PLA192
I
NTEGRATED
C
IRCUITS
D
IVISION
Parameters
Blocking Voltage
Load Current
On-Resistance (max)
LED Current to Operate
Ratings
600
150
22
5
Units
V
P
mA
rms
/ mA
DC
mA
Single Pole, Normally Open
OptoMOS
®
Relay
Description
IXYS Integrated Circuits' PLA192 is a single-pole,
normally open (1-Form-A) solid state relay that
provides 5000V
rms
of input to output isolation.
In addition to all the features and benefits of the
PLA192, the PLA192E meets the partial discharge
demands of DIN EN 60747-5-5 (previously VDE
0884).
All versions of the PLA192 can be used to replace
mechanical relays, while offering the superior
reliability associated with semiconductor devices.
Optically coupled outputs that use the patented
OptoMOS architecture are controlled by a highly
efficient infrared LED. Because they have no moving
parts, they offer bounce-free switching in more
compact surface mount or thru-hole packages.
Features
•
PLA192E is 100% Tested for Partial Discharge:
DIN EN 60747-5-5
•
5000V
rms
Input/Output Isolation
•
Low Drive Power Requirements
•
High Reliability
•
Arc-Free With No Snubbing Circuits
•
No EMI/RFI Generation
•
Small 6-Pin Package
•
Flammability Rating UL 94 V-0
Applications
•
•
•
•
•
•
•
•
•
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Meters (Watt-Hour, Water, Gas)
Medical Equipment: Patient/Equipment Isolation
Aerospace
Industrial Controls
Approvals
•
UL Recognized Component: File E76270
•
CSA Certified Component: Certificate 1175739
•
DIN EN 60747-5-5 Certified ("E" Suffix Only)
VDE Certificate 40036603
•
EN/IEC 60950-1 Certified Component:
Certificate available on our website
Ordering Information
Part #
PLA192E
PLA192ES
PLA192ESTR
PLA192
PLA192S
PLA192STR
Description
6-Pin DIP (50/Tube)
6-Pin Surface Mount (50/Tube)
6-Pin Surface Mount (1000/Reel)
6-Pin DIP (50/Tube)
6-Pin Surface Mount (50/Tube)
6-Pin Surface Mount (1000/Reel)
Switching Characteristics of
Normally Open Devices
Pin Configuration
AC/DC Configuration
+ Control
- Control
Do Not Use
1
2
3
6
5
4
Load
Do Not Use
Load
DC Only Configuration
+ Control
- Control
Do Not Use
1
2
3
6
5
4
+ Load
- Load
Form-A
I
F
90%
I
LOAD
t
on
10%
t
off
DS-PLA192-R08
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NTEGRATED
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IVISION
Absolute Maximum Ratings @ 25ºC (Unless Otherwise Noted)
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
1
Total Package Dissipation
2
Isolation Voltage, Input to Output
(60 Seconds)
ESD Rating, Human Body Model
Operational Temperature
Storage Temperature
1
2
PLA192
Rating
600
5
50
1
150
800
5000
4
-40 to +85
-40 to +125
Units
V
P
V
mA
A
mW
mW
V
rms
kV
ºC
ºC
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
Typical values are characteristic of the device at +25°C, and
are the result of engineering evaluations. They are provided for
information purposes only, and are not part of the manufacturing
testing requirements.
Derate linearly 1.33 mW / ºC
Derate linearly 6.67 mW / ºC
Electrical Characteristics @ 25ºC (Unless Otherwise Noted)
Parameters
Output Characteristics
Load Current
Continuous, AC/DC Configuration
Continuous, DC-Only Configuration
Peak
On-Resistance
AC/DC Configuration
DC-Only Configuration
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
Conditions
Symbol
Min
Typ
Max
Units
-
-
t=10ms
I
L
=150mA
I
L
=220mA
V
L
=600V
P
I
F
=5mA, V
L
=10V
I
F
=0mA, V
L
=50V, f=1MHz
I
L
=100mA
-
I
F
=5mA
V
R
=5V
V
IO
=0V, f=1MHz
I
L
I
LPK
R
ON
I
LEAK
t
on
t
off
C
OUT
I
F
I
F
V
F
I
R
C
IO
-
-
-
-
-
-
-
-
-
-
0.1
0.9
-
-
-
-
-
13.3
4.15
-
-
-
10
0.22
0.21
1.2
-
3
150
220
±400
22
8
1
5
5
-
5
-
1.5
10
-
mA
rms
/ mA
DC
mA
DC
mA
P
A
ms
pF
mA
mA
V
A
pF
PLA192E Safety and Insulation Ratings
Parameters
Pollution Degree 2 according to DIN VDE 0109
Highest Allowable Over-Voltage
Maximum Working Insulation Voltage
Partial Discharge Test Voltage
Isolation Test Voltage
Creepage Distance
Clearance Distance
Conditions
-
Transient Voltage
Recurring Voltage
Symbol
-
V
IOTM
V
IORM
V
PR
V
ISO
-
-
Min
-
7071
1000
-
-
7.6
7.6
Max
-
-
-
1875
5000
-
-
Units
-
V
P
V
P
V
P
V
rms
mm
mm
DIN EN 60747-5-5
Method B
-
-
-
2
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IVISION
PERFORMANCE DATA*
Typical LED Forward Voltage Drop
(N=50, I
F
=5mA)
35
30
Device Count (N)
Device Count (N)
25
20
15
10
5
0
1.25
1.26
1.27
1.28
1.29
LED Forward Voltage Drop (V)
1.6
1.7
1.8
1.9
2.0
Turn-On Time (ms)
2.1
PLA192
Typical Turn-On Time
(N=50, I
F
=5mA, I
L
=100mA
DC
)
35
30
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, I
F
=5mA, I
L
=100mA
DC
)
35
30
Device Count (N)
25
20
15
10
5
0
0.23
0.26
0.29
0.32
0.35
Turn-Off Time (ms)
0.38
30
25
Device Count (N)
Typical I
F
for Switch Operation
(N=50, I
L
=100mA)
40
35
