NSR30CM3
Dual Common Cathode
Schottky Barrier Diodes
These Schottky barrier diodes are designed for high speed switching
applications, circuit protection, and voltage clamping. Extremely low
forward voltage reduces conduction loss. Miniature surface mount
package is excellent for hand−held and portable applications where
space is limited.
Features
www.onsemi.com
•
Extremely Fast Switching Speed
•
Low Forward Voltage − 0.35 V (Typ) @ I
F
= 10 mA
•
NSVR Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
•
This is a Pb−Free Device
MAXIMUM RATINGS
(T
J
= 125°C unless otherwise noted)
Rating
Reverse Voltage
Forward Power Dissipation
@ T
A
= 25°C
Derate above 25°C
Forward Current (DC)
Junction Temperature
Storage Temperature Range
Thermal Resistance
Junction−to−Ambient (Note 1)
Symbol
V
R
P
F
190
1.9
I
F
T
J
T
stg
R
qJA
200 Max
125 Max
−55 to +150
525
mW
mW/°C
mA
°C
°C
°C/W
Value
30
Unit
Volts
30 VOLTS
DUAL COMMON CATHODE
SCHOTTKY BARRIER DIODES
3
2
1
SOT−723
CASE 631AA
STYLE 3
1
ANODE
3
CATHODE
2
ANODE
MARKING DIAGRAM
5C D
1
5C = Specific Device Code
D = Date Code
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−4 board with minimum mounting pad.
ORDERING INFORMATION
Device
NSR30CM3T5G
Package
SOT−723
(Pb−Free)
SOT−723
(Pb−Free)
Shipping
†
8000/Tape & Reel
NSVR30CM3T5G
8000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2016
1
December, 2016 − Rev. 5
Publication Order Number:
NSR30CM3T5G/D
NSR30CM3
PACKAGE DIMENSIONS
SOT−723
CASE 631AA
ISSUE D
−X−
D
b1
3
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
DIM
A
b
b1
C
D
E
e
H
E
L
L2
MILLIMETERS
MIN
NOM
MAX
0.45
0.50
0.55
0.15
0.21
0.27
0.25
0.31
0.37
0.07
0.12
0.17
1.15
1.20
1.25
0.75
0.80
0.85
0.40 BSC
1.15
1.20
1.25
0.29 REF
0.15
0.20
0.25
A
−Y−
E
1
2
2X
H
E
b
0.08 X Y
C
SIDE VIEW
2X
e
TOP VIEW
3X
1
L
3X
L2
BOTTOM VIEW
STYLE 3:
PIN 1. ANODE
2. ANODE
3. CATHODE
RECOMMENDED
SOLDERING FOOTPRINT*
2X
0.40
2X
PACKAGE
OUTLINE
0.27
1.50
3X
0.52
0.36
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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4
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