DC-IN 1-CH Transistor DC-OUT 4-Pin PDIP SMD T/R
| 参数名称 | 属性值 |
| 欧盟限制某些有害物质的使用 | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| HTS | 8541.40.80.00 |
| 输出类型 Output Type | DC |
| Input Type | DC |
| Output Device | Transistor |
| Number of Channels per Chip | 1 |
| Minimum Isolation Voltage (Vrms) | 5000 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Operating Temperature (°C) | 110 |
| Maximum Forward Voltage (V) | 1.4 |
| Maximum Collector-Emitter Voltage (V) | 70 |
| Maximum Current Transfer Ratio (%) | 160 |
| Standard | DIN|UL |
| Maximum Collector Current (mA) | 50 |
| Maximum Collector-Emitter Saturation Voltage (mV) | 200 |
| Maximum Power Dissipation (mW) | 200 |
| Maximum Reverse Voltage (V) | 6 |
| Typical Forward Voltage (V) | 1.2 |
| Maximum Rise Time (us) | 18 |
| Maximum Fall Time (us) | 18 |
| Maximum Forward Current (mA) | 50 |
| 系列 Packaging | Tape and Reel |
| Minimum Current Transfer Ratio (%) | 80 |
| Current Transfer Ratio Test Current (mA) | 5 |
| Typical Rise Time (us) | 4 |
| Typical Fall Time (us) | 3 |
| Standard Package Name | DIP SMD |
| Pin Count | 4 |
| Supplier Package | PDIP SMD |
| Mounting | Surface Mount |
| Package Height | 4(Max) |
| Package Length | 5.1(Max) |
| Package Width | 7(Max) |
| PCB changed | 4 |
| Lead Shape | Gull-wing |
| FOD817A3SD | FOD8173SD | FOD817C300W | |
|---|---|---|---|
| 描述 | DC-IN 1-CH Transistor DC-OUT 4-Pin PDIP SMD T/R | DC-IN 1-CH Transistor DC-OUT 4-Pin PDIP SMD Black T/R | DC-IN 1-CH Transistor DC-OUT 4-Pin PDIP Box |
| 欧盟限制某些有害物质的使用 | Compliant | - | Compliant |
| ECCN (US) | EAR99 | - | EAR99 |
| Part Status | Active | - | Active |
| HTS | 8541.40.80.00 | - | 8541.40.80.00 |
| 输出类型 Output Type |
DC | - | DC |
| Input Type | DC | - | DC |
| Output Device | Transistor | - | Transistor |
| Number of Channels per Chip | 1 | - | 1 |
| Minimum Isolation Voltage (Vrms) | 5000 | - | 5000 |
| Minimum Operating Temperature (°C) | -55 | - | -55 |
| Maximum Operating Temperature (°C) | 110 | - | 110 |
| Maximum Forward Voltage (V) | 1.4 | - | 1.4 |
| Maximum Collector-Emitter Voltage (V) | 70 | - | 70 |
| Maximum Current Transfer Ratio (%) | 160 | - | 400 |
| Standard | DIN|UL | - | DIN|UL |
| Maximum Collector Current (mA) | 50 | - | 50 |
| Maximum Collector-Emitter Saturation Voltage (mV) | 200 | - | 200 |
| Maximum Power Dissipation (mW) | 200 | - | 200 |
| Maximum Reverse Voltage (V) | 6 | - | 6 |
| Typical Forward Voltage (V) | 1.2 | - | 1.2 |
| Maximum Rise Time (us) | 18 | - | 18 |
| Maximum Fall Time (us) | 18 | - | 18 |
| Maximum Forward Current (mA) | 50 | - | 50 |
| 系列 Packaging |
Tape and Reel | - | Box |
| Minimum Current Transfer Ratio (%) | 80 | - | 200 |
| Current Transfer Ratio Test Current (mA) | 5 | - | 5 |
| Typical Rise Time (us) | 4 | - | 4 |
| Typical Fall Time (us) | 3 | - | 3 |
| Standard Package Name | DIP SMD | - | PDIP |
| Pin Count | 4 | - | 4 |
| Supplier Package | PDIP SMD | - | PDIP |
| Mounting | Surface Mount | - | Through Hole |
| Package Height | 4(Max) | - | 4(Max) |
| Package Length | 5.1(Max) | - | 5.1(Max) |
| Package Width | 7(Max) | - | 7(Max) |
| PCB changed | 4 | - | 4 |
| Lead Shape | Gull-wing | - | Wide Lead Spacing Through Hole |
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