Micron Confidential and Proprietary
2Gb: x8, x16 NAND Flash Memory
Features
NAND Flash Memory
MT29F2G08ABAEAH4, MT29F2G08ABAEAWP, MT29F2G08ABBEAH4
MT29F2G08ABBEAHC, MT29F2G16ABAEAWP, MT29F2G16ABBEAH4
MT29F2G16ABBEAHC
Features
• Open NAND Flash Interface (ONFI) 1.0-compliant
1
• Single-level cell (SLC) technology
• Organization
– Page size x8: 2112 bytes (2048 + 64 bytes)
– Page size x16: 1056 words (1024 + 32 words)
– Block size: 64 pages (128K + 4K bytes)
– Plane size: 2 planes x 1024 blocks per plane
– Device size: 2Gb: 2048 blocks
• Asynchronous I/O performance
–
t
RC/
t
WC: 20ns (3.3V), 25ns (1.8V)
• Array performance
– Read page: 25µs
3
– Program page: 200µs (TYP: 1.8V, 3.3V)
3
– Erase block: 700µs (TYP)
• Command set: ONFI NAND Flash Protocol
• Advanced command set
– Program page cache mode
4
– Read page cache mode
4
– One-time programmable (OTP) mode
– Two-plane commands
4
– Interleaved die (LUN) operations
– Read unique ID
– Block lock (1.8V only)
– Internal data move
• Operation status byte provides software method for
detecting
– Operation completion
– Pass/fail condition
– Write-protect status
• Ready/Busy# (R/B#) signal provides a hardware
method of detecting operation completion
• WP# signal: Write protect entire device
• First block (block address 00h) is valid when ship-
ped from factory with ECC. For minimum required
ECC, see Error Management.
• Block 0 requires 1-bit ECC if PROGRAM/ERASE cy-
cles are less than 1000
• RESET (FFh) required as first command after pow-
er-on
• Alternate method of device initialization (Nand_In-
it) after power up (contact factory)
• Internal data move operations supported within the
plane from which data is read
• Quality and reliability
– Data retention: 10 years
– Endurance: 100,000 PROGRAM/ERASE cycles
• Operating voltage range
– V
CC
: 2.7–3.6V
– V
CC
: 1.7–1.95V
• Operating temperature
– Commercial: 0°C to +70°C
– Industrial (IT): –40ºC to +85ºC
– Automotive Industrial (AIT): –40°C to +85°C
– Automotive (AAT): –40°C to +105°C
• Package
– 48-pin TSOP type 1, CPL
2
– 63-ball VFBGA
Notes:
1. The ONFI 1.0 specification is available at
www.onfi.org.
2. CPL = Center parting line.
3. See Electrical Specifications – Program/Erase
Characteristics for
t
R_ECC and
t
PROG_ECC
specifications.
4. These commands supported only with ECC
disabled.
PDF: 09005aef83b83f42
m69a_2gb_ecc_nand.pdf - Rev. R 04/14 EN
1
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2009 Micron Technology, Inc. All rights reserved.
Micron Confidential and Proprietary
2Gb: x8, x16 NAND Flash Memory
Features
Part Numbering Information
Micron NAND Flash devices are available in different configurations and densities. Verify valid part numbers by
using Micron’s part catalog search at
www.micron.com.
To compare features and specifications by device type,
visit
www.micron.com/products.
Contact the factory for devices not found.
Figure 1: Marketing Part Number Chart
MT 29F 2G 08
Micron Technology
Product Family
29F = NAND Flash memory
A
B
A
E
A WP
IT
ES
:E
Design Revision (shrink)
Production Status
Blank = Production
ES = Engineering sample
MS = Mechanical sample
QS = Qualification sample
Density
2G = 2Gb
Device Width
08 = 8-bit
16 = 16-bit
Special Options
Blank
X = Product longevity program (PLP)
Level
A = SLC
Operating Temperature Range
Blank = Commercial (0°C to +70°C)
IT = Industrial (–40°C to +85°C)
AIT = Automotive Industrial (–40°C to +85°C)
AAT = Automotive (–40°C to +115°C)
Classification
Mark Die
B
1
nCE
1
RnB
1
I/O Channels
1
Speed Grade
Blank
Operating Voltage Range
A = 3.3V (2.7–3.6V)
B = 1.8V (1.7–1.95V)
Package Code
WP = 48-pin TSOP
HC = 63-ball VFBGA (10.5 x 13 x 1.0mm)
H4 = 63-ball VFBGA (9 x 11 x 1.0mm)
Feature Set
E = Feature set E
Interface
A = Async only
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m69a_2gb_ecc_nand.pdf - Rev. R 04/14 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2009 Micron Technology, Inc. All rights reserved.
