Requirement
Impedance change within ± 15% Without
Method Used
-65℃,
(30 mins) -> room temp. (2 mins) ->
125℃,
(30 mins) -> room temp. (2 mins)
50 cycles
Thermal Shock
mechanical damage
Humidity
Resistance
Low Temp.
Storing
High Temp.
Storing
Impedance change within ± 15% Without
mechanical damage
Apply IDC current @ 60℃ ambient
Humidity: 90％
Duration: 168 hrs
Storing Temp.
-40 ±2
℃
for total 168 +5/-0 hours
Storing Temp.
125 ±2
℃
for total 168 +5/-0 hours
Impedance change within ± 15% Without
mechanical damage
Impedance change within ± 15% Without
mechanical damage
Rev.01
Page 4 of 5
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