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LM2904YST |
PRA100I7218R0.5%0.01%R0031 |
LM2904ST |
LM2904AYDT |
LM2904DT |
描述 |
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Array/Network Resistor, Isolated, Thin Film, 0.1W, 218ohm, 50V, 0.5% +/-Tol, -10,10ppm/Cel, 2806, |
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增益带宽积(GBP):1.1MHz 放大器组数:2 运放类型:General Purpose 各通道功耗:700uA 压摆率(SR):0.6 V/us 电源电压:3V ~ 32V, ±1.5V ~ 16V |
包装说明 |
ROHS COMPLIANT, MINISO-8 |
SMT, 2806 |
TSSOP, TSSOP8,.19 |
ROHS COMPLIANT, MICRO, PLASTIC, SOP-8 |
ROHS COMPLIANT, MICRO, PLASTIC, SOP-8 |
Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
compliant |
ECCN代码 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
端子数量 |
8 |
14 |
8 |
8 |
8 |
最高工作温度 |
125 °C |
155 °C |
125 °C |
125 °C |
125 °C |
最低工作温度 |
-40 °C |
-55 °C |
-40 °C |
-40 °C |
-40 °C |
封装形式 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMT |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE |
SMALL OUTLINE |
包装方法 |
TAPE AND REEL |
Box |
TAPE AND REEL |
TAPE AND REEL |
TR |
技术 |
BIPOLAR |
THIN FILM |
BIPOLAR |
BIPOLAR |
BIPOLAR |
Brand Name |
STMicroelectronics |
- |
STMicroelectronics |
STMicroelectronics |
STMicroelectronics |
是否Rohs认证 |
符合 |
不符合 |
- |
符合 |
符合 |
零件包装代码 |
SOIC |
- |
SOIC |
SOIC |
SOIC |
针数 |
8 |
- |
8 |
8 |
8 |
Factory Lead Time |
20 weeks |
- |
12 weeks |
10 weeks |
43 weeks 2 days |
放大器类型 |
OPERATIONAL AMPLIFIER |
- |
OPERATIONAL AMPLIFIER |
OPERATIONAL AMPLIFIER |
OPERATIONAL AMPLIFIER |
架构 |
VOLTAGE-FEEDBACK |
- |
VOLTAGE-FEEDBACK |
VOLTAGE-FEEDBACK |
VOLTAGE-FEEDBACK |
最大平均偏置电流 (IIB) |
0.02 µA |
- |
0.02 µA |
0.02 µA |
0.2 µA |
25C 时的最大偏置电流 (IIB) |
0.15 µA |
- |
0.15 µA |
0.15 µA |
0.15 µA |
标称共模抑制比 |
85 dB |
- |
85 dB |
85 dB |
85 dB |
频率补偿 |
YES |
- |
YES |
YES |
YES |
最大输入失调电压 |
9000 µV |
- |
9000 µV |
4000 µV |
9000 µV |
JESD-30 代码 |
S-PDSO-G8 |
- |
S-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
JESD-609代码 |
e3 |
- |
e3 |
e3 |
e4 |
长度 |
3 mm |
- |
3 mm |
4.9 mm |
4.9 mm |
低-失调 |
NO |
- |
NO |
NO |
NO |
负供电电压上限 |
-16 V |
- |
-16 V |
-16 V |
-32 V |
功能数量 |
2 |
- |
2 |
2 |
2 |
封装主体材料 |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
TSSOP |
- |
TSSOP |
SOP |
SOP |
封装等效代码 |
TSSOP8,.19 |
- |
TSSOP8,.19 |
SOP8,.25 |
SOP8,.25 |
封装形状 |
SQUARE |
- |
SQUARE |
RECTANGULAR |
RECTANGULAR |
峰值回流温度(摄氏度) |
260 |
- |
260 |
260 |
260 |
电源 |
+-1.5/+-13/3/26 V |
- |
+-1.5/+-13/3/26 V |
+-1.5/+-13/3/26 V |
+-1.5/+-13/3/26 V |
认证状态 |
Not Qualified |
- |
Not Qualified |
Not Qualified |
Not Qualified |
座面最大高度 |
1.1 mm |
- |
1.1 mm |
1.75 mm |
1.75 mm |
最小摆率 |
0.2 V/us |
- |
0.3 V/us |
0.2 V/us |
0.3 V/us |
标称压摆率 |
0.6 V/us |
- |
0.6 V/us |
0.6 V/us |
0.6 V/us |
最大压摆率 |
2 mA |
- |
2 mA |
2 mA |
2 mA |
供电电压上限 |
16 V |
- |
16 V |
16 V |
32 V |
标称供电电压 (Vsup) |
5 V |
- |
5 V |
5 V |
5 V |
表面贴装 |
YES |
- |
YES |
YES |
YES |
温度等级 |
AUTOMOTIVE |
- |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
端子面层 |
Matte Tin (Sn) |
- |
Matte Tin (Sn) - annealed |
Matte Tin (Sn) - annealed |
Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 |
GULL WING |
- |
GULL WING |
GULL WING |
GULL WING |
端子节距 |
0.65 mm |
- |
0.65 mm |
1.27 mm |
1.27 mm |
端子位置 |
DUAL |
- |
DUAL |
DUAL |
DUAL |
处于峰值回流温度下的最长时间 |
30 |
- |
30 |
30 |
30 |
标称均一增益带宽 |
1100 kHz |
- |
1100 kHz |
1100 kHz |
1100 kHz |
最小电压增益 |
25000 |
- |
25000 |
25000 |
25000 |
宽度 |
3 mm |
- |
3 mm |
3.9 mm |
3.9 mm |
厂商名称 |
- |
- |
ST(意法半导体) |
ST(意法半导体) |
ST(意法半导体) |
湿度敏感等级 |
- |
- |
1 |
1 |
1 |