Chip Multilayer Ceramic Capacitors for General Purpose
GRM32ER61E226KE15_(1210,X5R(EIA),22uF,DC 25 V)
_:Packaging Code
■
Scope
This product specification is applied to Chip Multilayer Ceramic Capacitors used for General Electronic equipment.
Reference Sheet
■
MURATA Part No. System
(Ex.)
GRM
32
(1)L/W
Dimensions
E
R6
1E
(4)Rated
Voltage
226
K
E15
L
(2)T
(3)Temperature
Dimensions Characteristics
(5)Nominal (6)Capacitance (7)Murata’s
(8)Packaging
Capacitance
Tolerance
Control Code Code
■
Type
■
Rated Value
(1)Size Code :
1210
(3)Temperature Characteristics :R6(Public STD Code :X5R(EIA))
Dimensions(mm)
MURATA PART NO.
(1)-1 L
3.2
+/-0.3
(3)Temperature Characteristics
e
g
Temp. coeff
or Cap. Change
+/-15 %
(1)-2 W
2.5
+/-0.2
(2) T
2.5
+/-0.2
Temp. Range
-55 to 85
℃
Ref.Temp.
25
℃
(4)Rated
Voltage
(5)Nominal
Capacitance
(6)Capacitance
Operating
Tolerance
Temp. Range
Mounting
Method
GRM32ER61E226KE15_
0.3 min.
1.0 min.
DC 25 V
22uF
+/-10 %
-55 to 85
℃
Reflow
■
Package
(8)Code
L
K
Packaging
φ180mm Reel
Plastic Tape W8P4
φ330mm Reel
Plastic Tape W8P4
Packaging Unit
1000 pcs./Reel
4000 pcs./Reel
Product specifications in this catalog are as of Nov.23,2017,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
GRM32ER61E226KE15-01A
■
Specifications and Test Methods
Item
No.
1 Rated Voltage
Specification
Shown in Rated value.
Test Method (Ref. Standard:JIS C 5101, IEC60384)
The rated voltage is defined as the maximum voltage which may be applied continuously to the capacitor.
When AC voltage is superimposed on DC voltage, V
P-P
or V
O-P
, whichever is larger, should be maintained
within the rated voltage range.
Visual inspection.
Using Measuring instrument of dimension.
Measurement Point :
Between the terminations
Test Voltage :
250% of the rated voltage
Applied Time :
1s to 5s
Charge/Discharge Current : 50mA max.
Measurement Temperature: Room Temperature
Measurement Point :
Between the terminations
Measurement Voltage :
Rated Voltage
Charging Time :
1min
Charge/Discharge Current : 50mA max.
Measurement Temperature: Room Temperature
Measurement Frequency : 120+/-24Hz
Measurement Voltage :
0.5+/-0.1Vrms
2 Appearance
3 Dimension
4 Voltage Proof
No defects or abnormalities.
Shown in Rated value.
No defects or abnormalities.
5 Insulation Resistance(I.R.)
More than 50Ω½F
6 Capacitance
Shown in Rated value.
7 Q or Dissipation Factor (D.F.)
DF:0.1 max.
Measurement Temperature : Room Temperature
Measurement Frequency : 120+/-24Hz
Measurement Voltage :
0.5+/-0.1Vrms
The capacitance change should be measured after 5 minutes at each specified temperature stage.
Capacitance value as a reference is the value in "*" marked step.
8 Capacitance
Temperature
Characteristics
No bias
Within +/-15%
(-55℃ to +85℃)
Measurement Voltage :
Less than 1.0Vrms (Refer to the individual data sheet)
Step
1
2
3
*
4
5
Temperature(°C)
Reference Temp. +/-2
Min. Operating Temp. +/-3
Reference Temp. +/-2
Max. Operating Temp. ±3
Reference Temp. +/-2
Applying Voltage
No bias
Pre-treatment :
Perform a heat treatment at 150+0/-10°C for 1hour and then let sit for 24+/-2hours at room temperature, then measure.
GRM32ER61E226KE15-01A
Item
No.
9 Adhesive Strength of
Termination
Specification
No removal of the terminations or other defect should occur.
Test Method (Ref. Standard:JIS C 5101, IEC60384)
Solder the capacitor on the test substrate shown in Fig.3.
Applied Force :
10N
Holding Time :
10+/-1½
Applied Direction :
In parallel with the test substrate and vertical with the capacitor side
Solder the capacitor on the test substrate shown in Fig.3.
Kind of Vibration :
A simple harmonic motion 10Hz to 55Hz to 10Hz
Vibration Time :
1min
Total Amplitude :
1.5mm
This motion should be applied for a period of 2hours in each 3 mutually perpendicular directions(total of 6hours).
10 Vibration
Appearance
No defects or abnormalities.
Capacitance Within the specified initial value.
Q or D.F.
Within the specified initial value.
11 Substrate
Bending Test
Appearance
No defects or abnormalities.
Capacitance Within +/-10%
Change
Solder the capacitor on the test substrate shown in Fig.1.
Pressurization Method :
Shown in Fig.2.
