额定功率:300mW 集电极电流Ic:100mA 集射极击穿电压Vce:50V 晶体管类型:2 个 NPN 预偏压式(双) 预偏置 2个NPN,Vceo=50V,Ic=100mA
| 参数名称 | 属性值 |
| Brand Name | Nexperia |
| 厂商名称 | Nexperia |
| 零件包装代码 | TSSOP |
| 包装说明 | SMALL OUTLINE, R-PDSO-G6 |
| 针数 | 6 |
| 制造商包装代码 | SOT363 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 4 weeks |
| Samacsys Confidence | 4 |
| Samacsys Status | Released |
| Samacsys PartID | 307577 |
| Samacsys Pin Count | 6 |
| Samacsys Part Category | Integrated Circuit |
| Samacsys Package Category | SOT23 (6-Pin) |
| Samacsys Footprint Name | NXP SOT-363 |
| Samacsys Released Date | 2017-07-02 16:34:37 |
| Is Samacsys | N |
| 其他特性 | BUILT IN BIAS RESISTOR RATIO IS 1 |
| 最大集电极电流 (IC) | 0.1 A |
| 集电极-发射极最大电压 | 50 V |
| 配置 | SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
| 最小直流电流增益 (hFE) | 30 |
| JESD-30 代码 | R-PDSO-G6 |
| JESD-609代码 | e3 |
| 湿度敏感等级 | 1 |
| 元件数量 | 2 |
| 端子数量 | 6 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度(摄氏度) | 260 |
| 极性/信道类型 | NPN |
| 参考标准 | AEC-Q101 |
| 表面贴装 | YES |
| 端子面层 | Tin (Sn) |
| 端子形式 | GULL WING |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 晶体管应用 | SWITCHING |
| 晶体管元件材料 | SILICON |
| 标称过渡频率 (fT) | 230 MHz |
| Base Number Matches | 1 |

| PUMH11,115 | PEMH11,115 | PEMH11,315 | PUMH11F | |
|---|---|---|---|---|
| 描述 | 额定功率:300mW 集电极电流Ic:100mA 集射极击穿电压Vce:50V 晶体管类型:2 个 NPN 预偏压式(双) 预偏置 2个NPN,Vceo=50V,Ic=100mA | TRANS 2NPN PREBIAS 0.3W SOT666 | TRANS 2NPN PREBIAS 0.3W SOT666 | TRANS 2NPN PREBIAS 0.3W SC-88 |
| Brand Name | Nexperia | Nexperia | Nexperia | Nexperia |
| 零件包装代码 | TSSOP | SOT | SOT | TSSOP |
| 包装说明 | SMALL OUTLINE, R-PDSO-G6 | SMALL OUTLINE, R-PDSO-F6 | SMALL OUTLINE, R-PDSO-F6 | SMALL OUTLINE, R-PDSO-G6 |
| 针数 | 6 | 6 | 6 | 6 |
| 制造商包装代码 | SOT363 | SOT666 | SOT666 | SOT363 |
| Reach Compliance Code | compliant | compliant | compliant | compliant |
| 其他特性 | BUILT IN BIAS RESISTOR RATIO IS 1 | BUILT IN BIAS RESISTOR RATIO IS 1 | BUILT IN BIAS RESISTOR RATIO IS 1 | BUILT IN BIAS RESISTOR RATIO IS 1 |
| 最大集电极电流 (IC) | 0.1 A | 0.1 A | 0.1 A | 0.1 A |
| 集电极-发射极最大电压 | 50 V | 50 V | 50 V | 50 V |
| 配置 | SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR | SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR | SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR | SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
| 最小直流电流增益 (hFE) | 30 | 30 | 30 | 30 |
| JESD-30 代码 | R-PDSO-G6 | R-PDSO-F6 | R-PDSO-F6 | R-PDSO-G6 |
| 元件数量 | 2 | 2 | 2 | 2 |
| 端子数量 | 6 | 6 | 6 | 6 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 峰值回流温度(摄氏度) | 260 | 260 | 260 | NOT SPECIFIED |
| 极性/信道类型 | NPN | NPN | NPN | NPN |
| 参考标准 | AEC-Q101 | AEC-Q101 | AEC-Q101 | AEC-Q101 |
| 表面贴装 | YES | YES | YES | YES |
| 端子形式 | GULL WING | FLAT | FLAT | GULL WING |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | NOT SPECIFIED |
| 晶体管应用 | SWITCHING | SWITCHING | SWITCHING | SWITCHING |
| 晶体管元件材料 | SILICON | SILICON | SILICON | SILICON |
| 标称过渡频率 (fT) | 230 MHz | 230 MHz | 230 MHz | 230 MHz |
| 厂商名称 | Nexperia | - | Nexperia | Nexperia |
| ECCN代码 | EAR99 | EAR99 | EAR99 | - |
| JESD-609代码 | e3 | e3 | e3 | - |
| 湿度敏感等级 | 1 | 1 | 1 | - |
| 端子面层 | Tin (Sn) | Tin (Sn) | Tin (Sn) | - |
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