逻辑类型:收发器,非反相 额外特性:三态
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | Nexperia |
包装说明 | TSSOP, |
Reach Compliance Code | compliant |
其他特性 | WITH DIRECTION CONTROL |
系列 | LVC/LCX/Z |
JESD-30 代码 | R-PDSO-G48 |
JESD-609代码 | e4 |
长度 | 12.5 mm |
逻辑集成电路类型 | BUS TRANSCEIVER |
湿度敏感等级 | 1 |
位数 | 8 |
功能数量 | 2 |
端口数量 | 2 |
端子数量 | 48 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
输出特性 | 3-STATE WITH SERIES RESISTOR |
输出极性 | TRUE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 |
传播延迟(tpd) | 18.4 ns |
座面最大高度 | 1.2 mm |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 1.2 V |
标称供电电压 (Vsup) | 1.8 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | AUTOMOTIVE |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 6.1 mm |
Base Number Matches | 1 |
74LVCH162245ADGG | P-0502E2180BSWP | P2010Z2184PGTF | P2010Z2184PGW | PAC100C08259FA1000 | |
---|---|---|---|---|---|
描述 | 逻辑类型:收发器,非反相 额外特性:三态 | Fixed Resistor, Thin Film, 0.1W, 218ohm, 75V, 0.1% +/-Tol, 25ppm/Cel, Surface Mount, 0502, CHIP | Fixed Resistor, Thin Film, 1W, 2180000ohm, 300V, 0.02% +/-Tol, 5ppm/Cel, Surface Mount, 2010, CHIP | Fixed Resistor, Thin Film, 1W, 2180000ohm, 300V, 0.02% +/-Tol, 5ppm/Cel, Surface Mount, 2010, CHIP | RESISTOR, WIRE WOUND, 1 W, 1 %, 82.5 ohm, THROUGH HOLE MOUNT, AXIAL LEADED, GREEN |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
包装说明 | TSSOP, | CHIP | CHIP | CHIP | , |
Reach Compliance Code | compliant | compliant | compliant | compliant | unknown |
其他特性 | WITH DIRECTION CONTROL | ANTI-SULFUR, FLAME PROOF, NON-INDUCTIVE | ANTI-SULFUR, HIGH PRECISION | ANTI-SULFUR, HIGH PRECISION | PRECISION |
端子数量 | 48 | 2 | 2 | 2 | 2 |
最高工作温度 | 125 °C | 155 °C | 155 °C | 155 °C | 275 °C |
表面贴装 | YES | YES | YES | YES | NO |
技术 | CMOS | THIN FILM | THIN FILM | THIN FILM | WIRE WOUND |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Matte Tin (Sn) - with Nickel (Ni) barrier | GOLD OVER NICKEL | GOLD OVER NICKEL | Matte Tin (Sn) |
JESD-609代码 | e4 | e3 | - | - | e3 |
最低工作温度 | -40 °C | -55 °C | -55 °C | -55 °C | - |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMT | SMT | SMT | - |
Objectid | - | 230991327 | 284931634 | 284373780 | 1123749038 |
Country Of Origin | - | USA | France | France | Czechia |
ECCN代码 | - | EAR99 | EAR99 | EAR99 | EAR99 |
YTEOL | - | 8 | 8.55 | 8.55 | 6.9 |
构造 | - | Rectangular | Rectangular | Rectangular | - |
安装特点 | - | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | THROUGH HOLE MOUNT |
封装高度 | - | 0.8382 mm | 0.5 mm | 0.5 mm | - |
封装长度 | - | 1.397 mm | 5.08 mm | 5.08 mm | - |
封装宽度 | - | 0.635 mm | 2.54 mm | 2.54 mm | - |
包装方法 | - | WAFFLE PACK | TR, Plastic | Waffle Pack | AMMO PACK |
额定功率耗散 (P) | - | 0.1 W | 1 W | 1 W | 1 W |
额定温度 | - | 70 °C | 70 °C | 70 °C | 25 °C |
电阻 | - | 218 Ω | 2180000 Ω | 2180000 Ω | 82.5 Ω |
电阻器类型 | - | FIXED RESISTOR | FIXED RESISTOR | FIXED RESISTOR | FIXED RESISTOR |
尺寸代码 | - | 0502 | 2010 | 2010 | - |
温度系数 | - | 25 ppm/°C | 5 ppm/°C | 5 ppm/°C | - |
端子形状 | - | WRAPAROUND | WRAPAROUND | WRAPAROUND | WIRE |
容差 | - | 0.1% | 0.02% | 0.02% | 1% |
工作电压 | - | 75 V | 300 V | 300 V | - |
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