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74LVT244, 74LVTH244 — Low Voltage Octal Buffer/Line Driver with 3-STATE Outputs
January 2008
74LVT244, 74LVTH244
Low Voltage Octal Buffer/Line Driver with 3-STATE Outputs
Features
■
Input and output interface capability to systems at
■
General Description
The LVT244 and LVTH244 are octal buffers and line
drivers designed to be employed as memory address
drivers, clock drivers and bus oriented transmitters or
receivers which provide improved PC board density.
The LVTH244 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
These octal buffers and line drivers are designed for low-
voltage (3.3V) V
CC
applications, but with the capability to
provide a TTL interface to a 5V environment. The LVT244
and LVTH244 are fabricated with an advanced BiCMOS
technology to achieve high speed operation similar to 5V
ABT while maintaining low power dissipation.
■
■
■
■
■
■
5V V
CC
Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH244),
also available without bushold feature (74LVT244)
Live insertion/extraction permitted
Power Up/Down high impedance provides glitch-free
bus loading
Outputs source/sink –32mA/+64mA
Functionally compatible with the 74 series 244
Latch-up performance exceeds 500mA
ESD performance:
– Human-body model
>
2000V
– Machine model
>
200V
– Charged-device model
>
1000V
Ordering Information
Order Number
74LVT244WM
74LVT244SJ
74LVT244MSA
74LVT244MTC
74LVTH244WM
74LVTH244SJ
74LVTH244MSA
74LVTH244MTC
Package
Number
M20B
M20D
MSA20
MTC20
M20B
M20D
MSA20
MTC20
Package Description
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
All packages are lead free per JEDEC: J-STD-020B standard.
三星刚出的旗舰新机Galaxy S III固然不错，但是高昂的价格不是每个人都能承受的起。昨天我们报道了一部山寨版的i9300，而现在该机价格和具体配置已经全部出炉。 这款山寨的Galaxy S III名叫HDC Galaxy S3，其外形甚至UI界面都与原型机异常相似。该机的三围为138×70×9.2mm，配备了一块4.7寸触摸屏，分辨率只有800×480像素。
该机还搭载了...[详细]
stm32/stm8
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