工作电压：2V ~ 5.5V CPU位数：8-Bit CPU内核：PIC 主频（MAX)：20MHz ROM类型：FLASH
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Microchip(微芯科技) |
| 零件包装代码 | SOIC |
| 包装说明 | 7.50 MM, LEAD FREE, PLASTIC, SOIC-28 |
| 针数 | 28 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 5 weeks |
| Samacsys Confidence | 3 |
| Samacsys Status | Released |
| Samacsys PartID | 159839 |
| Samacsys Pin Count | 28 |
| Samacsys Part Category | Integrated Circuit |
| Samacsys Package Category | Small Outline Packages |
| Samacsys Footprint Name | 28-Lead Plastic Small Outline (SO) - Wide 7.50mm Body (SOIC) |
| Samacsys Released Date | 2015-04-16 09:48:08 |
| Is Samacsys | N |
| 具有ADC | YES |
| 其他特性 | ITS ALSO OPERATES MINIMUM 2V AT 8 MHZ |
| 地址总线宽度 | |
| 位大小 | 8 |
| CPU系列 | PIC |
| 最大时钟频率 | 20 MHz |
| DAC 通道 | NO |
| DMA 通道 | NO |
| 外部数据总线宽度 | |
| JESD-30 代码 | R-PDSO-G28 |
| JESD-609代码 | e3 |
| 长度 | 17.9 mm |
| 湿度敏感等级 | 1 |
| I/O 线路数量 | 24 |
| 端子数量 | 28 |
| 片上程序ROM宽度 | 14 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| PWM 通道 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP28,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 2.5/5 V |
| 认证状态 | Not Qualified |
| RAM（字节） | 256 |
| ROM（单词） | 4096 |
| ROM可编程性 | FLASH |
| 座面最大高度 | 2.65 mm |
| 速度 | 20 MHz |
| 最大压摆率 | 4.8 mA |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) - annealed |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 7.5 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC |
| Base Number Matches | 1 |
| PIC16F883-I/SO | PIC16F887-I/PT | PIC16F886I/SP | PIC16F883-I/SS | PIC16F882T-E/SO | PIC16F882T-E/ML | PIC16F882-I/P | PIC16F882-E/P | PIC16F884-I/SP | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | 工作电压：2V ~ 5.5V CPU位数：8-Bit CPU内核：PIC 主频（MAX)：20MHz ROM类型：FLASH | 工作电压：2V ~ 5.5V CPU位数：8-Bit CPU内核：PIC 主频（MAX)：20MHz ROM类型：FLASH PIC16系列，368 RAM，14 kB Flash，256 EEPROM，10位AD和UART，大部分场合可以直接替换PIC16F877A-I/PT | 工作电压：2V ~ 5.5V CPU位数：8-Bit CPU内核：PIC 主频（MAX)：20MHz ROM类型：FLASH | 工作电压：2V ~ 5.5V CPU位数：8-Bit CPU内核：PIC 主频（MAX)：20MHz ROM类型：FLASH PIC16 Series 128 B RAM 3.5 kB Flash 8-Bit CMOS Microcontroller - SSOP-28 | 8-BIT, FLASH, 20 MHz, RISC MICROCONTROLLER, PDSO28, 7.50 MM, LEAD FREE, PLASTIC, SOIC-28 | 8-BIT, FLASH, 20 MHz, RISC MICROCONTROLLER, PQCC28, 6 X 6 MM, LEAD FREE, PLASTIC, QFN-28 | RISC MICROCONTROLLER | RISC MICROCONTROLLER | RISC MICROCONTROLLER |
| 是否无铅 | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 | - | - | - |
| 是否Rohs认证 | 符合 | 符合 | - | 符合 | 符合 | 符合 | - | - | - |
| 厂商名称 | Microchip(微芯科技) | - | - | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) |
| 零件包装代码 | SOIC | QFP | - | SSOP | SOIC | QFN | - | - | - |
| 包装说明 | 7.50 MM, LEAD FREE, PLASTIC, SOIC-28 | 10 X 10 MM, 1 MM HEIGHT, LEAD FREE, PLASTIC, QFP-44 | - | 5.30 MM, LEAD FREE, PLASTIC, SSOP-28 | 7.50 MM, LEAD FREE, PLASTIC, SOIC-28 | 6 X 6 MM, LEAD FREE, PLASTIC, QFN-28 | DIP-28 | DIP-28 | DIP-40 |
| 针数 | 28 | 44 | - | 28 | 28 | 28 | - | - | - |
| Reach Compliance Code | compliant | compliant | - | compliant | compliant | compliant | compliant | compliant | compliant |
| 具有ADC | YES | YES | - | YES | YES | YES | YES | YES | YES |