Device Count (N)
Typical On-Resistance Distribution
(N=50, I
F
=5mA, I
L
=150mA)
30
25
Device Count (N)
20
15
10
5
0
DC-Only On-Resistance Distribution
(N=50, I
F
=5mA, I
L
=220mA)
30
25
20
15
10
5
0
20
15
10
5
0
0.20
0.21
0.22 0.23 0.24
LED Current (mA)
0.25
0.26
13.1
13.2
13.3
13.4
13.5
On-Resistance ( )
13.6
4.05
4.10
4.15
4.20
4.25
On-Resistance ( )
4.30
Typical Blocking Voltage Distribution
(N=50)
30
25
Device Count (N)
20
15
10
5
0
700
710
720
730
740
Blocking Voltage (V
P
)
750
Typical LED Forward Voltage Drop
vs. Temperature
LED Forward Voltage Drop (V)
1.6
1.5
1.4
1.3
1.2
1.1
1.0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
I
F
=50mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
4500
4000
Turn-On Time ( s)
3000
2500
2000
1500
1000
500
0
0
3500
Typical Turn-On Time
vs. LED Forward Current
(I
L
=100mA)
361
360
Turn-Off Time ( s)
359
358
357
356
355
Typical Turn-Off Time
vs. LED Forward Current
(I
L
=100mA)
10
20
30
LED Current (mA)
40
50
0
10
20
30
40
Forward Current (mA)
50
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
R08
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NTEGRATED
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IVISION
PERFORMANCE DATA*
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=100mA)
Typical Turn-On Time
vs. Temperature
(I
L
=100mA)
Turn-Off Time ( s)
I
F
=2mA
PLA192
LED Current to Operate (mA)
0.30
0.28
4500
4000
Turn-On Time ( s)
3500
3000
2500
2000
1500
1000
500
450
400
350
300
250
200
Typical Turn-Off Time
vs. Temperature
(I
L
=100mA)
I
F
=10mA
I
F
=5mA
I
F
=2mA
0.26
0.24
0.22
0.20
0.18
0.16
-40
-20
0
20
40
60
Temperature (ºC)
80
100
I
F
=5mA
I
F
=10mA
500
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
18
On-Resistance ( )
16
14
12
10
8
-40
Typical AC/DC On-Resistance
vs. Temperature
(I
F
=5mA, I
L
=150mA)
7
6
On-Resistance ( )
5
4
3
2
1
-40
Typical DC-Only On-Resistance
vs. Temperature
(I
F
=5mA, I
L
=220mA)
Load Current (mA)
250
Maximum Load Current
vs. Temperature
(I
F
=5mA)
DC-Only Configuration
200
AC/DC Configuration
150
100
50
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-20
0
20
40
60
Temperature (ºC)
80
100
0.15
0.10
Current (A)
Typical Load Current vs. Load Voltage
AC/DC Configuration
(I
F
=5mA)
0.25
0.20
Current (A)
0.15
0.10
0.05
0.00
Typical Load Current vs. Load Voltage
DC-Only Configuration
(I
F
=5mA)
Blocking Voltage (V
P
)
Typical Blocking Voltage
vs. Temperature
770
760
750
740
730
720
710
700
-40
-20
0
20
40
60
Temperature (ºC)
80
100
0.05
0.00
-0.05
-0.10
-0.15
-3
-2
-1
0
1
Voltage (V)
2
3
0.0
0.2
0.4
0.6
0.8
Voltage (V)
1.0
1.2
0.06
0.05
Leakage ( A)
0.04
0.03
0.02
0.01
0
-40
Typical Leakage vs. Temperature
Measured across Pins 4&6
(V
L
=600V)
180
Output Capacitance (pF)
160
140
120
100
80
60
40
20
0
0.1
Output Capacitance
vs. Load Voltage
(I
F
=0mA, f=1MHz)
1.2
1.0
Load Current (A)
0.8
0.6
0.4
0.2
Energy Rating Curve
(I
F
=5mA)
-20
0
20
40
60
Temperature º(C)
80
100
1
10
100
Load Voltage (V)
1000
0
10 s 100 s 1ms 10ms 100ms
Time
1s
10s
100s
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
4
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IVISION
Manufacturing Information
Moisture Sensitivity
PLA192
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of
the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product evaluation. We test all of
our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices
when handled according to the limitations and information in that standard as well as to any limitations set forth in the
information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
PLA192, PLA192S, PLA192E, PLA192ES
Moisture Sensitivity Level (MSL) Classification
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (T
C
) of this product and the maximum dwell time the
body temperature of this device may be (T
C
- 5)ºC or greater. The classification temperature sets the Maximum
Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other
processes, the guidelines of
J-STD-020
must be observed.
Device
PLA192, PLA192E
PLA192S, PLA192ES
Classification Temperature (T
c
)
250ºC
250ºC
Dwell Time (t
p
)
30 seconds
30 seconds
Max Reflow Cycles
1
3
Board Wash
IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux
residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage
to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow
up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the
variability of the wash parameters used to clean the board, determination of the bake temperature and duration
necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning
or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the
device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
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