类型:D 型 逻辑电路的归属系列:74LVC 功能:三态,非反相
| 参数名称 | 属性值 |
| Brand Name | Nexperia |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Nexperia |
| 零件包装代码 | TSSOP |
| 包装说明 | 6.10 MM, ROHS COMPLIANT, PLASTIC, MO-153, SOT362-1, TSSOP-48 |
| 针数 | 48 |
| 制造商包装代码 | SOT362-1 |
| Reach Compliance Code | compliant |
| Samacsys Confidence | 2 |
| Samacsys Status | Released |
| Samacsys PartID | 1061932 |
| Samacsys Pin Count | 48 |
| Samacsys Part Category | Integrated Circuit |
| Samacsys Package Category | Small Outline Packages |
| Samacsys Footprint Name | SOT362-1 (TSSOP48) |
| Samacsys Released Date | 2019-11-12 07:41:52 |
| Is Samacsys | N |
| 系列 | LVC/LCX/Z |
| JESD-30 代码 | R-PDSO-G48 |
| JESD-609代码 | e4 |
| 长度 | 12.5 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 湿度敏感等级 | 1 |
| 位数 | 8 |
| 功能数量 | 2 |
| 端口数量 | 2 |
| 端子数量 | 48 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度(摄氏度) | 260 |
| 传播延迟(tpd) | 7.5 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 1.2 V |
| 标称供电电压 (Vsup) | 2.7 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 6.1 mm |
| Base Number Matches | 1 |

| 74LVC16374ADGG,118 | 74LVCH16374ABX,518 | 74LVC16374ADGG,112 | 74LVCH16374ADL,112 | 74LVCH16374ADL,118 | 74LVC16374ADL,118 | |
|---|---|---|---|---|---|---|
| 描述 | 类型:D 型 逻辑电路的归属系列:74LVC 功能:三态,非反相 | IC FF D-TYPE DUAL 8BIT 60HXQFN | IC FF D-TYPE DUAL 8BIT 48TSSOP | IC FF D-TYPE DUAL 8BIT 48SSOP | IC FF D-TYPE DUAL 8BIT 48SSOP | IC FF D-TYPE DUAL 8BIT 48SSOP |
| Brand Name | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia |
| 包装说明 | 6.10 MM, ROHS COMPLIANT, PLASTIC, MO-153, SOT362-1, TSSOP-48 | HVBCC, LGA60,8X12,20 | 6.10 MM, ROHS COMPLIANT, PLASTIC, MO-153, SOT362-1, TSSOP-48 | 7.50 MM, PLASTIC, MO-118, SOT370-1, SSOP-48 | 7.50 MM, PLASTIC, MO-118, SOT370-1, SSOP-48 | 7.50 MM, PLASTIC, MO-118, SOT370-1, SSOP-48 |
| 针数 | 48 | QFN | 48 | 48 | 48 | 48 |
| 制造商包装代码 | SOT362-1 | SOT1134-2 | SOT362-1 | SOT370-1 | SOT370-1 | SOT370-1 |
| 系列 | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
| JESD-30 代码 | R-PDSO-G48 | R-PBCC-B60 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 |
| JESD-609代码 | e4 | e3 | e4 | e4 | e4 | e4 |
| 长度 | 12.5 mm | 6 mm | 12.5 mm | 15.875 mm | 15.875 mm | 15.875 mm |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 湿度敏感等级 | 1 | 2 | 1 | 1 | 1 | 1 |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 48 | 60 | 48 | 48 | 48 | 48 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | HVBCC | TSSOP | SSOP | SSOP | SSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
| 传播延迟(tpd) | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns |
| 座面最大高度 | 1.2 mm | 0.5 mm | 1.2 mm | 2.8 mm | 2.8 mm | 2.8 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 1.2 V | 1.65 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| 标称供电电压 (Vsup) | 2.7 V | 3.3 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | MATTE TIN | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | BUTT | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.635 mm | 0.635 mm | 0.635 mm |
| 端子位置 | DUAL | BOTTOM | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 6.1 mm | 4 mm | 6.1 mm | 7.5 mm | 7.5 mm | 7.5 mm |
| 是否Rohs认证 | 符合 | - | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Nexperia | - | Nexperia | Nexperia | Nexperia | Nexperia |
| 零件包装代码 | TSSOP | - | TSSOP | SSOP | SSOP | SSOP |
| Reach Compliance Code | compliant | - | compliant | compliant | compliant | compliant |
| Is Samacsys | N | - | N | N | N | N |
| 峰值回流温度(摄氏度) | 260 | NOT SPECIFIED | 260 | 260 | 260 | - |
| 处于峰值回流温度下的最长时间 | 30 | NOT SPECIFIED | 30 | 30 | 30 | - |
| Base Number Matches | 1 | - | 1 | 1 | 1 | 1 |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved