LSB60R066GF
LonFET
Lonten N-channel 600V, 54A, 0.066Ω LonFET
TM
Power MOSFET
Description
LonFET
TM
Product Summary
V
DS
@ T
j,max
R
DS(on),max
I
DM
Q
g,typ
650V
0.066Ω
135A
87nC
The resulting
Power MOSFET is fabricated using
advanced super junction technology.
device has extremely low on resistance, making it
especially suitable for applications which require
superior power density and outstanding efficiency.
Features
Ultra low R
DS(on)
Ultra low gate charge (typ. Q
g
= 87nC)
100% UIS tested
RoHS compliant
G
TO-247
D
Applications
Power faction correction (PFC).
Switched mode power supplies (SMPS).
Uninterruptible power supply (UPS).
S
N-Channel MOSFET
Pb
Absolute Maximum Ratings
Parameter
Drain-Source Voltage
Continuous drain current
( T
C
= 25° )
C
( T
C
= 100° )
C
Pulsed drain current
1)
Gate-Source voltage
Avalanche energy, single pulse
2)
Power Dissipation
TO-247 ( T
C
= 25° )
C
P
D
- Derate above 25°
C
Operating and Storage Temperature Range
Continuous diode forward current
Diode pulse current
T
J
, T
STG
I
S
I
S,pulse
2.32
-55 to +150
54
135
W/°
C
°
C
A
A
I
DM
V
GSS
E
AS
V
DSS
I
D
Symbol
Value
600
54
30
135
±30
1200
290
Unit
V
A
A
A
V
mJ
W
Thermal Characteristics TO-247
Parameter
Thermal Resistance, Junction-to-Case
Thermal Resistance, Junction-to-Ambient
Soldering temperature, wavesoldering only allowed
T
sold
at leads. (1.6mm from case for 10s)
260
°
C
R
θJC
R
θJA
Symbol
Value
0.43
60
Unit
°
C/W
°
C/W
Version 2.0
2018
1
www.lonten.cc
LSB60R066GF
LonFET
Package Marking and Ordering Information
Device
LSB60R066GF
Device Package
TO-247
Marking
LSB60R066GF
Units/Tube
30
Units/Real
Electrical Characteristics
Parameter
Static characteristics
Drain-source breakdown voltage
Gate threshold voltage
Drain cut-off current
T
c
= 25° unless otherwise noted
C
Symbol
Test Condition
Min.
Typ.
Max.
Unit
BV
DSS
V
GS(th)
I
DSS
V
GS
=0 V, I
D
=0.25 mA
V
DS
=V
GS
, I
D
=0.25mA
V
DS
=600 V, V
GS
=0 V,
T
j
= 25°
C
T
j
= 125°
C
600
2
-
3
-
4
V
V
μA
-
-
-
-
-
-
-
-
10
-
-
1
-
50
-50
nA
nA
Gate leakage current, Forward
Gate leakage current, Reverse
Drain-source on-state resistance
I
GSSF
I
GSSR
R
DS(on)
V
GS
=30 V, V
DS
=0 V
V
GS
=-30 V, V
DS
=0 V
V
GS
=10 V, I
D
=27 A
T
j
= 25°
C
T
j
= 150°
C
0.060
0.13
0.0660
-
Ω
Dynamic characteristics
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
Turn-off delay time
Fall time
C
iss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
V
DD
= 400V, I
D
= 27A
R
G
= 10Ω, V
GS
=10V
V
DS
= 25 V, V
GS
= 0 V,
f = 1 MHz
-
-
-
-
-
-
-
4677
2556
30
29.0
12.8
191.6
13.6
-
-
-
-
-
-
-
ns
pF
Gate charge characteristics
Gate to source charge
Gate to drain charge
Gate charge total
Gate plateau voltage
Q
gs
Q
gd
Q
g
V
plateau
V
DD
=480 V, I
D
=27A,
V
GS
=0 to 10 V
-
-
-
-
24
31.24
87
5.5
-
-
-
-
V
nC
Reverse diode characteristics
Diode forward voltage
Reverse recovery time
Reverse recovery charge
Peak reverse recovery current
V
SD
t
rr
Q
rr
I
rrm
V
GS
=0 V, I
F
=27A
V
R
=50 V, I
F
=47A,
dI
F
/dt=100 A/μs
-
-
-
-
1.0
234
1.65
12.9
-
-
-
-
V
ns
μC
A
Notes:
1. Limited by maximum junction temperature, maximum duty cycle is 0.75.
2. I
AS
= 8A, V
DD
=60V, Starting T
j
= 25°
C.
Version 2.0
2018
2
www.lonten.cc
LSB60R066GF
LonFET
Electrical Characteristics Diagrams
Figure 1. On-Region Characteristics
Figure 2. Transfer Characteristics
Common Source
T
c
= 25°C
Pulse test
V
GS
=10V
V
GS
=7V
Common Source
T
c
= 25°C
V
DS
=20 V
Pulse test
Drain current I
D
(A)
V
GS
=6.5V
V
GS
=6V
V
GS
=5.5V
Drain−source voltage V
DS
(V)
Drain current I
D
(A)
Gate−source voltage V
GS
(V)
Figure 3. On-Resistance Variation vs. Drain Current
Figure 4. Threshold Voltage vs. Temperature
V
GS
= 10V
T
c
= 25°C
Pulse test
V
th
, (Normalized)
Gate threshold voltage
R
DS (on)
(Ω)
I
DS
=0.25 mA
Pulse test
Drain current I
D
(A)
Junction temperature T
j
(°C)
Figure 5. Breakdown Voltage vs. Temperature
Figure 6. On-Resistance vs. Temperature
BV
DSS
, (Normalized)
Drain-Source Breakdown Voltage
V
GS
=0 V
I
DS
=0.25 mA
Pulse test
R
DS(on)
, (Normalized)
Drain-Source On-Resistance
V
GS
=10 V
I
DS
=23.5 A
Pulse test
Junction temperature T
j
(°C)
Junction temperature T
j
(°C)
Version 2.0
2018
3
www.lonten.cc
LSB60R066GF
LonFET
Figure 7. Capacitance Characteristics
Figure 8. Gate Charge Characterist
Capacitance (pF)
C
iss
= C
gs
+ C
gd
(C
ds
= shorted)
C
oss
= C
ds
+ C
gd
C
rss
= C
gd
C
iss
C
oss
Gate-Source Voltage V
GS
(V)
Notes:
f = 1 MHz
V
GS
=0 V
C
rss
I
D
= 23.5 A
Drain-Source Voltage V
DS
(V)
Total Gate Charge Q
G
(nC)
Figure 9. Maximum Safe Operating Area
Figure 10. Power Dissipation vs. Temperature
Limited by R
DS(o
10us
100us
1ms
DC
Notes:
T
c
= 25°C
T
j
= 150°C
Single Pulse
Drain-Source Voltage V
DS
(V)
Drain power dissipation P
D
(W)
Drain current I
D
(A)
Case temperature T
c
(°C)
Figure 11. Transient Thermal Response Curve
In descending order
D= 0.5, 0.2, 0.1, 0.05, 0.02, 0.01, single pulse
Normalized Transient
Thermal Resistance
P
DM
t
Z
Duty = t/T
T
Z (t)=0.43°C/W Max.
θJC
θJC
Pulse Width t (s)
Version 2.0
2018
4
www.lonten.cc
LSB60R066GF
LonFET
Gate Charge Test Circuit & Waveform
Switching Test Circuit & Waveforms
Unclamped Inductive Switching Test Circuit & Waveforms
Version 2.0
2018
5
www.lonten.cc
stm32/stm8
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