Soft Termination Chip Multilayer Ceramic Capacitors for General Purpose
GRJ32ER71H475KE11_ (1210, X7R:EIA, 4.7uF, DC50V)
_: packaging code
1.Scope
This product specification is applied to Soft Termination Chip Multilayer Ceramic Capacitors used for General Electronic equipment.
Reference Sheet
2.MURATA Part NO. System
(Ex.)
GRJ
32
(1)L/W
Dimensions
E
(2)T
Dimensions
R7
(3)Temperature
Characteristics
1H
(4)Rated
Voltage
475
(5)Nominal
Capacitance
K
(6)Capacitance
Tolerance
E11
(7)Murata’s Control
Code
L
(8)Packaging Code
3. Type & Dimensions
(1)-1 L
3.2±0.4
(1)-2 W
2.5±0.3
(2) T
2.5±0.3
e
0.3 min.
(Unit:mm)
g
1.0 min.
4.Rated value
(3) Temperature Characteristics
(Public STD Code):X7R(EIA)
Temp. coeff
Temp. Range
or Cap. Change
(Ref.Temp.)
(4)
Rated
Voltage
(6)
(5) Nominal
Capacitance
Capacitance
Tolerance
Specifications and Test
Methods
(Operating
Temp. Range)
-15 to 15 %
-55 to 125 °C
(25 °C)
DC 50 V
4.7 uF
±10 %
-55 to 125 °C
5.Package
mark
L
K
(8) Packaging
f180mm
Reel
EMBOSSED W8P4
f330mm
Reel
EMBOSSED W8P4
Packaging Unit
1000 pcs./Reel
4000 pcs./Reel
Product specifications in this catalog are as of Apr.3,2018,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
GRJ32ER71H475KE11-01
1
■
Specifications and Test Methods
No
1
Item
Rated Voltage
Shown in Rated value.
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
The rated voltage is defined as the maximum voltage
which may be applied continuously to the capacitor.
When AC voltage is superimposed on DC voltage,
V
P-P
or V
O-P
, whichever is larger, should be maintained
within the rated voltage range.
2
3
4
Appearance
Dimension
Voltage proof
No defects or abnormalities.
Within the specified dimensions.
No defects or abnormalities.
Visual inspection.
Using Measuring instrument of dimension.
Measurement Point :
Test Voltage
:
Applied Time
:
Between the terminations
250% of the rated voltage
1 to 5 s
Charge/discharge current : 50mA max.
5
Insulation Resistance(I.R.)
More than 2000MΩ or 50Ω ∙ F (Whichever is smaller)
Measurement Point
:
Measurement Voltage :
Charging Time
:
Between the terminations
DC Rated Voltage
1 min
Charge/discharge current : 50mA max.
Measurement Temperature: Room Temperature
6
7
Capacitance
Dissipation Factor (D.F.)
Shown in Rated value.
B1,R1,B3,R6,R7,C6,C7,C8,D7 : 0.1 max.
D8
:
0.15 max
Measurement Temperature: Room Temperature
Capacitance
C≦10μF
(10V min.)
C≦10μF
(6.3V max.)
C＞10μF
Frequency
1.0+/-0.1kHz
1.0+/-0.1kHz
120+/-24Hz
Voltage
1.0+/-0.2Vrms
0.5+/-0.1Vrms
0.5+/-0.1Vrms
8
Temperature
Characteristics
of Capacitance
No bias
B1,B3 : Within +/-10%
R1,R7 : Within +/-15%
R6
C6
C7
C8
D7
D8
: Within +/-15%
: Within +/-22%
: Within+/-22%
: Within +/-22%
: Within +22/-33%
: Within +22/-33%
(-25°C to +85°C)
(-55°C to +125°C)
(-55°C to +85°C)
(-55°C to +85°C)
(-55°C to +125°C)
(-55°C to +105°C)
(-55°C to +125°C)
(-55°C to +105°C)
The capacitance change should be measured after 5 min.
at each specified temp. stage.
In case of applying voltage, the capacitance change should be
measured after 1 min. with applying voltage in equilibration of
each temp. stage.
Capacitance value as a reference is the value in step 3.
