Jk-mSMD 1812 Series Surface Mount PTC Devices
Performance Specification
Maximum
Model
V
max
(V dc)
JK-mSMD 010SF
JK-mSMD 014SF
JK-mSMD 020SF
JK-mSMD 030SF
JK-mSMD 050SF
JK-mSMD 050SF/33V
JK-mSMD 050SF/60V
JK-mSMD 075SF
JK-mSMD 110SF
JK-mSMD 110SF/16V
JK-mSMD 125SF
JK-mSMD 150SF
JK-mSMD 150SF/16V
JK-mSMD 150SF/24V
JK-mSMD R160SF
JK-mSMD 200SF
JK-mSMD 260SF
JK-mSMD 300SF
JK-mSMD 350SF
V max
I max
I hold
I trip
Pd
R1max
30.0
60.0
30.0
30.0
15.0
33.0
60.0
13.2
8.0
16.0
16.0
8.0
16.0
24.0
8.0
8.0
8.0
8.0
6.0
I
max
(A)
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
I
hold
@25°C
(A)
0.10
0.14
0.20
0.30
0.50
0.50
0.50
0.75
1.10
1.10
1.25
1.50
1.50
1.50
1.60
2.00
2.60
3.00
3.50
I
trip
@25°C
(A)
0.30
0.34
0.40
0.60
1.00
1.00
1.00
1.50
2.20
2.20
2.50
3.00
3.00
3.00
2.80
4.00
5.00
5.00
6.00
P
d
Typ.
(W)
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
2.0
Time To Trip
Current
(A)
0.5
1.5
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
10.0
Time
(Sec)
1.50
0.15
0.02
0.10
0.15
0.15
0.15
0.20
0.30
0.30
0.40
0.50
0.50
0.50
1.00
2.00
2.50
4.00
4.00
Resistance
R i
min
()
0.750
0.650
0.350
0.250
0.150
0.150
0.150
0.090
0.050
0.050
0.050
0.040
0.040
0.040
0.030
0.020
0.015
0.012
0.008
R1
max
()
15.000
6.000
5.000
3.000
1.000
1.000
1.400
0.450
0.250
0.250
0.140
0.160
0.160
0.160
0.130
0.100
0.050
0.040
0.030
= Maximum operating voltage device can withstand without damage at rated current (Imax).
= Maximum fault current device can withstand without damage at rated voltage (V max).
= Hold Current. Maximum current device will not trip in 25°C still air.
= Trip Current. Minimum current at which the device will always trip in 25°C still air.
= Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.
= Maximum device resistance is measured one hour post reflow.
Ri min/max = Minimum/Maximum device resistance prior to tripping at 25°C.
CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame.
Environmental Specifications
Test
Passive aging
Humidity aging
Thermal shock
Resistance to solvent
Vibration
Ambient operating conditions : - 40 °C to +85 °C
Maximum surface temperature of the device in the tripped state is 125 °C
Conditions
+85°C, 1000 hrs.
+85°C, 85% R.H. , 168 hours
+85°C to -40°C, 20 times
MIL-STD-202,Method 215
MIL-STD-202,Method 201
Resistance change
±5% typical
±5% typical
±33% typical
No change
No change
http:// www.jksemi.com
2016-12-01
版次:
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Jk-mSMD 1812 Series Surface Mount PTC Devices
Agency Approval and Environmental Complianc
Agency
UL
TUV
File Number
EN217453
pending
Regulation
Standard
2002/95/EC
EN14582
Thermal Derading Chart
Recommended Hold Current(A) at Ambient Temperature(°C)
Model
SMD1812R010SF
SMD1812R014SF
SMD1812R020SF
SMD1812R030SF
SMD1812R050SF
SMD182R075SF
SMD1812R110SF
SMD1812R110SF16V
SMD1812R125SF
SMD1812R150SF
SMD1812R150SF16V
SMD1812R160SF
SMD1812R200SF
SMD1812R260SF
SMD1812R300SF
SMD1812R350SF
Ambient Operation Temperature
-40°C
0.16
0.23
0.29
0.44
0.59
1.10
1.60
1.59
2.00
2.30
2.28
2.10
2.88
3.90
4.15
4.84
-20°C
0.14
0.19
0.26
0.39
0.57
0.99
1.45
1.44
1.75
2.05
2.03
1.96
2.61
3.42
3.76
4.39
0°C
0.12
0.17
0.23
0.35
0.55
0.87
1.28
1.27
1.52
1.77
1.75
1.88
2.25
2.96
3.46
4.04
25°C
0.10
0.14
0.20
0.30
0.50
0.75
1.10
1.10
1.25
1.50
1.50
1.60
2.00
2.60
3.00
3.50
40°C
0.08
0.12
0.17
0.26
0.45
0.63
0.92
0.92
1.00
1.23
1.21
1.26
1.80
2.33
2.55
2.98
50°C
0.07
0.10
0.15
0.23
0.43
0.57
0.83
0.82
0.95
1.09
1.07
1.12
1.66
2.07
2.28
2.66
60°C
0.06
0.09
0.14
0.21
0.35
0.49
0.71
0.70
0.90
0.95
0.93
0.98
1.45
1.94
2.01
2.35
70°C
0.05
0.08
0.12
0.18
0.30
0.45
0.66
0.64
0.75
0.82
0.79
0.84
1.09
1.35
1.61
1.88
85°C
0.03
0.06
0.10
0.15
0.23
0.35
0.52
0.50
0.53
0.61
0.58
0.63
0.80
1.00
1.33
1.55
