NSR05F20NXT5G
Schottky Barrier Diode
These Schottky barrier diodes are optimized for low forward
voltage drop and low leakage current and are offered in a Chip Scale
Package (CSP) to reduce board space. The low thermal resistance
enables designers to meet the challenging task of achieving higher
efficiency and meeting reduced space requirements.
Features
http://onsemi.com
•
•
•
•
Low Forward Voltage Drop
−
390 mV @ 500 mA
Low Reverse Current
−
15
mA
@ 10 V VR
500 mA of Continuous Forward Current
ESD Rating
−
Human Body Model: Class 3B
ESD Rating
−
Machine Model: Class C
•
High Switching Speed
•
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
20 V SCHOTTKY
BARRIER DIODE
1
CATHODE
2
ANODE
2
MARKING
DIAGRAM
1
PIN 1
05F20
YYY
•
•
•
•
•
•
•
•
•
•
LCD and Keypad Backlighting
Camera Photo Flash
Buck and Boost dc−dc Converters
Reverse Voltage and Current Protection
Clamping & Protection
Mobile Handsets
MP3 Players
Digital Camera and Camcorders
Notebook PCs & PDAs
GPS
DSN2
(0402)
CASE 152AC
05F20
YYY
= Specific Device Code
= Year Code
Markets
ORDERING INFORMATION
Device
NSR05F20NXT5G
Package
Shipping†
DSN2
5000 / Tape & Reel
(Pb−Free)
MAXIMUM RATINGS
Rating
Reverse Voltage
Forward Current (DC)
Forward Surge Current (60 Hz @ 1 cycle)
Repetitive Peak Forward Current
(Pulse Wave = 1 sec, Duty Cycle = 66%)
ESD Rating:
Human Body Model
Machine Model
Symbol
V
R
I
F
I
FSM
I
FRM
ESD
Value
20
500
10
4.0
>8
> 400
Unit
V
mA
A
A
kV
V
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
©
Semiconductor Components Industries, LLC, 2010
September, 2010
−
Rev. 2
1
Publication Order Number:
NSR05F20/D
NSR05F20NXT5G
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance
Junction−to−Ambient (Note 1)
Total Power Dissipation @ T
A
= 25°C
Thermal Resistance
Junction−to−Ambient (Note 2)
Total Power Dissipation @ T
A
= 25°C
Storage Temperature Range
Junction Temperature
Symbol
R
qJA
P
D
R
qJA
P
D
T
stg
T
J
Min
Typ
Max
240
521
94
1.3
−40
to +125
+150
Unit
°C/W
mW
°C/W
W
°C
°C
1. Mounted onto a 4 in square FR−4 board 50 mm sq. 1 oz. Cu 0.06” thick single sided. Operating to steady state.
2. Mounted onto a 4 in square FR−4 board 1 in sq. 1 oz. Cu 0.06” thick single sided. Operating to steady state.
ELECTRICAL CHARACTERISTICS
(T
A
= 25°C unless otherwise noted)
Characteristic
Reverse Leakage
(V
R
= 10 V)
(V
R
= 20 V)
Forward Voltage
(I
F
= 100 mA)
(I
F
= 500 mA)
Symbol
I
R
Min
Typ
Max
15
75
0.330
0.390
0.345
0.430
Unit
mA
V
F
V
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2
NSR05F20NXT5G
PACKAGE DIMENSIONS
DSN2, 1.0x0.6, 0.575P, (0402)
CASE 152AC−01
ISSUE B
0.05 C
D
A B
E
0.05 C
TOP VIEW
0.05 C
A
0.05 C
A1
SIDE VIEW
C
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
DIM
A
A1
b
D
E
L
L2
L3
MILLIMETERS
MIN
MAX
0.25
0.31
−−−
0.05
0.45
0.55
1.00 BSC
0.60 BSC
0.85
0.95
0.35
0.45
0.20
0.30
CATHODE BAND MONTH
CODING
DEC
SEP
JUN
MAR
FEB
JAN
NOV OCT
0.05 C A B
L
L/2
1
b
0.05 C A B
XXXX
YYY
XXXX
Y09
INDICATES AUG 2009
DEVICE CODE
YEAR CODE
L3
L2
(EXAMPLE)
BOTTOM VIEW
RECOMMENDED
SOLDER FOOTPRINT*
1.20
0.47
PIN 1
0.60
0.60
DIMENSIONS: MILLIMETERS
See Application Note AND8398/D for more mounting details
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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Phone:
303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax:
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Email:
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USA/Canada
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Phone: 81−3−5773−3850
ON Semiconductor Website: www.onsemi.com
Order Literature:
http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
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4
NSR05F20/D
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