· Measurement Voltage : Less than 1.0Vrms
(Refer to the individual data sheet)
Step
1
2
Temperature(C)
Reference Temp.+/-2
Min.Operating Temp. +/-3
Reference Temp.+/-2
Max.Operating Temp. +/-3
Reference Temp.+/-2
Min.Operating Temp. +/-3
Reference Temp.+/-2
Max.Operating Temp.+/-3
50% of
the rated voltage
(For B1,R1)
Applying Voltage(VDC)
50% of
the rated
voltage
B1: Within +10/-30%
R1: Within +15/-40%
(-25°C to +85°C)
(-55°C to +125°C)
3
4
5
6
7
8
No bias
½Initial
measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
9
Adhesive Strength
of Termination
No removal of the terminations or other defect
should occur.
GRJ03
GRJ15/GRJ18
GRJ21/GRJ31/GRJ32
Solder the capacitor on the test substrate shown in Fig.3.
Type
Applied Force(N)
2
5
10
Holding Time
:
10+/-1s
Applied Direction : In parallel with the test substrate and vertical with the
capacitor side.
10 Vibration
Appearance
Capacitance
D.F.
No defects or abnormalities.
Within the specified initial value.
Total amplitude
Within the specified initial value.
:
Solder the capacitor on the test substrate shown in Fig.3.
Kind of Vibration
:
A simple harmonic motion
10Hz to 55Hz to 10Hz (1min)
1.5mm
This motion should be applied for a period of 2h in each 3 mutually
perpendicular directions(total of 6h).
JEMCGS-05905
2
No
11 Substrate
Bending test
Item
Appearance
Specification
No defects or abnormalities.
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Solder the capacitor on the test substrate shown in Fig.1.
Pressurization method :
Flexure
:
:
:
:
:
:
:
:
:
:
:
:
:
:
Shown in Fig.2
3mm(GRJ18/21/31/32)
5mm(GRJ03/15)
Holding Time
Soldering Method
5+/-1s
Reflow soldering
Solder bath method
Solution of rosin ethanol 25(mass)%
80℃ to 120℃ for 10s to 30s
Sn-3.0Ag-0.5Cu
245+/-5℃
2+/-0.5s
Solder bath method
Sn-3.0Ag-0.5Cu
270+/-5℃
10+/-0.5s
24+/-2h
GRJ31 size max.: 120℃ to 150℃ for 1 min
GRJ32 size : 100℃ to 120℃ for 1 min
and 170℃ to 200℃ for 1 min
· Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
Capacitance
Change
Within +/-10%
12 Solderability
95% of the terminations is to be soldered evenly and
continuously.
Test Method
Flux
Preheat
Solder
Solder Temp.
Immersion time
13 Resistance
to
Soldering
Heat
Appearance
Capacitance
Change
D.F.
I.R.
No defects or abnormalities.
Within +/-7.5%
Test Method
Solder
Solder Temp.
Immersion time
Exposure Time
Within the specified initial value.
Within the specified initial value.
Preheat
Voltage proof No defects.
14 Temperature
Sudden Change
Appearance
No defects or abnormalities.
Solder the capacitor on the test substrate shown in Fig.3.
Perform the 100 cycles according to the four heat treatments
shown in the following table.
Capacitance
Change
Within +/-7.5%
Step
1
Temp.(C)
Min.Operating Temp.+0/-3
Room Temp
Max.Operating Temp.+3/-0
Room Temp
Time
(min)
30+/-3
2 to 3
30+/-3
2 to 3
2
D.F.
Within the specified initial value.
3
4
I.R.
Within the specified initial value.
Exposure Time
· Initial measurement
:
24+/-2h
Voltage proof No defects.
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
15
High
Temperature
High
Humidity
(Steady)
Appearance
No defects or abnormalities.
Solder the capacitor on the test substrate shown in Fig.3.
Test Temperature
Test Humidity
:
:
:
:
40+/-2℃
90%RH to 95%RH
500+/-12h
DC Rated Voltage
Capacitance
Change
D.F.
Within +/-12.5%
Test Time
Test Voltage
Charge/discharge current : 50mA max.
0.2 max.
· Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
I.R.
More than 500MΩ or 12.5Ω ∙ F (Whichever is smaller)
let sit for 24+/-2h at room temperature,then measure.
· Measurement after test
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
16 Durability
Appearance
No defects or abnormalities.
Solder the capacitor on the test substrate shown in Fig.3.
Test Temperature
:
:
:
Max. Operating Temp. +/-3℃
1000+/-12h
150% of the rated voltage
Capacitance
Change
Within +/-12.5%
Test Time
Test Voltage
Charge/discharge current : 50mA max.