Flexure :
1mm
Holding Time :
5+/-1s
Soldering Method :
Reflow soldering
Test Method :
Flux :
Preheat :
Solder :
Test Temp. :
Test Time :
Test Method :
Solder :
Solder Temp. :
Test Time :
Preheat Temp. :
Preheat Time :
Pre-treatment :
Post-treatment :
Solder bath method
Solution of rosin ethanol 25(mass)%
80℃ to 120℃、10s to 30s
Sn-3.0Ag-0.5Cu(Lead Free Solder)
245+/-5℃
2+/-0.5s
Solder bath method
Sn-3.0Ag-0.5Cu(Lead Free Solder)
270+/-5℃
10+/-0.5s
100℃ to 120℃ and 170℃ to 200℃
each 1min
Perform a heat treatment at 150+0/-10°C for 1hour and then let sit for 24+/-2hours at room temperature, then measure.
12 Solderability
95% of the terminations is to be soldered evenly and continuously.
13 Resistance
to Soldering
Heat
Appearance
No defects or abnormalities.
Capacitance Within +/-7.5%
Change
Q or D.F.
Within the specified initial value.
I.R.
Voltage
Proof
Within the specified initial value.
No defects.
Let sit for 24+/-2hours at room temperature, then measure.
14 Temperature
Sudden
Change
Appearance
No defects or abnormalities.
Solder the capacitor on the test substrate shown in Fig.3.
5 cycles
Cycles :
Step
1
2
3
4
Temperature(℃)
Min.Operating Temp. +0/-3
Reference Temp.
Max.Operating Temp. +3/-0
Reference Temp.
Time (min)
30+/-3
2 to 3
30+/-3
2 to 3
Capacitance Within +/-7.5%
Change
Q or D.F.
Within the specified initial value.
I.R.
Voltage
Proof
Within the specified initial value.
No defects.
Pre-treatment :
Post-treatment :
Perform a heat treatment at 150+0/-10°C for 1hour and then let sit for 24+/-2hours at room temperature, then measure.
Let sit for 24+/-2hours at room temperature, then measure.
GRM32ER61E226KE15-01A
Item
Specification
No.
15 High
Appearance No defects or abnormalities.
Temperature
High Humidity
Capacitance Within +/-12.5%
(Steady)
Change
Q or D.F.
DF:0.2 max.
I.R.
More than 500MΩ or 12.5Ω½F (Whichever is smaller)
Test Method (Ref. Standard:JIS C 5101, IEC60384)
Solder the capacitor on the test substrate shown in Fig.3.
40+/-2℃
Test Temperature :
Test Humidity :
90%RH to 95%RH
Test Time :
500+/-12h
Test Voltage :
Rated Voltage
Charge/Discharge Current : 50mA max.
Pre-treatment :
Post-treatment :
Perform a heat treatment at 150+0/-10°C for 1hour and then let sit for 24+/-2hours at room temperature, then measure.
Perform a heat treatment at 150+0/-10°C for 1hour and then let sit for 24+/-2hours at room temperature, then measure.
16 Durability
Appearance
No defects or abnormalities.
Capacitance Within +/-12.5%
Change
Q or D.F.
DF:0.2 max.
I.R.
More than 1000MΩ or 25Ω½F (Whichever is smaller)
Solder the capacitor on the test substrate shown in Fig.3.
Test Temperature :
Maximum Operating Temperature+/-3℃
Test Time :
1000+/-12h
Test Voltage :
150% of the rated voltage
Charge/Discharge Current : 50mA max.
Pre-treatment :
Post-treatment :
Perform a heat treatment at 150+0/-10°C for 1hour and then let sit for 24+/-2hours at room temperature, then measure.
Perform a heat treatment at 150+0/-10°C for 1hour and then let sit for 24+/-2hours at room temperature, then measure.
GRM32ER61E226KE15-01A
Substrate Bending Test
・Test
Substrate
Material : JIS C 6484 Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin)
Thickness :
1.6mm
Copper Foil Thickness: 0.035mm
Kind of Solder : Sn-3.0Ag-0.5Cu
Land
b
4.5
40
c
c
Series
GRM32
Dimension(mm)
a
2.2
b
5.0
c
2.9
a
100
Solder Resist (Coat with heat resistant resin for solder)
・Pressurization
Method
20
50min.
Pressurization speed
1.0mm/s
Pressurize
R5
Support
Capacitance meter
45
45
Flexure
Fig.2 (in mm)
Adhesive Strength of Termination, Vibration, Temperature Sudden Change, High Temperature High Humidity(Steady), Durability
・Test
Substrate
Material : JIS C 6484 Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin)
Thickness :
1.6mm or 0.8mm
Copper Foil Thickness: 0.035mm
Kind of Solder : Sn-3.0Ag-0.5Cu
・Land
Dimensions
Chip Capacitor
Land
Series
GRM32
a
b
Solder Resist
Dimension(mm)
a
2.2
c
b
5.0
c
2.9
Fig.3
GRM32ER61E226KE15-01A
1.75±0.1
Fig.1 (in mm)
*1,2：2.0±0.05
4.0±0.1
嵌入式系统
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