CEP20A03/CEB20A03
N-Channel Enhancement Mode Field Effect Transistor
FEATURES
30V, 197A, R
DS(ON)
= 2 mΩ @V
GS
= 10V.
R
DS(ON)
= 3 mΩ @V
GS
= 4.5V.
Super high dense cell design for extremely low R
DS(ON)
.
High power and current handing capability.
Lead-free plating ; RoHS compliant.
TO-220 & TO-263 package.
D
PRELIMINARY
D
G
S
CEB SERIES
TO-263(DD-PAK)
G
G
D
S
CEP SERIES
TO-220
S
ABSOLUTE MAXIMUM RATINGS
Parameter
Drain-Source Voltage
Gate-Source Voltage
Drain Current-Continuous @ T
C
= 25 C
@ T
C
= 100 C
Drain Current-Pulsed
a
Tc = 25 C unless otherwise noted
Symbol
Limit
V
DS
V
GS
I
D
I
DM
P
D
E
AS
I
AS
T
J
,T
stg
30
Units
V
V
A
A
A
W
W/ C
mJ
A
C
±
20
197
124
788
139
1.1
800
40
-55 to 150
Maximum Power Dissipation @ T
C
= 25 C
- Derate above 25 C
Single Pulsed Avalanche Energy
d
Single Pulsed Avalanche Current
d
Operating and Store Temperature Range
Thermal Characteristics
Parameter
Thermal Resistance, Junction-to-Case
Thermal Resistance, Junction-to-Ambient
Symbol
R
θJC
R
θJA
Limit
0.9
62.5
Units
C/W
C/W
This is preliminary information on a new product in development now .
Details are subject to change without notice .
1
Rev 1. 2012.Jun
http://www.cet-mos.com
CEP20A03/CEB20A03
Electrical Characteristics
Parameter
Off Characteristics
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate Body Leakage Current, Forward
Gate Body Leakage Current, Reverse
On Characteristics
Static Drain-Source
On-Resistance
Gate input resistance
Dynamic Characteristics
c
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Switching Characteristics
c
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Drain-Source Diode Forward Current
Drain-Source Diode Forward Voltage
b
b
Tc = 25 C unless otherwise noted
Symbol
BV
DSS
I
DSS
I
GSSF
I
GSSR
V
GS(th)
R
DS(on)
R
g
C
iss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
Q
g
Q
gs
Q
gd
I
S
V
SD
V
GS
= 0V, I
S
= 30A
V
DS
= 15V, I
D
= 50A,
V
GS
= 4.5V
V
DD
= 15V, I
D
= 15A,
V
GS
= 4.5V, R
GEN
= 1Ω
Test Condition
V
GS
= 0V, I
D
= 250µA
V
DS
= 30V, V
GS
= 0V
V
GS
= 20V, V
DS
= 0V
V
GS
= -20V, V
DS
= 0V
V
GS
= V
DS
, I
D
= 250µA
V
GS
= 10V, I
D
= 30A
V
GS
= 4.5V, I
D
= 30A
f=1MHz,open Drain
1
1.6
2
2
Min
30
1
100
-100
3
2
3
Typ
Max
Units
V
µA
nA
nA
V
mΩ
mΩ
Ω
pF
pF
pF
Gate Threshold Voltage
V
DS
= 15V, V
GS
= 0V,
f = 1.0 MHz
7950
1055
740
41
32
92
30
96
24
39
115
1.2
82
64
184
60
125
ns
ns
ns
ns
nC
nC
nC
A
V
Drain-Source Diode Characteristics and Maximun Ratings
Notes :
a.Repetitive Rating : Pulse width limited by maximum junction temperature
b.Pulse Test : Pulse Width < 300µs, Duty Cycle < 2%.
c.Guaranteed by design, not subject to production testing.
d.L = 1mH, I
AS
= 40A, V
DD
= 24V, R
G
= 25Ω, Starting T
J
= 25 C
2
CEP20A03/CEB20A03
125
100
75
V
GS
=10,8,6,4V
300
240
180
120
25 C
60 T =125 C
J
0
-55 C
3
4.5
6
7.5
I
D
, Drain Current (A)
V
GS
=3V
50
25
0
0
2
4
6
8
10
I
D
, Drain Current (A)
0
1.5
V
DS
, Drain-to-Source Voltage (V)
Figure 1. Output Characteristics
9000
7500
6000
4500
3000
1500
0
Coss
Crss
0
3
6
9
12
15
Ciss
2.2
1.9
1.6
1.3
1.0
0.7
0.4
-100
V
GS
, Gate-to-Source Voltage (V)
Figure 2. Transfer Characteristics
I
D
=30A
V
GS
=10V
R
DS(ON),
Normalized
R
DS(ON)
, On-Resistance(Ohms)
C, Capacitance (pF)
-50
0
50
100
150
200
V
DS
, Drain-to-Source Voltage (V)
Figure 3. Capacitance
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
-50
V
DS
=V
GS
T
J
, Junction Temperature( C)
Figure 4. On-Resistance Variation
with Temperature
V
GS
=0V
10
2
V
TH
, Normalized
Gate-Source Threshold Voltage
I
S
, Source-drain current (A)
I
D
=250µA
10
1
10
-25
0
25
50
75
100
125
150
0
0.4
0.6
0.8
1.0
1.2
1.4
T
J
, Junction Temperature( C)
Figure 5. Gate Threshold Variation
with Temperature
V
SD
, Body Diode Forward Voltage (V)
Figure 6. Body Diode Forward Voltage
Variation with Source Current
3
CEP20A03/CEB20A03
V
GS
, Gate to Source Voltage (V)
5
4
3
2
1
0
V
DS
=15V
I
D
=50A
10
3
R
DS(ON)
Limit
100ms
I
D
, Drain Current (A)
10
2
1ms
10ms
DC
10
1
0
20
40
60
80
100
10
0
T
C
=25 C
T
J
=150 C
Single Pulse
10
-1
10
0
10
1
10
2
Qg, Total Gate Charge (nC)
Figure 7. Gate Charge
V
DD
t
on
V
IN
V
GS
R
GEN
G
R
L
D
V
OUT
t
d(on)
V
OUT
10%
V
DS
, Drain-Source Voltage (V)
Figure 8. Maximum Safe
Operating Area
t
off
t
r
90%
t
d(off)
90%
10%
t
f
INVERTED
90%
S
V
IN
50%
10%
50%
PULSE WIDTH
Figure 9. Switching Test Circuit
Figure 10. Switching Waveforms
r(t),Normalized Effective
Transient Thermal Impedance
10
0
D=0.5
0.2
10
-1
0.1
0.05
0.02
0.01
Single Pulse
P
DM
t
1
t
2
10
-2
1. R
θJC
(t)=r (t) * R
θJC
2. R
θJC
=See Datasheet
3. T
JM-
T
C
= P* R
θJC
(t)
4. Duty Cycle, D=t1/t2
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
Square Wave Pulse Duration (sec)
Figure 11. Normalized Thermal Transient Impedance Curve
4
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