| 其他特性 | ITS ALSO OPERATES MINIMUM 2V AT 8 MHZ | ITS ALSO OPERATES MINIMUM 2V AT 8 MHZ | - | ITS ALSO OPERATES MINIMUM 2V AT 8 MHZ | ITS ALSO OPERATES MINIMUM 2V AT 8 MHZ | ITS ALSO OPERATES MINIMUM 2V AT 8 MHZ | - | - | - |
| 位大小 | 8 | 8 | - | 8 | 8 | 8 | 8 | 8 | 8 |
| CPU系列 | PIC | PIC | - | PIC | PIC | PIC | PIC | PIC | PIC |
| 最大时钟频率 | 20 MHz | 20 MHz | - | 20 MHz | 20 MHz | 20 MHz | 8 MHz | 8 MHz | 8 MHz |
| DAC 通道 | NO | NO | - | NO | NO | NO | NO | NO | NO |
| DMA 通道 | NO | NO | - | NO | NO | NO | NO | NO | NO |
| JESD-30 代码 | R-PDSO-G28 | S-PQFP-G44 | - | R-PDSO-G28 | R-PDSO-G28 | S-PQCC-N28 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T40 |
| JESD-609代码 | e3 | e3 | - | e3 | e3 | e3 | - | - | - |
| 长度 | 17.9 mm | 10 mm | - | 10.2 mm | 17.9 mm | 6 mm | 34.67 mm | 34.67 mm | 51.75 mm |
| 湿度敏感等级 | 1 | 3 | - | 1 | 1 | 1 | - | - | - |
| I/O 线路数量 | 24 | 35 | - | 24 | 24 | 24 | 24 | 24 | 35 |
| 端子数量 | 28 | 44 | - | 28 | 28 | 28 | 28 | 28 | 40 |
| 片上程序ROM宽度 | 14 | 14 | - | 14 | 14 | 14 | 16 | 16 | 16 |
| 最高工作温度 | 85 °C | 85 °C | - | 85 °C | 125 °C | 125 °C | 85 °C | 125 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| PWM 通道 | YES | YES | - | YES | YES | YES | YES | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | TQFP | - | SSOP | SOP | HVQCCN | DIP | DIP | DIP |
| 封装等效代码 | SOP28,.4 | TQFP44,.47SQ,32 | - | SSOP28,.3 | SOP28,.4 | LCC28,.24SQ,25 | DIP28,.3 | DIP28,.3 | DIP40,.6 |
| 封装形状 | RECTANGULAR | SQUARE | - | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | FLATPACK, THIN PROFILE | - | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | IN-LINE | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | 260 | 260 | - | 260 | 260 | 260 | - | - | - |
| 电源 | 2.5/5 V | 2.5/5 V | - | 2.5/5 V | 2.5/5 V | 2.5/5 V | - | - | - |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | - | - | - |
| RAM（字节） | 256 | 368 | - | 256 | 128 | 128 | 128 | 128 | 256 |
| ROM（单词） | 4096 | 8192 | - | 4096 | 2048 | 2048 | 2048 | 2048 | 4096 |
| ROM可编程性 | FLASH | FLASH | - | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| 座面最大高度 | 2.65 mm | 1.2 mm | - | 2 mm | 2.65 mm | 1 mm | 5.08 mm | 5.08 mm | 6.35 mm |
| 速度 | 20 MHz | 20 MHz | - | 20 MHz | 20 MHz | 20 MHz | 8 MHz | 8 MHz | 8 MHz |
| 最大压摆率 | 4.8 mA | 4.8 mA | - | 4.8 mA | 4.8 mA | 4.8 mA | 4.8 mA | 4.8 mA | 4.8 mA |
| 最大供电电压 | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | - | YES | YES | YES | NO | NO | NO |
| 技术 | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | AUTOMOTIVE | AUTOMOTIVE | INDUSTRIAL | AUTOMOTIVE | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | - | Matte Tin (Sn) - annealed | Matte Tin (Sn) | MATTE TIN | - | - | - |
| 端子形式 | GULL WING | GULL WING | - | GULL WING | GULL WING | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 0.8 mm | - | 0.65 mm | 1.27 mm | 0.65 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | QUAD | - | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | 40 | - | 40 | 40 | 40 | - | - | - |
| 宽度 | 7.5 mm | 10 mm | - | 5.3 mm | 7.5 mm | 6 mm | 7.62 mm | 7.62 mm | 15.24 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | - | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC |
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