Thermal Derating Curve
Average Time-Current Curve
Average Time Current Curves
100
0.30A
0.50A
Time In Seconds
10
0.75A
1.00A
1.25A
1
1.50A
1.85A
2.0A
0.1
2.50A
2.60A
3.00A
0.01
0.1
1
10
100
Current In Amperes
3.50A
http:// www.jksemi.com
2016-12-01
版次:
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Jk-mSMD 1812 Series Surface Mount PTC Devices
Soldering Parameters
TP 20~40 S
TP
260
Ramp-up
Critical Zone
TL to TP
TL
217
Tsmax
tL
60~150 s
200
Tsmin
Ramp-down
150
ts
Preheat 60~180 s
25
t 25°C to peak
Time
Profile Feature
Average Ramp-Up Rate(Ts max to T p)
Preheat
-Temperature Min(Ts min)
-Temperature Max(Ts max)
-Time(Ts min to Ts max)
Time maintained above:
-Temperature(TL)
-Time(tL)
Peak Temperature(Tp)
Ramp-Down Rate
Time 25℃ to Peak Temperature
Storage Condition
Recommended maximum paste thickness is 0.25mm
Pb-Free Assembly
3℃/second
mac.
150℃
200℃
60~180 seconds
217℃
60~150 seconds
260℃
6℃/second max.
8 minutes max
0℃~35℃,≤70%RH
Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free
Devices can be cleaned using standard industry methods and solvents.
Note 1:All temperature refer to topside of the package, measured on the package body surface.
Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.
http:// www.jksemi.com
2016-12-01
版次:
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Jk-mSMD 1812 Series Surface Mount PTC Devices
Physical Dimensions(mm.)
A
B
XX
010
050
D
Model
SMD1812R010SF
SMD1812R014SF
SMD1812R020SF
SMD1812R030SF
SMD1812R050SF
E
A
Min.
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
C
B
Max.
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
Min.
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
Max.
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
Min.
0.50
0.50
0.50
0.50
0.40
0.70
1.10
0.40
0.40
0.60
0.60
0.40
0.40
0.40
0.50
0.50
0.50
0.50
C
Max.
1.00
1.00
1.30
1.00
0.90
1.30
1.80
0.90
0.90
1.30
1.30
1.20
1.20
1.20
1.30
1.50
1.50
1.50
D
Min.
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
E
Min.
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
SMD1812R050SF33V
SMD1812R050SF60V
SMD182R075SF
SMD1812R110SF
SMD1812R110SF16V
SMD1812R125SF
SMD1812R150SF
SMD1812R150SF16V
SMD1812R160SF
SMD1812R200SF
SMD1812R260SF
SMD1812R300SF
SMD1812R350SF
Termination Pad Characteristics
Terminal pad materials：Tin-plated Nickel-Copper
Terminal pad solder ability：Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3.
Recommended Pad Layout (mm.)
1.78
士
0.1
1.78
士
0.1
3..2
士
0.1
3.2
士
0.1
Packaging Quantity
Part Number
SMD812 Series
Tape & reel packaging per EIA481-1
Quantity
1,500 pcs/reel
Tape And Reel Specifications (mm)
http:// www.jksemi.com
2016-12-01
版次:
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EIA Tape Component Dimensions
Jk-mSMD 1812 Series Surface Mount PTC Devices
Governing
Specifications
W
P0
P1
P2
A0
B0
B1max.
D0
F
E1
E2min.
T
T1max.
K0
Leader min.
Trailer min.
Reel Dimensions
A max.
N min.
W1
W2
178
60
12.4 ± 0.5
18.4
Cover tape
Carrier tape
Embossed cavity
W1(measured at hub)
EIA 481-1
12 ± 0.3
4.0 ± 0.10
8.0 ± 0.10
2.0 ± 0.05
3.5 ± 0.10
5.1 ± 0.10
5.9
1.50 + 0.1, -0
5.5 ± 0.05
1.75 ± 0.10
10.25
0.6
0.1
0.9 ± 0.1
390
160
W2(measured at hub)
T
P1
B
K0
EIA Tape Component Dimensions
T
Cover
A
B0
D
P0
Embossment
P2
E1
F
W
E2
EIA Reel Dimensions
A
N(hub dia.)
Storage And Handling
‧
Storage conditions：35°C max, 70% R.H.
‧
Devices may not meet specified performance
if storage conditions are exceeded.
Part Number System
JK - mSMD
口口口
S F
口口
V
special voltage Rating(Optional)
Lead-Free
Tin-plated Nickel-Copper
Holding Current Rating
Device Dimensions: Length/width(Unit:1/100 inch) Size 4532 mm / 1812 inch
JKSEMI
http:// www.jksemi.com
2016-12-01
版次:
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