Low Speed/Full Speed/High Speed USB 2.0 High Speed Hub Controller USB 2.0 3.3V T/R 36-Pin VQFN EP
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
包装说明 | HVQCCN, |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
Factory Lead Time | 7 weeks |
Is Samacsys | N |
其他特性 | ALSO REQUIRES 3.3V SUPPLY |
地址总线宽度 | |
总线兼容性 | I2C; SMBUS |
最大时钟频率 | 24 MHz |
外部数据总线宽度 | |
JESD-30 代码 | S-XQCC-N36 |
JESD-609代码 | e3 |
长度 | 6 mm |
湿度敏感等级 | 3 |
端子数量 | 36 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | UNSPECIFIED |
封装代码 | HVQCCN |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
座面最大高度 | 1 mm |
最大供电电压 | 3.6 V |
最小供电电压 | 3 V |
标称供电电压 | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Matte Tin (Sn) - annealed |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 6 mm |
uPs/uCs/外围集成电路类型 | BUS CONTROLLER, UNIVERSAL SERIAL BUS |
Base Number Matches | 1 |
USB2514BI-AEZG-TR | USB2513B-AEZC | USB2514B-AEZC | PRA100C2-196KBPNT | USB2514BI-AEZG | USB2513BT/M2 | |
---|---|---|---|---|---|---|
描述 | Low Speed/Full Speed/High Speed USB 2.0 High Speed Hub Controller USB 2.0 3.3V T/R 36-Pin VQFN EP | Low Speed/Full Speed/High Speed USB 2.0 High Speed Hub Controller USB 2.0 3.3V Tray 36-Pin VQFN EP | Low Speed/Full Speed/High Speed USB 2.0 High Speed Hub Controller USB 2.0 3.3V Tray 36-Pin VQFN EP | Array/Network Resistor, Bussed, Thin Film, 0.1W, 196000ohm, 50V, 0.1% +/-Tol, -10,10ppm/Cel, 0806, | Low Speed/Full Speed/High Speed USB 2.0 High Speed Hub Controller USB 2.0 3.3V Tray 36-Pin VQFN EP | Low Speed/Full Speed/High Speed USB 2.0 High Speed Hub Controller USB 2.0 3.3V T/R 36-Pin SQFN EP |
是否Rohs认证 | 符合 | - | 符合 | 符合 | 符合 | - |
包装说明 | HVQCCN, | - | HVQCCN, | SMT, 0806 | HVQCCN, | - |
Reach Compliance Code | compliant | - | compliant | compliant | compliant | - |
JESD-609代码 | e3 | - | e3 | e2 | e3 | - |
端子数量 | 36 | - | 36 | 3 | 36 | - |
最高工作温度 | 85 °C | - | 85 °C | 155 °C | 85 °C | - |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMT | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - |
表面贴装 | YES | - | YES | YES | YES | - |
技术 | CMOS | - | CMOS | THIN FILM | CMOS | - |
端子面层 | Matte Tin (Sn) - annealed | - | Matte Tin (Sn) | Tin/Silver (Sn/Ag) - with Nickel (Ni) barrier | Matte Tin (Sn) - annealed | - |
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