Micron Confidential and Proprietary
2Gb: x8, x16 NAND Flash Memory
Features
Contents
General Description ......................................................................................................................................... 8
Signal Descriptions ........................................................................................................................................... 8
Signal Assignments ........................................................................................................................................... 9
Package Dimensions ....................................................................................................................................... 12
Architecture ................................................................................................................................................... 15
Device and Array Organization ........................................................................................................................ 16
Asynchronous Interface Bus Operation ........................................................................................................... 18
Asynchronous Enable/Standby ................................................................................................................... 18
Asynchronous Commands .......................................................................................................................... 18
Asynchronous Addresses ............................................................................................................................ 20
Asynchronous Data Input ........................................................................................................................... 21
Asynchronous Data Output ......................................................................................................................... 22
Write Protect# ............................................................................................................................................ 23
Ready/Busy# .............................................................................................................................................. 23
Device Initialization ....................................................................................................................................... 28
Command Definitions .................................................................................................................................... 29
Reset Operations ............................................................................................................................................ 32
RESET (FFh) ............................................................................................................................................... 32
Identification Operations ................................................................................................................................ 33
READ ID (90h) ............................................................................................................................................ 33
READ ID Parameter Tables .............................................................................................................................. 34
READ PARAMETER PAGE (ECh) ...................................................................................................................... 36
Parameter Page Data Structure Tables ............................................................................................................. 37
READ UNIQUE ID (EDh) ................................................................................................................................ 41
Feature Operations ......................................................................................................................................... 42
SET FEATURES (EFh) .................................................................................................................................. 43
GET FEATURES (EEh) ................................................................................................................................. 44
Status Operations ........................................................................................................................................... 47
READ STATUS (70h) ................................................................................................................................... 48
READ STATUS ENHANCED (78h) ................................................................................................................ 48
Column Address Operations ........................................................................................................................... 50
RANDOM DATA READ (05h-E0h) ................................................................................................................ 50
RANDOM DATA READ TWO-PLANE (06h-E0h) ............................................................................................ 51
RANDOM DATA INPUT (85h) ...................................................................................................................... 52
PROGRAM FOR INTERNAL DATA INPUT (85h) ........................................................................................... 53
Read Operations ............................................................................................................................................. 55
READ MODE (00h) ..................................................................................................................................... 57
READ PAGE (00h-30h) ................................................................................................................................ 57
READ PAGE CACHE SEQUENTIAL (31h) ...................................................................................................... 58
READ PAGE CACHE RANDOM (00h-31h) .................................................................................................... 59
READ PAGE CACHE LAST (3Fh) .................................................................................................................. 61
READ PAGE TWO-PLANE 00h-00h-30h ....................................................................................................... 62
Program Operations ....................................................................................................................................... 64
PROGRAM PAGE (80h-10h) ......................................................................................................................... 65
PROGRAM PAGE CACHE (80h-15h) ............................................................................................................. 65
PROGRAM PAGE TWO-PLANE (80h-11h) .................................................................................................... 68
Erase Operations ............................................................................................................................................ 70
ERASE BLOCK (60h-D0h) ............................................................................................................................ 70
ERASE BLOCK TWO-PLANE (60h-D1h) ....................................................................................................... 71
Internal Data Move Operations ....................................................................................................................... 72
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2009 Micron Technology, Inc. All rights reserved.
