CM1213A, SZCM1213A
1, 2 and 4-Channel
Low Capacitance
ESD Protection Arrays
Product Description
The CM1213A family of diode arrays has been designed to provide
ESD protection for electronic components or subsystems requiring
minimal capacitive loading. These devices are ideal for protecting
systems with high data and clock rates or for circuits requiring low
capacitive loading. Each ESD channel consists of a pair of diodes in
series which steer the positive or negative ESD current pulse to either
the positive (V
P
) or negative (V
N
) supply rail. A Zener diode is
embedded between V
P
and V
N
, offering two advantages. First, it
protects the V
CC
rail against ESD strikes, and second, it eliminates the
need for a bypass capacitor that would otherwise be needed for
absorbing positive ESD strikes to ground. The CM1213A will protect
against ESD pulses up to 12 kV per the IEC 61000−4−2 standard.
Features
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SOT23−3
SO SUFFIX
CASE 318
SOT−143
SR SUFFIX
CASE 318A
SC−74
SO SUFFIX
CASE 318F
•
One, Two, and Four Channels of ESD Protection
•
•
•
•
•
•
•
Note: For 6 and 8−channel Devices, See the CM1213 Datasheet
Provides ESD Protection to IEC61000−4−2 Level 4
♦
±12
kV Contact Discharge
Low Channel Input Capacitance of 0.85 pF Typical
Minimal Capacitance Change with Temperature and Voltage
Channel Input Capacitance Matching of 0.02 pF Typical is Ideal for
Differential Dignals
Each I/O Pin Can Withstand Over 1000 ESD Strikes*
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
SC70−6
S7 SUFFIX
CASE 419AD
MSOP−10
MR SUFFIX
CASE 846AE
MARKING DIAGRAMS
XXXMG
G
1
XXX
M
G
1
XXXMG
G
= Specific Device Code
= Date Code
= Pb−Free Package
10
XXXX
AYWG
G
1
Applications
•
USB2.0 Ports at 480 Mbps in Desktop PCs, Notebooks and Peripherals
•
IEEE1394 Firewire
®
Ports at 400 Mbps/800 Mbps
•
DVI Ports, HDMI Ports in Notebooks, Set Top Boxes, Digital TVs,
LCD Displays
•
Serial ATA Ports in Desktop PCs and Hard Disk Drives
•
PCI Express Ports
•
General Purpose High−Speed Data Line ESD Protection
XXXX
A
Y
W
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 2 of this data sheet.
*Standard test condition is IEC61000−4−2 level 4 test circuit with each pin subjected to
±8
kV contact discharge for 1000 pulses. Discharges
are timed at 1 second intervals and all 1000 strikes are completed in one continuous test run. The part is then subjected to standard production
test to verify that all of the tested parameters are within spec after the 1000 strikes.
©
Semiconductor Components Industries, LLC, 2011
1
June, 2018 − Rev. 14
Publication Order Number:
CM1213A/D
CM1213A, SZCM1213A
BLOCK DIAGRAM
V
P
CH1
CH1
V
P
CH2
CH4
V
P
CH3
V
N
CM1213A−01SO
V
N
CM1213A−02SR
CM1213A−02SO
CH1 V
N
CH2
CM1213A−04MR
CM1213A−04S7
Table 1. ORDERING INFORMATION
Device
CM1213A−01SO
SZCM1213A−01SO*
CM1213A−02SR
SZCM1213A−02SR*
CM1213A−02SO
CM1213A−04S7
CM1213A−04MR
233
D38
D237
D232
Marking
231
Package
SOT23−3
(Pb−Free)
SOT143−4
(Pb−Free)
SC−74
(Pb−Free)
SC70−6
(Pb−Free)
MSOP−10
(Pb−Free)
Shipping
†
3,000 / Tape & Reel
3,000 / Tape & Reel
3,000 / Tape & Reel
3,000 / Tape & Reel
4,000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP
Capable.
