NSR0230M2T5G,
NSVR0230M2T5G
Schottky Barrier Diode
These Schottky barrier diodes are designed for high−speed
switching applications, circuit protection, and voltage clamping.
Extremely low forward voltage reduces conduction loss. Miniature
surface mount package is excellent for hand−held and portable
applications where space is limited.
Features
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Extremely Fast Switching Speed
Extremely Low Forward Voltage 0.325 V (max) @ I
F
= 10 mA
Low Reverse Current
AEC Qualified and PPAP Capable
NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
This is a Pb−Free Device*
MAXIMUM RATINGS
Rating
Reverse Voltage
Forward Current DC
Forward Current Surge Peak
(60 Hz, 1 cycle)
ESD Rating:
Class 3B per Human Body Model
Class C per Machine Model
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
Symbol
V
R
I
F
I
FSM
Value
30
200
1.0
Unit
Vdc
mA
A
30 V SCHOTTKY
BARRIER DIODE
SOD−723
CASE 509AA
PLASTIC
1
CATHODE
2
ANODE
MARKING DIAGRAM
7C MG
G
1
2
7C = Specific Device Code
M = Month Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR−5 Board,
(Note 1)
T
A
= 25C
Derate above 25C
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature Range
1. FR−5 Minimum Pad.
Symbol
P
D
167
2.0
R
qJA
T
J
, T
stg
600
−55
to
+125
mW
mW/C
C/W
C
Max
Unit
ORDERING INFORMATION
Device
NSR0230M2T5G
Package
Shipping†
SOD−723
2 mm Pitch
(Pb−Free) 8,000/Tape & Reel
NSVR0230M2T5G SOD−723
2 mm Pitch
(Pb−Free) 8,000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2011
November, 2011
−
Rev. 3
1
Publication Order Number:
NSR0230/D
NSR0230M2T5G, NSVR0230M2T5G
ELECTRICAL CHARACTERISTICS
(T
A
= 25C unless otherwise noted)
Characteristic
Reverse Leakage
(V
R
= 10 V)
(V
R
= 30 V)
Forward Voltage
(I
F
= 10 mA)
(I
F
= 200 mA)
Symbol
I
R
Min
−
−
−
−
Typ
−
−
−
−
Max
10
100
0.325
0.500
Unit
mA
V
F
Vdc
1
I
F
, FORWARD CURRENT (A)
I
R
, REVERSE CURRENT (A)
100m
10m
1m
100m
10m
1m
T
A
=
−25C
0
0.1
0.2
0.3
0.4
0.5
0.6
T
A
= 125C
T
A
= 75C
10m
1m
100m
10m
1m
100n
10n
1n
0
5
10
T
A
=
−25C
T
A
= 75C
T
A
= 25C
T
A
= 125C
T
A
= 25C
15
20
25
30
V
F
, FORWARD VOLTAGE (V)
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 1. Forward Characteristics
Figure 2. Reverse Characteristics
20
C
T
, TOATAL CAPACITANCE (pF)
18
16
14
12
10
8
6
4
2
0
0
5
10
15
20
25
30
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 3. Total Capacitance
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2
NSR0230M2T5G, NSVR0230M2T5G
PACKAGE DIMENSIONS
SOD−723
CASE 509AA−01
ISSUE O
D
−X−
−Y−
E
b
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
DIM
A
b
c
D
E
H
E
L
MILLIMETERS
INCHES
MIN
NOM MAX
MIN
NOM MAX
0.49
0.52
0.55
0.019 0.020 0.022
0.25
0.28
0.32 0.0098 0.011 0.013
0.08
0.12
0.15 0.0032 0.0047 0.0059
0.95
1.00
1.05
0.037 0.039 0.041
0.55
0.60
0.65
0.022 0.024 0.026
1.35
1.40
1.45
0.053 0.055 0.057
0.15
0.20
0.25
0.006 0.0079 0.010
0.08 (0.0032) X Y
A
c
L
H
E
SOLDERING FOOTPRINT*
1.1
0.043
0.45
0.0177
0.50
0.0197
SCALE 10:1
mm
inches
SOD−723
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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For additional information, please contact your local
Sales Representative
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3
NSR0230
/D
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