APPROVAL NO.
730 - 021
ALUMINUM ELECTROLYTIC CAPACITOR
PAGE:
DATE:
1 OF 6
2016.01.15
SPECIFICATIONS
Item
Rated Voltage Range
Operating Temperature Range
Characteristics
6.3 ~ 450 V
DC
- 40 ~ + 105
℃
±20%(M)
Rated Voltage(V
DC
)
6.3 ~ 100
0.01CV (μA) or 3μA, whichever is greater
( at 20℃, 2minutes )
Capacitance Tolerance
(at 20
℃,120Hz)
160 ~ 450
0.04CV + 100 (μA)
( at 20℃, 1minute )
Leakage Current
Max. Leakage current(μA)
Where, C : Nominal capacitance（μF
），V
: Rated Voltage（V
DC
）
Dissipation Factor
Tanδ（Max.）
Rated voltage(V
DC
)
Φ4
~
Φ6.3
Φ8
~
Φ18
6.3
0.30
0.40
10
0.24
0.30
16
0.20
0.26
25
0.16
0.16
35
0.14
0.14
50~100 160~250 400~450
0.12
0.12
-
0.15
-
0.20
(at 120Hz,20
℃
)
Temperature characteristics
( Max. Impedance ratio )
（at
120Hz
）
Rated Voltage (V
DC
)
Z(-25
℃
)/Z(20
℃
)
Z(-40
℃
)/Z(20
℃
)
6.3
4
10
10
3
8
16
2
6
25
2
4
35
2
3
50~100
3
4
160~250 400~450
3
6
6
10
The following specifications shall be satisfied when the capacitors are restored to 20℃
after the rated voltage is applied with the following conditions.
Φ4~Φ6.3:
105℃,1000 hours,
Capacitance change
Φ4~Φ6.3
Φ8~Φ18
TANδ
Φ4~Φ6.3
Φ8~Φ18
Leakage current
:
≤300%
of the initial specified value
:
≤200%
of the initial specified value
:
≤The
initial specified value
Φ8~Φ18:
105℃,2000 hours
Load Life
:
≤±
30% of the initial Value
:
≤±
20% of the initial Value
The following specifications shall be satisfied when the capacitors are restored to 20℃
after exposing them for the specified time at 105℃ without voltage applied.
The rated voltage shall be appled to the capacitors for a minimum of 30 minutes,at least 24
hours and not more than 48 hours before the measurements.
Φ4~Φ6.3:
105℃,500 hours,
Capacitance change
Φ4~Φ6.3
Φ8~Φ18
TANδ
Leakage current
:
≤±
25% of the initial Value
:
≤±
20% of the initial Value
:
≤200%
of the initial specified value
:
≤The
initial specified value
Φ8~Φ18:
105℃,1000 hours
Shelf Life
Others
Satisfies characteristic KS C IEC 60384-4
←
←
←
李波
SamYoung Electronics Co., Ltd.
立范
波
阿吕
勇
PAGE:
4 OF 6
ALUMINUM ELECTROLYTIC CAPACITOR
CE32
TYPE
MINIATURE SIZED TYPE CAPACITORS COMPONENT
PART NAME
LEAD WIRE
APPROVAL NO：
730 - 021
MATERIALS
KISTRON
TINNED COPPER - PLY WIRE(PB-FREE)
KOHOKU
NANTONG HONGYANG
KISTRON
VENDER
(KOREA/CHINA)
(JAPAN/CHINA)
(CHINA)
(KOREA/CHINA)
(JAPAN/CHINA)
(CHINA)
(KOREA/CHINA)
(CHINA)
(KOREA)
(JAPAN)
(CHINA)
(KOREA)
(CHINA)
(KOREA)
(JAPAN)
(ITALY)
(CHINA)
(JAPAN)
(KOREA)
(CHINA)
(JAPAN)
(CHINA)
(KOREA)
(JAPAN)
AL LEAD
ALUMINUM 99.92%
KOHOKU
NANTONG HUIFENG
SUNG NAM
CCW
BASE
ZICVISION
SANKYO TOHOKU
VIVID
D.N TECH/HA NAM
LINAN AOXING
SAM YOUNG
K.D.K/JCC/MATSUSHITA
BECROMAL
HEC/HISTAR
K.D.K
PACKING PAD
SYNTHETIC RUBBER
CHIP BASE
PPA ( POLY PHTHAL AMIDE )
AL
CASE
COATED ALUMINUM
AL FOIL
（+）
FORMED ALUMINUM 99.9% OVER
AL FOIL
（-）
ETCHED ALUMINUM 98% OVER
K-JCC
ELECON/WU JIANG FEILO
N.K.K
KAN
DAEIL/SWECO
NITTO/NICHIBAN
SEPARATOR
INSULATION PAPER
POLYPHENYLENE SULFIDE OR POLY IMIDE FILM
ADHESIVE TAPE
PRECAUTIONS TO USERS
Soldering method
The capacitors of Al chip have no capability to withstand such
dip or wave soldering as totally immerses components into a
solder bath.
Reflow soldering
Use the capacitors within the Recommended Reflow Soldering
Conditions, and also make sure to check the temperature stress
to the capacitors because the following makes a difference in the
stress to the capacitors.If any other reflow soldering conditions are
applied,please consult us.
(1)Location of components.(The edge sides of a PC board
increases its temperature more than the center does.)
(2)Population of components. The less the component popluation
is the more the temperature is increased.
(3)Mater ial of printed circuit board. As a ceramic board needs
heating up more than a glass epoxy board to reach the same
board temperature,the capacitors may be damaged.
(4)Thickness of PC board. A thick PC board needs heating up
more than a thin board. It may damage the capacitors.
(5)Size of PC board. A large PC board needs heating up more than
a small board and it may damage the capacitors.
(6)Location of infrared ray lamps. On IR reflow as well as hot
plate reflow, heating only the reverse side of the PC
reduce stress to the capaciors.
Rework of soldering
Avoid soldering more than once by reflow. Use a soldering iron
board will
for rework of solder, and do not exceed an iron tip temperature of 300℃ and
a max. exposure time of 5 seconds.
Mechanical stress
Do not lift up or push the capacitor after soldering.Avoid curvature of the PC board.
These may damage the capacitor.
Cleaning of Assembly board
Standard aluminnum electrolytic capacitors should be free from solvent during
PC board cleaning after soldering.Use solvent—proof capacitors and follow the
cleaning condition when halogenated solvents are used.
After solvent cleaning, immediately evaporate the solvents residue for at least
10 minutes with a hot forced air. If the assembly board is inadequately dried
after a washing process,the capacitors will keep suffering from the residual
solvent for long periods of time,and will be corroded while in service.
Coating on assembly board
(1)Before coating ,evaporate cleaning solvents from the assembly board.
(2)Before the conformal coating ,using a buffer precoat which does not contain
chloride is recommended to reduce stress to the capacitors.
Molding by resin
Inner pressure of a capcitor slowly increases over the service life of the capacitor
with gas being produced by internal chemical reaction.If the end seal of the
capacitor is completely be in danger. Also if the resin contains a large amount of
chlorine ion,it will penetrate into the end seal,get into the inside element of the
capacitor,and damage the capacitor while in service.
Others
Pls refer to Page 5 of 6 and 6 of 6.
SamYoung Electronics Co., Ltd.
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