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2
CM1213A, SZCM1213A
Table 2. PIN DESCRIPTIONS
1−Channel, 3−Lead SOT23−3 Package (CM1213A−01SO)
Pin
1
2
3
Name
CH1
V
P
V
N
Type
I/O
PWR
GND
Description
ESD Channel
Positive Voltage Supply Rail
Negative Voltage Supply Rail
V
P
(2)
2
CH1 (1)
Top View
1
231
3
V
N
(3)
PACKAGE/PINOUT DIAGRAMS
3−Lead SOT23−3
2−Channel, 4−Lead SOT143−4 Package (CM1213A−02SR)
Pin
1
2
3
4
Name
V
N
CH1
CH2
V
P
Type
GND
I/O
I/O
PWR
Description
Negative Voltage Supply Rail
ESD Channel
ESD Channel
Positive Voltage Supply Rail
CH1 (2)
2−Channel, SC−74 Package (CM1213A−02SO)
Pin
1
2
3
4
5
6
Name
NC
VN
CH1
CH2
NC
VP
Type
−
GND
I/O
I/O
−
PWR
Description
No Connect
Negative Voltage Supply Rail
ESD Channel
ESD Channel
No Connect
Positive Voltage Supply Rail
CH1 (3)
4−Channel, 6−Lead SC70−6 (CM1213A−04S7)
Pin
1
2
3
4
5
6
Name
CH1
V
N
CH2
CH3
V
P
CH4
Type
I/O
GND
I/O
I/O
PWR
I/O
Description
ESD Channel
Negative Voltage Supply Rail
ESD Channel
ESD Channel
Positive Voltage Supply Rail
ESD Channel
CH1
V
N
CH2
Top View
1
D38
2
3
6
5
4
CH4
V
P
CH3
3
4
CH2 (4)
6−Lead SC−74
NC (1)
V
N
(2)
Top View
1
233
2
6
5
V
P
(6)
NC (5)
4−Lead SOT143−4
2
V
N
(1)
Top View
1
D232
3
CH2 (3)
6−Lead SC70−6
4−Channel, 10−Lead MSOP−10 Package (CM1213A04MR)
Pin
1
2
3
4
5
6
7
8
9
10
Name
CH1
NC
V
P
CH2
NC
CH3
NC
V
N
CH4
NC
Type
I/O
−
PWR
I/O
−
I/O
−
GND
I/O
−
Description
ESD Channel
No Connect
Positive Voltage Supply Rail
ESD Channel
No Connect
ESD Channel
No Connect
Negative Voltage Supply Rail
ESD Channel
No Connect
CH1
NC
V
P
CH2
NC
Top View
1
2
3
4
5
10
9
8
7
6
NC
CH4
V
N
NC
CH3
D238
10−Lead MSOP−10
4
V
P
(4)
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CM1213A, SZCM1213A
SPECIFICATIONS
Table 3. ABSOLUTE MAXIMUM RATINGS
Parameter
Operating Supply Voltage (V
P
− V
N
)
Operating Temperature Range
Storage Temperature Range
DC Voltage at any channel input
Package Power Rating
SOT23−3, SOT143−4, SC−74, and SC70−6 Packages
MSOP−10 Package
ESD
IEC 61000−4−2 Contact
IEC 61000−4−2 Air
ISO 10605 330 pF / 330
W
Contact
ISO 10605 330 pF / 2 kW Contact
ISO 10605 150 pF / 2 kW Contact
Rating
6.0
–40 to +150
–65 to +150
(V
N
− 0.5) to (V
P
+ 0.5)
225
400
±12
±12
±9
±22
±25
kV
Units
V
°C
°C
V
mW
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
Table 4. ELECTRICAL OPERATING CHARACTERISTICS
(Note1)
Symbol
V
P
I
P
V
F
Parameter
Operating Supply Voltage (V
P
−V
N
)
Operating Supply Current
Diode Forward Voltage
Top Diode
Bottom Diode
Channel Leakage Current
Channel Input Capacitance
Channel Input Capacitance Matching
Channel Clamp Voltage
Positive Transients
Negative Transients
Dynamic Resistance
Positive Transients
Negative Transients
(V
P
−V
N
) = 3.3 V
I
F
= 8 mA; T
A
= 25°C
0.60
0.60
T
A
= 25°C; V
P
= 5 V, V
N
= 0 V
At 1 MHz, V
P
= 3.3 V, V
N
= 0 V, V
IN
= 1.65 V
(Note 2)
At 1 MHz, V
P
= 3.3 V, V
N
= 0 V, V
IN
= 1.65 V
(Note 2)
T
A
= 25°C, I
PP
= 1A, t
P
= 8/20
mS
(Note 2)
I
PP
= 1A, t
P
= 8/20
mS
Any I/O pin to Ground
(Note 2)
0.80
0.80
0.1
0.85
0.02
0.95
0.95
1.0
1.2
mA
pF
pF
V
+10
–1.7
W
0.9
0.5
Conditions
Min
Typ
3.3
Max
5.5
8.0
Units
V
mA
V
I
LEAK
C
IN
DC
IN
V
CL
R
DYN
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. All parameters specified at T
A
= 25°C unless otherwise noted.
2. Standard IEC 61000−4−2 with C
Discharge
= 150 pF, R
Discharge
= 330
W,
V
P
= 3.3 V, V
N
grounded.
3. These measurements performed with no external capacitor on V
P
(V
P
floating).
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CM1213A, SZCM1213A
PERFORMANCE INFORMATION
Input Channel Capacitance Performance Curves
Figure 1. Typical Variation of C
IN
vs. V
IN
(f = 1 MHz, V
P
= 3.3 V, V
N
= 0 V, 0.1
mF
Chip Capacitor between V
P
and V
N
, 255C)
Figure 2. Typical Variation of C
IN
vs. Temp
(f = 1 MHz, V
IN
= 30 mV, V
P
= 3.3 V, V
N
= 0 V, 0.1
mF
Chip Capacitor between V
P
and V
N
)
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