D.F.
0.2 max.
· Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
· Measurement after test
I.R.
More than 1000MΩ or 25Ω ∙ F (Whichever is smaller)
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
JEMCGS-05905
3
Test method : Substrate Bending test
・Test
substrate
Material
: Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm (GRJ03/GRJ15: t:0.8mm)
Copper foil thickness : 0.035mm
: Solder resist
(Coat with heat resistant resin for solder)
*1,2：2.0±0.05
Land
f4.5
4.0±0.1
＊1
Type
GRJ03
GRJ15
GRJ18
GRJ21
GRJ31
GRJ32
a
100
a
0.3
0.4
1.0
1.2
2.2
2.2
Dimension (mm)
φ1.5
+0.1
-0
b
0.9
1.5
Ａ
3.0
4.0
5.0
5.0
Ｂ
＊2
c
0.3
0.5
1.2
1.65
0.05以下
2.0
2.9
3.5±0.05
40
c
c
1.75±0.1
8.0±0.3
b
t
Fig.1
(in mm)
・Kind
of Solder : Sn-3.0Ag-0.5Cu
・Pressurization
method
20
50 min.
Pressurization
speed
1.0mm/s
Capacitor
R5
Pressurize
45
Support
Capacitance meter
45
45
Flexure
Fig.2
(in mm)
Adhesive Strength of Termination, Vibration, Temperature Sudden Change , High Temperature High Humidity(Steady) , Durability
・Test
substrate
Material
: Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm or 0.8mm
Copper foil thickness : 0.035mm
・
Kind of Solder : Sn-3.0Ag-0.5Cu
・
Land Dimensions
Chip Capacitor
Land
Type
GRJ03
GRJ15
GRJ18
GRJ21
GRJ31
GRJ32
b
a
Solder Resist
a
0.3
0.4
1.0
1.2
2.2
2.2
Dimension (mm)
b
0.9
1.5
3.0
4.0
5.0
5.0
c
0.3
0.5
1.2
1.65
2.0
2.9
c
Fig.3
JEMCGS-05905
4
Package
GRJ Type
1.Tape Carrier Packaging(Packaging Code:D/E/W/L/J/F/K)
1.1 Minimum Quantity(pcs./reel)
Type
GRJ03
GRJ15
GRJ18
GRJ21
3
5(Dimensions
Tolerance:±0.07)
5 (Dimensions
Tolerance:±0.15 min.)
8
6
9
B
9
M
C
D/E
Paper Tape
Code:D/E
15000(W8P2)
10000(W8P2)
10000(W8P2)
4000
4000
4000
3000
3000
3000
2000
1000
φ180mm reel
Paper Tape
Code:W
30000(W8P1)
Plastic Tape
Code:L
φ330mm reel
Paper Tape
Plastic Tape
Code:J/F
Code:K
50000(W8P2)
50000(W8P2)
40000(W8P2)
10000
10000
10000
10000
10000
10000
6000
4000
GRJ31
GRJ32
1.2 Dimensions of Tape
(1)GRJ03/15 <Paper Tape W8P2 Code:D/E/J/F>
φ1.5
-0
+0.1
(in mm)
*2
*1
3.5±0.05
1.75±0.1
8.0±0.3
*1,2：2.0±0.05
4.0±0.1
Ａ
Ａ
Ｂ
0.05 max.
0.8 max.
Type
GRJ03
GRJ15
3
5
L
0.6±0.05
1.0±0.07
1.0±0.15
1.0±0.2
Dimensions(Chip)
W
0.3±0.05
0.5±0.07
0.5±0.15
0.5±0.2
A *3
T
0.3±0.05
0.39
0.5±0.07
0.65
0.5±0.15
0.72
0.5±0.2
0.75
*3 Nominal value
1.75±0.1
4.0±0.1
φ1.5
-0
+0.1
B *3
0.69
1.15
1.25
1.35
t
0.5 max.
0.8 max.
(2)GRJ03 <Paper Tape W8P1 Code:W>
1.0±0.05
3.5±0.05
Ｂ
Ａ
1.0±0.05
8.0±0.3
t
Type
GRJ03
3
Dimensions(Chip)
A *3
L
W
T
0.6±0.05
0.3±0.05
0.3±0.05
0.39
*3 Nominal value
B *3
0.69
t
0.5 max.
JEMCGP-02403H
5
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