TMBAT49
Small signal Schottky diode
Features
■
■
very low turn-on voltage
fast switching
Description
The TMBAT49 is a general purpose metal to
silicon diode. This device has integrated
protection against excessive voltage such as
electrostatic discharges.
MELF
(glass)
November 2010
Doc ID 3484 Rev 2
1/6
www.st.com
6
Characteristics
TMBAT49
1
Characteristics
Table 1.
Symbol
V
RRM
I
F
I
FRM
I
FSM
T
stg
T
j
T
L
Absolute ratings (limiting values)
Parameter
Repetitive peak reverse voltage
Forward continuous current
Repetitive peak forward current
Surge non repetitive forward current
Storage temperature range
Operating junction temperature range
Maximum lead soldering temperature during 15 s
T
j
= 70 °C
t
p
= 1 s
δ ≤
0.5
t
p
= 10 ms
Value
80
500
3
10
- 65 to +150
- 65 to +125
260
Unit
V
mA
A
A
°C
°C
°C
Table 2.
Symbol
R
th(j-l)
Thermal parameter
Parameter
Junction to lead
Value
110
Unit
°C/W
Table 3.
Symbol
I
R(1)
V
F(1)
Static electrical characteristics
Parameter
Test conditions
V
R
= 80 V
I
F
= 10 mA
Forward voltage drop
T
j
= 25 °C
I
F
= 100 mA
I
F
= 1 A
Min.
-
-
-
-
Typ.
-
-
-
-
Max.
200
0.32
0.42
1
V
Unit
µA
Reverse leakage current T
j
= 25 °C
1. Pulse test: t
p
≤
300 µs,
δ
< 2%
Table 4.
Symbol
C
Dynamic characteristics (T
j
= 25 °C)
Parameter
Test conditions
V
R
= 0 V
V
R
= 5 V
Min.
-
-
Typ.
120
35
Max.
-
pF
-
Unit
Diode capacitance F = 1 MHz
2/6
Doc ID 3484 Rev 2
TMBAT49
Characteristics
Figure 1.
Forward voltage drop versus
Figure 2.
forward current (typical values, low
level)
10
9
Forward voltage drop versus
forward current (typical values,
high level)
1.E+03
I
FM
(mA)
I
FM
(A)
1.E+02
T
j
= 25 °C
T
j
= 100 °C
8
7
1.E+01
T
j
= 55 °C
6
5
1.E+00
4
3
T
j
= 25 °C
1.E-01
2
1
1.E-02
0.0
V
FM
(V)
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0
0.00
V
FM
(V)
0.25
0.50
0.75
1.00
1.25
1.50
Figure 3.
Reverse leakage current versus
reverse voltage applied (typical
values)
Figure 4.
Junction capacitance versus
reverse voltage applied
(typical values)
F = 1 MHz
V
osc
= 30 mV
T
j
= 25 °C
1.E+01
I
R
(mA)
T
j
= 125 °C
100
C(pF)
1.E+00
T
j
= 100 °C
T
j
= 75 °C
1.E-01
T
j
= 50 °C
T
j
= 25 °C
1.E-02
1.E-03
0
10
20
30
40
50
60
70
V
R
(V)
80
10
1
10
V
R
(V)
100
Figure 5.
Non-repetitive peak surge forward
current versus pulse duration
(square waveform)
Figure 6.
Non-repetitive peak surge forward
current versus number of cycles
25
I
FSM
(A)
10
I
FSM
(A)
20
t
p
=10 ms
One cycle
15
10
5
0
0.1
t
p
(ms)
1.0
10.0
1
1
10
Number of cycles
100
Doc ID 3484 Rev 2
3/6
Package information
TMBAT49
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at:
www.st.com.
ECOPACK
®
is an ST trademark.
Table 5.
MELF package dimensions
Dimensions
A
Ref.
Millimeters
Min.
Typ.
Max.
5.20
2.65
0.60
2.50
Min.
0.189
0.098
0.018
Inches
Typ.
Max.
0.205
0.104
0.024
0.098
ØB
A
øB
4.80
2.50
0.45
ØD
C
C
C
øD
Figure 7.
Footprint (dimensions in mm)
3
4
6.5
4/6
Doc ID 3484 Rev 2
TMBAT49
Ordering information
3
Ordering information
Table 6.
Ordering information
Marking
Cathode ring
Package
MELF (glass)
Weight
0.15 g
Base qty
1500
Delivery mode
Bulk
Order code
TMBAT49FILM
4
Revision history
Table 7.
Date
Aug-1999
12-Nov-2010
Document revision history
Revision
1A
2
Previous release.
Added ECOPACK statement. Updated graphics in
Section 1.
Changes
Doc ID 3484 Rev 2
5/6
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