Micron Confidential and Proprietary
2Gb: x8, x16 NAND Flash Memory
Features
READ FOR INTERNAL DATA MOVE (00h-35h) ............................................................................................. 73
PROGRAM FOR INTERNAL DATA MOVE (85h–10h) ..................................................................................... 74
PROGRAM FOR INTERNAL DATA MOVE TWO-PLANE (85h-11h) ................................................................. 75
Block Lock Feature ......................................................................................................................................... 76
WP# and Block Lock ................................................................................................................................... 76
UNLOCK (23h-24h) .................................................................................................................................... 76
LOCK (2Ah) ................................................................................................................................................ 79
LOCK TIGHT (2Ch) ..................................................................................................................................... 80
BLOCK LOCK READ STATUS (7Ah) .............................................................................................................. 81
One-Time Programmable (OTP) Operations .................................................................................................... 83
Legacy OTP Commands .............................................................................................................................. 83
OTP DATA PROGRAM (80h-10h) ................................................................................................................. 84
RANDOM DATA INPUT (85h) ...................................................................................................................... 85
OTP DATA PROTECT (80h-10) ..................................................................................................................... 86
OTP DATA READ (00h-30h) ......................................................................................................................... 88
Two-Plane Operations .................................................................................................................................... 90
Two-Plane Addressing ................................................................................................................................ 90
Interleaved Die (Multi-LUN) Operations .......................................................................................................... 99
Error Management ........................................................................................................................................ 100
Internal ECC and Spare Area Mapping for ECC ............................................................................................... 102
Electrical Specifications ................................................................................................................................. 104
Electrical Specifications – DC Characteristics and Operating Conditions .......................................................... 106
Electrical Specifications – AC Characteristics and Operating Conditions .......................................................... 108
Electrical Specifications – Program/Erase Characteristics ................................................................................ 111
Asynchronous Interface Timing Diagrams ...................................................................................................... 112
Revision History ............................................................................................................................................ 124
Rev. R – 04/14 ............................................................................................................................................ 124
Rev. Q – 02/14 ............................................................................................................................................ 124
Rev. P – 08/13 ............................................................................................................................................ 124
Rev. O – 10/12 ............................................................................................................................................ 124
Rev. N – 02/12 ............................................................................................................................................ 124
Rev. M – 01/12 ........................................................................................................................................... 124
Rev. L – 11/11 ............................................................................................................................................ 124
Rev. K – 01/11 ............................................................................................................................................ 124
Rev. J – 12/10 ............................................................................................................................................. 124
Rev. I – 11/10 ............................................................................................................................................. 124
Rev. H – 09/10 ............................................................................................................................................ 124
Rev. G – 08/10 ............................................................................................................................................ 125
Rev. F – 06/10 ............................................................................................................................................ 125
Rev. E – 05/10 ............................................................................................................................................ 125
Rev. D – 03/10 ............................................................................................................................................ 125
Rev. C – 01/10 ............................................................................................................................................ 125
Rev. B – 09/09 ............................................................................................................................................ 125
Rev. A – 07/09 ............................................................................................................................................ 125
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2009 Micron Technology, Inc. All rights reserved.
Micron Confidential and Proprietary
2Gb: x8, x16 NAND Flash Memory
Features
List of Tables
Table 1: Signal Definitions ............................................................................................................................... 8
Table 2: Array Addressing – MT29F2G08 (x8) .................................................................................................. 16
Table 3: Array Addressing – MT29F2G16 (x16) ................................................................................................. 17
Table 4: Asynchronous Interface Mode Selection ............................................................................................ 18
Table 5: Command Set .................................................................................................................................. 29
Table 6: Two-Plane Command Set .................................................................................................................. 31
Table 7: READ ID Parameters for Address 00h ................................................................................................. 34
Table 8: READ ID Parameters for Address 20h ................................................................................................. 35
Table 9: Parameter Page Data Structure .......................................................................................................... 37
Table 10: Feature Address Definitions ............................................................................................................. 42
Table 11: Feature Address 90h – Array Operation Mode ................................................................................... 43
Table 12: Feature Addresses 01h: Timing Mode ............................................................................................... 45
Table 13: Feature Addresses 80h: Programmable I/O Drive Strength ................................................................ 46
Table 14: Feature Addresses 81h: Programmable R/B# Pull-Down Strength ...................................................... 46
Table 15: Status Register Definition ................................................................................................................ 47
Table 16: Block Lock Address Cycle Assignments ............................................................................................ 78
Table 17: Block Lock Status Register Bit Definitions ........................................................................................ 81
Table 18: Error Management Details ............................................................................................................. 100
Table 19: Absolute Maximum Ratings ............................................................................................................ 104
Table 20: Recommended Operating Conditions ............................................................................................. 104
Table 21: Valid Blocks ................................................................................................................................... 104
Table 22: Capacitance ................................................................................................................................... 105
Table 23: Test Conditions .............................................................................................................................. 105
Table 24: DC Characteristics and Operating Conditions (3.3V) ....................................................................... 106
Table 25: DC Characteristics and Operating Conditions (1.8V) ....................................................................... 107
Table 26: AC Characteristics: Command, Data, and Address Input (3.3V) ........................................................ 108
Table 27: AC Characteristics: Command, Data, and Address Input (1.8V) ........................................................ 108
Table 28: AC Characteristics: Normal Operation (3.3V) .................................................................................. 109
Table 29: AC Characteristics: Normal Operation (1.8V) .................................................................................. 109
Table 30: Program/Erase Characteristics ....................................................................................................... 111
PDF: 09005aef83b83f42
m69a_2gb_ecc_nand.pdf - Rev. R 04/14 EN
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2009 Micron Technology, Inc. All rights reserved.